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    • 81. 发明授权
    • Semiconductor light emitting device
    • 半导体发光器件
    • US08368089B2
    • 2013-02-05
    • US12885777
    • 2010-09-20
    • Akihiro KojimaHiroshi KoizumiYoshiaki SugizakiTomomichi NakaYasuhide Okada
    • Akihiro KojimaHiroshi KoizumiYoshiaki SugizakiTomomichi NakaYasuhide Okada
    • H01L29/18H01L33/00
    • H01L33/50H01L33/46H01L33/486H01L33/58H01L33/62H01L2924/0002H01L2924/00
    • According to one embodiment, a semiconductor light emitting device includes a semiconductor layer, a first electrode, a second electrode, a transparent layer, and a fluorescent material layer. The transparent layer is provided on the first major surface of the semiconductor layer. The transparent layer is transparent with respect to light emitted by the light emitting layer and has a trench provided outside the outer circumference of the light emitting layer. The fluorescent material layer is provided in the trench and on the transparent layer. The fluorescent material layer includes a first fluorescent material particle provided in the trench and a second fluorescent material particle provided on the transparent layer. A particle size of the first fluorescent material particle is smaller than a width of the trench. A particle size of the second fluorescent material particle is larger than the width of the trench and larger than the particle size of the first fluorescent material particle.
    • 根据一个实施例,半导体发光器件包括半导体层,第一电极,第二电极,透明层和荧光材料层。 透明层设置在半导体层的第一主表面上。 透明层相对于由发光层发射的光是透明的,并且具有设置在发光层的外周外的沟槽。 荧光材料层设置在沟槽和透明层上。 荧光材料层包括设置在沟槽中的第一荧光材料颗粒和设置在透明层上的第二荧光材料颗粒。 第一荧光体粒子的粒径小于沟槽的宽度。 第二荧光体粒子的粒径大于沟槽的宽度,大于第一荧光体粒子的粒径。
    • 83. 发明授权
    • Droplet ejection head and method of manufacturing coated body
    • 液滴喷头及制造涂层体的方法
    • US08297743B2
    • 2012-10-30
    • US12873605
    • 2010-09-01
    • Hiroshi KoizumiShizuo Kinoshita
    • Hiroshi KoizumiShizuo Kinoshita
    • B41J2/045
    • B41J2/055B41J2/14274
    • According to one embodiment, a droplet ejection head includes a liquid room, chambers, piezo elements, restrictors, movable pieces, and actuators. The liquid room stores a liquid. The chambers are supplied with the liquid from the liquid room and include nozzles for ejecting the supplied liquid in a droplet state. The piezo elements can be displaced in directions so as to change contents of the chambers. The restrictors bring the liquid room and the chambers in communication with each other. The movable pieces are movable in directions so as to change flow-path areas of the restrictors. The actuators move the movable pieces in the directions so as to change the plow-path areas of the restrictors.
    • 根据一个实施例,液滴喷射头包括液体室,室,压电元件,限流器,可动件和致动器。 液体储存液体。 这些室从液体室供应液体,并且包括用于以液滴状态喷射所提供的液体的喷嘴。 压电元件可以在方向上移位,以便改变腔室的内容物。 限流器使液体室和室彼此连通。 活动件可沿方向移动,以便改变限流器的流路面积。 致动器沿可移动的方向移动以便改变限制器的犁道区域。
    • 89. 发明申请
    • SUBSTRATE REPLACING METHOD AND SUBSTRATE PROCESSING APPARATUS
    • 基板更换方法和基板处理装置
    • US20100252532A1
    • 2010-10-07
    • US12732451
    • 2010-03-26
    • SHIGERU ISHIZAWAHiroshi KoizumiTatsuya Ogi
    • SHIGERU ISHIZAWAHiroshi KoizumiTatsuya Ogi
    • C23F1/08C23C16/458C23F1/00C23C16/00
    • H01L21/67745H01L21/67748
    • A method for replacing plural substrates to be processed by a substrate processing apparatus which includes a substrate processing chamber, a load lock chamber, and a conveying apparatus including first and second conveying members for conveying the plural substrates into and out from the substrate processing chamber and the load lock chamber. The method includes the steps of a) conveying a first substrate out from the substrate processing chamber with the first conveying member, b) conveying a second substrate into the substrate processing chamber with the second conveying member, c) conveying the second substrate out from the load lock chamber with the second conveying member, and d) conveying the first substrate into the load lock chamber with the first conveying member. The steps c) and d) are performed between step a) and step b).
    • 一种用于替换多个基板的方法,所述基板处理装置包括基板处理室,负载锁定室和输送装置,所述基板处理装置包括用于将多个基板输入和移出基板处理室的第一和第二输送部件, 负载锁定室。 该方法包括以下步骤:a)用第一输送部件从基板处理室输出第一基板,b)用第二输送部件将第二基板输送到基板处理室中,c)将第二基板从 负载锁定室与第二输送构件,以及d)用第一输送构件将第一基板输送到装载锁定室。 在步骤a)和步骤b)之间执行步骤c)和d)。