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81. 发明申请

US20130249071A1 SEMICONDUCTOR DEVICE AND METHOD OF ASSEMBLING SAME 审中-公开
标题翻译：半导体器件及其组装方法
公开(公告)号：US20130249071A1
公开(公告)日：2013-09-26
申请号：US13854140
申请日：2013-04-01
申请人： Jinzhong Yao , Zhigang Bai , Yuan Zang
发明人： Jinzhong Yao , Zhigang Bai , Yuan Zang
IPC分类号： H01L23/495 , H01L21/56
CPC分类号： H01L23/495 , B29C33/005 , B29C45/14221 , B29C45/14655 , H01L21/4842 , H01L21/561 , H01L21/565 , H01L23/49555 , H01L24/32 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/97 , H01L2224/05554 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/49109 , H01L2224/73265 , H01L2224/97 , H01L2924/00014 , H01L2924/10253 , H01L2924/181 , H01L2924/00 , H01L2224/85 , H01L2924/00012 , H01L2224/45099
摘要： A method of assembling a semiconductor device includes providing a lead frame having a die pad and a fame member with lead fingers that surround the die pad. The lead fingers have distal ends connected to the frame member and proximal ends near the die pad. A die is attached to the die pad and die connection pads are electrically connected to the proximal ends of the lead fingers with bond wires. The die, bond wires, and part of the lead fingers are encapsulated with an encapsulant. The encapsulating process includes separating the lead fingers into first and second sets of lead fingers. The proximal ends of the first set lie in a first plane and the proximal ends of the second set lie in a second plane that is spaced and maintained from the first plane solely by the encapsulation material.
摘要翻译：一种组装半导体器件的方法包括提供引线框架，该引线框架具有管芯焊盘和引导指围绕管芯焊盘的成形构件。引线指具有连接到框架构件的远端和靠近管芯焊盘的近端。模具附接到管芯焊盘，管芯连接焊盘通过接合线电连接到引线指的近端。管芯，接合线和引线的一部分用密封剂封装。封装过程包括将引线分离成第一和第二组引线指。第一组的近端位于第一平面中，并且第二组的近端位于第二平面中，第二平面仅与第一平面间隔开并由包封材料保持。

82. 发明授权

US08536684B2 Method of assembling shielded integrated circuit device 有权
标题翻译：屏蔽集成电路器件组装方法
公开(公告)号：US08536684B2
公开(公告)日：2013-09-17
申请号：US13092162
申请日：2011-04-22
申请人： Wei Min Chen , Zhigang Bai , Zhijie Wang
发明人： Wei Min Chen , Zhigang Bai , Zhijie Wang
IPC分类号： H01L23/29
CPC分类号： H01L23/552 , H01L21/565 , H01L23/3128 , H01L23/3135 , H01L24/16 , H01L24/29 , H01L24/33 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/85 , H01L24/92 , H01L24/97 , H01L2224/16225 , H01L2224/16245 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73204 , H01L2224/73265 , H01L2224/83192 , H01L2224/85 , H01L2224/92125 , H01L2224/92247 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/0103 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/16152 , H01L2924/181 , H01L2924/3025 , Y10T29/49146 , H01L2924/00012 , H01L2924/00 , H01L2224/81 , H01L2224/45015 , H01L2924/207
摘要： A method of assembling an integrated circuit (IC) device includes the steps of providing a lead frame or substrate panel, attaching a semiconductor die to the lead frame or substrate panel and electrically coupling the die to the lead frame or substrate panel. The method further includes encapsulating the die with a first encapsulant, and the encapsulating the first encapsulant with a second encapsulant where the second encapsulant includes a material that provides electromagnetic shielding.
摘要翻译：一种组装集成电路（IC）器件的方法包括以下步骤：提供引线框架或衬底面板，将半导体管芯附接到引线框架或衬底面板，并将管芯电耦合到引线框架或衬底面板。该方法还包括用第一密封剂封装管芯，并用第二密封剂封装第一密封剂，其中第二密封剂包括提供电磁屏蔽的材料。

83. 发明申请

US20130234306A1 LEAD FRAME FOR ASSEMBLING SEMICONDUCTOR DEVICE 有权
标题翻译：用于组装半导体器件的引线框架
公开(公告)号：US20130234306A1
公开(公告)日：2013-09-12
申请号：US13605990
申请日：2012-09-06
申请人： Shunan Qiu , Zhigang Bai , Haiyan Liu
发明人： Shunan Qiu , Zhigang Bai , Haiyan Liu
IPC分类号： H01L23/495 , H01L21/60
CPC分类号： H01L23/49558 , H01L23/3107 , H01L23/49541 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/49171 , H01L2924/00014 , H01L2924/00
摘要： A lead frame has a flag, a peripheral frame, and main tie bars coupling the flag to the peripheral frame. At least one cross tie bar extends between two of the main tie bars and an inner row of external connector pads extending from an inner side of the cross tie bar and an outer row of external connector pads extending from an outer side of the cross tie bar. Both an inner non-electrically conductive support bar and an outer non-electrically conductive support bar are attached across the two of the main tie bars. The inner non-electrically conductive support bar is attached to upper surfaces of the two of the main tie bars and to upper surfaces of the inner row of the external connector pads.
摘要翻译：引线框架具有标志，外围框架和将标志耦合到外围框架的主连接条。至少一个交叉连接杆在两个主连接杆之间延伸，以及从交叉连接杆的内侧延伸的内排的外部连接器焊盘以及从交叉连接杆的外侧延伸的外部排的外部连接器焊盘。内部非导电支撑杆和外部非导电支撑杆都穿过两个主连接杆。内部非导电支撑杆附接到两个主连杆的上表面和外部连接器垫的内排的上表面。

84. 发明申请

US20130049183A1 POWER DEVICE AND METHOD OF PACKAGING SAME 有权
标题翻译：电源装置及其包装方法
公开(公告)号：US20130049183A1
公开(公告)日：2013-02-28
申请号：US13549518
申请日：2012-07-16
申请人： Jinzhong YAO , Zhigang Bai , Xuesong Xu
发明人： Jinzhong YAO , Zhigang Bai , Xuesong Xu
IPC分类号： H01L23/495 , H01L21/50
CPC分类号： H01L23/49537 , H01L21/561 , H01L21/565 , H01L23/3107 , H01L23/4334 , H01L23/49551 , H01L23/49568 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/97 , H01L2224/13101 , H01L2224/1329 , H01L2224/16245 , H01L2224/2919 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48247 , H01L2224/49171 , H01L2224/73207 , H01L2224/73253 , H01L2224/73265 , H01L2224/83192 , H01L2224/92242 , H01L2224/97 , H01L2924/00014 , H01L2924/0781 , H01L2924/12042 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13062 , H01L2924/13091 , H01L2924/181 , H01L2924/00 , H01L2924/0665 , H01L2924/014 , H01L2924/00012
摘要： A method of packaging a power semiconductor die includes providing a first lead frame of a dual gauge lead frame. The first lead frame includes a thick die pad. A tape is attached to a first side of the thick die pad and the power die is attached to a second side of the thick die pad. A second lead frame of the dual gauge lead frame is provided. The second lead frame has thin lead fingers. One end of the lead fingers is attached to an active surface of the power die such that the lead fingers are electrically connected to bonding pads of the power die. A molding compound is then dispensed onto a top surface of the dual gauge lead frame such that the molding compound covers the power die and the lead fingers.
摘要翻译：封装功率半导体管芯的方法包括提供双量规引线框架的第一引线框架。第一引线框架包括厚的芯片焊盘。磁带附着到厚芯片焊盘的第一侧，并且功率管芯附接到厚芯片焊盘的第二侧。提供了双量规引线框架的第二引线框架。第二引线框架具有薄的引线指。引线指的一端连接到功率管芯的有源表面，使得引线指电连接到功率管芯的焊盘。然后将模塑料分配到双量规引线框架的顶表面上，使得模制化合物覆盖电源模具和引线指。

85. 发明授权

US08320076B1 Method and system for providing a magnetic recording transducer including an assist pole having surfaces angled with respect to the ABS 有权
标题翻译：用于提供包括具有相对于ABS成角度的表面的辅助杆的磁记录换能器的方法和系统
公开(公告)号：US08320076B1
公开(公告)日：2012-11-27
申请号：US12147364
申请日：2008-06-26
申请人： Yong Shen , Zhigang Bai
发明人： Yong Shen , Zhigang Bai
IPC分类号： G11B5/127 , G11B5/147
CPC分类号： G11B5/3116 , G11B5/3163 , Y10T29/49041 , Y10T29/49043 , Y10T29/49044 , Y10T29/49046 , Y10T29/49048 , Y10T29/49052
摘要： A method and system provide a magnetic transducer that includes an underlayer. The method and system include providing a recessed region in the underlayer. The recessed region includes a front having an angle from horizontal. The angle is greater than zero and less than ninety degrees. The method and system further includes providing an assist pole layer in the recessed region and providing a main pole layer. A portion of the main pole layer resides on the assist pole layer. A main pole is defined from the assist pole layer and the main pole layer.
摘要翻译：一种方法和系统提供包括底层的磁换能器。该方法和系统包括在底层中设置凹陷区域。凹陷区域包括具有与水平方向成角度的前部。角度大于零，小于九十度。该方法和系统还包括在凹陷区域中提供辅助极层并提供主极层。主极层的一部分位于辅助极层上。主极由辅助极层和主极层限定。

86. 发明申请

US20120075749A1 Magnetic write head with thin and thick portions for balancing writability and ate 有权
公开(公告)号：US20120075749A1
公开(公告)日：2012-03-29
申请号：US12924416
申请日：2010-09-27
申请人： Yan Wu , Moris Dovek , Zhigang Bai , Cherng Chyi Han , Jiun-Ting Lee , Po-Kang Wang
发明人： Yan Wu , Moris Dovek , Zhigang Bai , Cherng Chyi Han , Jiun-Ting Lee , Po-Kang Wang
IPC分类号： G11B5/127 , G11B5/10
CPC分类号： G11B5/1278 , G11B5/3116 , G11B5/3163
摘要： A perpendicular magnetic recording (PMR) head is fabricated with a tapered main pole having a variable thickness. The tapered portion of the pole is at the ABS tip and it can be formed by bevels at the leading or trailing edges or both. The taper terminates to form a region with a maximum thickness, t1, which extends for a certain distance proximally. Beyond this region of maximum thickness t1, the pole is then reduced to a constant minimum thickness t2. A yoke is attached to this region of constant minimum thickness. This pole design requires less flux because of the thinner region of the pole where it attaches to the yoke, but the thicker region just before the tapered ABS provides additional flux to drive the pole just before the ABS, so that high definition and field gain is achieved, yet fringing is significantly reduced.

87. 发明申请

US20120044598A1 Writer shields with modified shapes for reduced flux shunting 有权
标题翻译：作者盾牌具有改进的形状，用于减少通量分流
公开(公告)号：US20120044598A1
公开(公告)日：2012-02-23
申请号：US12806803
申请日：2010-08-20
申请人： Zhigang Bai , Moris Dovek , Yan Wu
发明人： Zhigang Bai , Moris Dovek , Yan Wu
IPC分类号： G11B5/17
CPC分类号： G11B5/3163 , G11B5/1278 , G11B5/3116 , G11B5/312 , G11B5/3146
摘要： A perpendicular magnetic recording (PMR) head is fabricated with a configuration of leading edge shields and trailing edge shields that reduce the leakage of flux between the main pole and the shields. The reduction of leakage is achieved by eliminating the sharp 90° corner between the backside surfaces of the shields and the surfaces adjacent to the main pole. In one embodiment the corner is replaced by two successive acute angles, in another embodiment it is replaced by a rounded surface. In a final embodiment, leakage between the pole and trailing edge shield is achieved by shortening the length of the write gap by forming the shield with a double taper.
摘要翻译：垂直磁记录（PMR）头被制造成具有前缘屏蔽和后缘屏蔽的结构，其减小主极和屏蔽之间的通量泄漏。通过消除屏蔽的背面和与主极相邻的表面之间的尖锐的90°角来实现泄漏的减少。在一个实施例中，角部被两个连续的锐角取代，在另一个实施例中，它被圆形表面所代替。在最终实施例中，通过用双锥形形成屏蔽来缩短写入间隙的长度来实现极和后缘屏蔽之间的泄漏。

88. 发明申请

US20110255196A1 PMR writer with graded side shield 有权
标题翻译： PMR作家与分级侧盾
公开(公告)号：US20110255196A1
公开(公告)日：2011-10-20
申请号：US12799131
申请日：2010-04-19
申请人： Yan Wu , Zhigang Bai , Moris Dovek , Cherng-Chyi Han , Min Li , Jianing Zhou , Jiun-Ting Lee , Min Zheng
发明人： Yan Wu , Zhigang Bai , Moris Dovek , Cherng-Chyi Han , Min Li , Jianing Zhou , Jiun-Ting Lee , Min Zheng
IPC分类号： G11B5/10 , G11B21/16
CPC分类号： G11B5/105 , G11B5/1278 , G11B5/3116 , G11B5/315 , G11B5/3163
摘要： A perpendicular magnetic recording (PMR) head is fabricated with a pole tip shielded laterally by a graded side shield that is conformal to the shape of the pole tip at an upper portion of the shield but not conformal to the pole tip at a lower portion. The shield includes a trailing shield, that is conformal to the trailing edge of the pole tip and may include a leading edge shield that magnetically connects two bottom ends of the graded side shield.
摘要翻译：垂直磁记录（PMR）头被制造成具有通过分级侧屏蔽横向屏蔽的极尖，该平面侧屏蔽保护层在屏蔽的上部处与极尖的形状保持一致，但在下部不与极尖共形。屏蔽件包括后挡板，其与电极尖端的后缘保持一致，并且可以包括磁性连接分级侧屏蔽件的两个底端的前缘屏蔽件。

89. 发明申请

US20110249364A1 PMR writer with seamless shields and method of making it 有权
标题翻译： PMR作者具有无缝屏障及其制作方法
公开(公告)号：US20110249364A1
公开(公告)日：2011-10-13
申请号：US12798560
申请日：2010-04-07
申请人： Zhigang Bai , Moris Dovek , Yan Wu , Cherng-Chyi Han , Jiun-Ting Lee
发明人： Zhigang Bai , Moris Dovek , Yan Wu , Cherng-Chyi Han , Jiun-Ting Lee
IPC分类号： G11B5/187 , B05D5/00 , C23F1/02
CPC分类号： G11B5/1278 , G11B5/3116 , G11B5/3163 , Y10T29/49039 , Y10T29/49043 , Y10T29/4906
摘要： A process (and the structure resulting therefrom) is described for manufacturing a magnetic write head in which there is no physical interface between the first and second trailing shields. This is achieved by the introduction of a sacrificial layer immediately after the top yoke plating has been done and its photoresist mold has been stripped.
摘要翻译：描述了一种用于制造其中在第一和第二后挡板之间没有物理接口的磁写头的过程（以及由此产生的结构）。这是通过在顶部磁轭镀层完成之后立即引入牺牲层并且其光致抗蚀剂模具被剥离来实现的。

90. 发明申请

US20110063755A1 PMR write with flux choking area 有权
标题翻译： PMR写入焊剂阻塞区域
公开(公告)号：US20110063755A1
公开(公告)日：2011-03-17
申请号：US12586249
申请日：2009-09-17
申请人： Zhigang Bai , Yue Liu , Kowang Liu , Yan Wu , Moris Dovek
发明人： Zhigang Bai , Yue Liu , Kowang Liu , Yan Wu , Moris Dovek
IPC分类号： G11B5/10 , G11B5/127
CPC分类号： G11B5/3116 , G11B5/1278 , G11B5/3163
摘要： A PMR writer having a trailing shield structure is disclosed in which a flux choking layer (FCL) formed adjacent to the ABS provides a means to limit the amount of flux flowing from the trailing shield to a first write shield (WS1) near the write pole tip thereby significantly reducing adjacent track erasure. The FCL has a substantially smaller thickness than a top section of the trailing shield to which it is attached along a side opposite the ABS. As a result, pole tip protrusion is reduced compared to prior art PMR writers. The FCL contacts a trailing side of WS1 at the ABS and one or both of the trailing sides of the WS1 and FCL may be tapered or perpendicular with respect to the ABS. The top trailing shield section, FCL, and WS1 may be comprised of NiFe, CoFe, CoFeNi, or alloys thereof.
摘要翻译：公开了具有拖尾屏蔽结构的PMR写入器，其中与ABS相邻形成的通量阻塞层（FCL）提供了一种将从后屏蔽流过的磁通量限制在写极附近的第一写屏蔽（WS1）的装置从而显着地减少相邻轨道擦除。 FCL具有比尾部护罩的顶部部分基本上小的厚度，其沿着与ABS相对的一侧被附接到该顶部部分。结果，与现有技术的PMR写入器相比，极尖突起减小。 FCL在ABS处接触WS1的后侧，并且WS1和FCL的一个或两个后侧可以相对于ABS呈锥形或垂直。顶部后屏蔽部分FCL和WS1可以由NiFe，CoFe，CoFeNi或其合金组成。

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