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81. 发明专利

JPH038523B2 失效
公开(公告)号：JPH038523B2
公开(公告)日：1991-02-06
申请号：JP3316484
申请日：1984-02-22
申请人： NITTO DENKO CORP
发明人： IGARASHI KAZUMASA , YAMAGUCHI KATSUHIKO , TANAKA MUNEKAZU
IPC分类号： C08G73/10 , C08G73/00 , G02F1/133 , G02F1/1337

82. 发明专利

JPH03763A POSITIVE TYPE PHOTOSENSITIVE POLYIMIDE COMPOSITION 失效
公开(公告)号：JPH03763A
公开(公告)日：1991-01-07
申请号：JP34252489
申请日：1989-12-27
申请人： NITTO DENKO CORP
发明人： YAMAOKA TSUGIO , MOCHIZUKI SHU , IGARASHI KAZUMASA , OMOTE TOSHIHIKO
IPC分类号： G03F7/039 , C08G73/10 , C08L79/08 , H01L21/027 , H01L21/30
摘要： PURPOSE:To improve the solubility of a polymer itself, to obtain high photosensitivity in forming a fine pattern and to improve dimensional accuracy by introducing a specified functional group into a molecular skeleton of an imide polymer. CONSTITUTION:A positive type photosensitive polyimide compsn. contg. a polyimide having repeating units of the formula and the content of the unit (m) of 20wt.% of the whole. In the formula, Ar1 is a tetravalent arom. hydrocarbon residue; Ar2 is a divalent arom. hydrocarbon residue with an acyloxy group on at least one position of ortho or meta of an arom. ring; Ar3 is a divalent arom. hydrocarbon residue. As said polyimide compsn. contains a polyimide wherein an acyloxy group is introduced into the main chain to improve the solubility in an org. solvent, the acyloxy group is hydrolyzed upon irradiation with light to provide a change in alkali solubility. As the result, the formation of a fine pattern which cannot be achieved by using the conventional positive type photosensitive polyimide becomes possible.

83. 发明专利

JPH0259620B2 失效
公开(公告)号：JPH0259620B2
公开(公告)日：1990-12-13
申请号：JP22929083
申请日：1983-12-05
申请人： NITTO DENKO CORP
发明人： IGARASHI KAZUMASA , YAMAGUCHI KATSUHIKO , IKO KAZUO , MIKI KAZUYUKI
IPC分类号： H01L23/29 , C08G73/10 , C08G77/42 , C08G77/455 , H01L21/312 , H01L23/31

84. 发明专利

JPH02277258A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH02277258A
公开(公告)日：1990-11-13
申请号：JP9935489
申请日：1989-04-18
申请人： NITTO DENKO CORP
发明人： IGARASHI KAZUMASA , AIZAWA MIKIO , NAKAMURA MASAO , SUGIMOTO MASAKAZU , TANAKA MUNEKAZU
IPC分类号： H01L23/29 , H01L23/31
摘要： PURPOSE:To enhance moisture-resistant reliability of a protective film by using a varnish composed of a specific fluorine-based resin. CONSTITUTION:A silicon chip 1 is bonded onto a die pad of a lead frame 7; an insulating film 2 is formed on the surface of the chip 1; a bonding pad part for external-electrode extraction use is formed at its one part and is connected to a circuit 4; a passivating film 3 is formed at this wiring layer; a protective film 6 is formed so as to cover the film 3. A vinylidene-fluoride-based fluorine rubber is as the protective film 6; this fluorine rubber is a copolymer containing vinylidene fluoride as a copolymerization unit; it is preferable to use a vinylidene fluoride-hexafluoro-propylene binary copolymer or the like expressed by Formula I (where m and n represent positive integers). Thereby, it is possible to enhance moisture-resistant reliability of the protective film.

85. 发明专利

JPH02272077A HEAT-RESISTANT ADHESIVE MATERIAL 失效
公开(公告)号：JPH02272077A
公开(公告)日：1990-11-06
申请号：JP9389789
申请日：1989-04-13
申请人： NITTO DENKO CORP
发明人： IGARASHI KAZUMASA , IWAMOTO TOSHIAKI
IPC分类号： C09J7/02 , C09J179/08
摘要： PURPOSE:To provide the title material for films or tapes insulate or fix electrical and electronic parts, etc., made up of the first layer consisting of non- thermoplastic aromatic polyimide supporting film and the second layer consisting of a thermoplastic aromatic polyimide adhesive layer. CONSTITUTION:The objective material made up of (A) the first layer consisting of a non-thermoplastic aromatic polyimide supporting film with recurring unit of formula I (Ar is aromatic tetracarboxylic acid; R is symmetric aromatic p-substituted diamine; n is integer >=1) as the main constituent and (B) the second layer consisting of a thermoplastic aromatic polyimide adhesive layer with recurring unit of formula II (R is symmetric aromatic m-substituted diamine) as the main constituent.

86. 发明专利

JPH0219862B2 失效
公开(公告)号：JPH0219862B2
公开(公告)日：1990-05-07
申请号：JP16370184
申请日：1984-08-02
申请人： NITTO DENKO CORP
发明人： IGARASHI KAZUMASA , YAMAGUCHI KATSUHIKO , INOE NAOKI
IPC分类号： C08G73/00 , C08G73/10 , C09D179/08

87. 发明专利

JPH01249876A POLYIMIDE INSULATING TAPE 失效
公开(公告)号：JPH01249876A
公开(公告)日：1989-10-05
申请号：JP8003388
申请日：1988-03-30
申请人： NITTO DENKO CORP
发明人： IGARASHI KAZUMASA , IWAMOTO TOSHIAKI , UEMURA TAKEMASA
IPC分类号： C09J7/02 , C09J121/00 , H01B17/60
摘要： PURPOSE:To obtain the subject tape for fixing electronic parts, excellent in bond properties at the ordinary or high temperature and capable of reducing leaking current, by forming a pressure-sensitive adhesives layer containing an acrylonitrile-butadiene rubber on one side of a polyimide film. CONSTITUTION:A pressure-sensitive adhesives layer (B) obtained by blending (i) 100 pts.wt. acrylonitrile-butadiene rubber, (ii) 20-80 pts.wt. phenolic resin, (iii) 0.5-20 pts.wt. curing agent and (iv) 0.05-10 pts.wt. radical generator is formed on one side of a polyimide film (A) to provide the objective tape. In addition, heat shrinkage factor of the resultant film is preferably

88. 发明专利

JP2013221100A Ultraviolet curable optical resin adhesive composition, image display device using the same, and method for manufacturing image display device 审中-公开
标题翻译： ULTRAVIOLET可固化光学树脂粘合剂组合物，使用该组合物的图像显示装置以及用于制造图像显示装置的方法
公开(公告)号：JP2013221100A
公开(公告)日：2013-10-28
申请号：JP2012094036
申请日：2012-04-17
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： HASEGAWA YUKI , IGARASHI KAZUMASA
IPC分类号： C09J133/04 , C09J5/00 , C09J11/06 , G02F1/1333 , G09F9/00
摘要： PROBLEM TO BE SOLVED: To provide an ultraviolet curable optical resin adhesive composition which never adversely affects luminance or contrast with respect to image quality, and is excellent in transparency, adhesion reliability and durability, and suitably used to a part having a light shielding portion, an image display device using the same, and a method for manufacturing the image display device.SOLUTION: As an optical resin adhesive composition for filling a gap between an image display panel and a protection cover plate or the like, an ultraviolet curable optical resin adhesive composition is used to fill the gap. The composition includes an acrylic polymer (A) and a phosphor-based photopolymerization initiator (B) as essential components, and the light absorption area in a wavelength range of 345-450 nm in an absorbance curve of ultraviolet-visible absorption spectrum transmitting the thickness 50 μm of the composition is 0.6 or more. According to this, the composition can secure characteristics of excellent curability even when applied to a light shielding portion, in addition to excellent transparency and adhesiveness.
摘要翻译：要解决的问题：提供一种对图像质量不会对亮度或对比度产生不利影响的紫外线固化光学树脂粘合剂组合物，并且透明性，粘合可靠性和耐久性优异，适用于具有遮光部分的部分，使用该图像显示装置的图像显示装置和图像显示装置的制造方法。作为用于填充图像显示面板和保护盖板等之间的间隙的光学树脂粘合剂组合物，可以使用紫外线固化型光学树脂粘合剂组合物用于弥补差距。作为必要成分的组合物包括丙烯酸类聚合物（A）和荧光体类光聚合引发剂（B），在紫外 - 可见吸收光谱的透射厚度的吸光度曲线中，在345〜450nm的波长范围内的光吸收面积组合物的50μm为0.6以上。据此，除了优异的透明性和粘合性之外，组合物也可以确保即使应用于遮光部时也具有优异的固化性。

89. 发明专利

JP2006057021A Electronic device 审中-公开
标题翻译：电子设备
公开(公告)号：JP2006057021A
公开(公告)日：2006-03-02
申请号：JP2004241398
申请日：2004-08-20
申请人： Nec Corp , Nitto Denko Corp , 日本電気株式会社 , 日東電工株式会社
发明人： HAZEYAMA ICHIRO , KUBO MASAHIRO , IGARASHI KAZUMASA
IPC分类号： C08G59/50 , C08G59/62 , H01L21/60
CPC分类号： H01L21/563 , C08G59/184 , C08G59/504 , C08L63/00 , H01L23/293 , H01L29/0657 , H01L2224/16225 , H01L2224/26145 , H01L2224/27013 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2924/00014 , H01L2924/01004 , H01L2924/01012 , H01L2924/0102 , H01L2924/01087 , H01L2924/10155 , H01L2924/10158 , C08L2666/16 , H01L2924/00 , H01L2224/0401
摘要： PROBLEM TO BE SOLVED: To provide an electronic device sealed with a low-viscosity one-pack solvent-free epoxy resin composition exhibiting a flow property having low shear rate dependence (low thixotropy), curable at a low temperature and having a long pot life.
SOLUTION: The electronic device has a semiconductor device 1 mounted on a printed circuit board 2 in a state placing the connection electrodes (solder bumps) 3 of the semiconductor device 1 opposite to the connection electrodes (solder pads) 5 of the printed circuit board 2. The gap between the printed circuit board 2 and the semiconductor device 1 is sealed by a sealing resin layer 4 composed of a liquid epoxy resin composition containing (A) a liquid epoxy resin, (B) a liquid phenolic resin, (C) a solid-dispersed amine adduct cure accelerator powder, (D) an amine-based silane coupling agent and (E) an inorganic filler.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种用低粘度单组分无溶剂环氧树脂组合物密封的电子装置，其具有低剪切速率依赖性（低触变性）的流动性，可在低温下固化并具有长寿命。解决方案：电子设备具有安装在印刷电路板2上的半导体器件1，其状态是将半导体器件1的连接电极（焊料凸块）3与印刷的连接电极（焊盘）5相对置印刷电路板2和半导体器件1之间的间隙由包含（A）液体环氧树脂的液体环氧树脂组合物，（B）液体酚醛树脂（（B））的液体环氧树脂组合物构成的密封树脂层4密封， C）固体分散的胺加合物固化促进剂粉末，（D）胺类硅烷偶联剂和（E）无机填料。版权所有（C）2006，JPO＆NCIPI

90. 发明专利

JP2003096424A ADHESIVE FOR OPTICAL FIBER CONNECTOR AND OPTICAL FIBER CONNECTOR 审中-公开
公开(公告)号：JP2003096424A
公开(公告)日：2003-04-03
申请号：JP2001285993
申请日：2001-09-20
申请人： NITTO DENKO CORP
发明人： FUKUSHIMA TAKASHI , IGARASHI KAZUMASA , KITAMURA FUJIO , ITO TATSUSHI
IPC分类号： G02B6/24 , C09J163/00 , G02B6/30
摘要： PROBLEM TO BE SOLVED: To provide an adhesive for an optical fiber connector useful, for example, for bonding quartz glass used for the optical fiber connector to each other, or bonding an optical fiber to a quartz waveguide, and to provide the optical fiber connector using the adhesive. SOLUTION: The adhesive contains an epoxy compound having an alkylene fluoride group or a methyl trifluoride group, an alicyclic epoxy compound having a specific structure, and a photopolymerization initiator or a hardener. As the epoxy compound having an alkylene fluoride group, a diglycidyl compound having a methylene fluoride group is preferably used, and the compound is contained in a range of 30-80 wt.%. As the polymerization initiator, it is preferable to use an aromatic sulfonium hexafluorophosphonium compound.

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