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81. 发明专利

JP2019022193A 交流発生装置审中-公开
公开(公告)号：JP2019022193A
公开(公告)日：2019-02-07
申请号：JP2017142051
申请日：2017-07-21
申请人： DENSO CORP , AIST , UNIV TOHOKU
发明人： MIZUNUMA KOTARO , SATO MASASHIGE , KONO YASUSHI , KUBOTA HITOSHI , FUKUSHIMA AKIO , TSUNEKI SUMITO , TAMARU SHINGO , MIZUKAMI NARUMI , SUZUKI KAZUYA
IPC分类号： H03B15/00 , H01L29/82 , H01L43/08
摘要：【課題】磁性発振素子をスレーブとして用いたマスタースレーブ方式の交流発生装置において、磁性発振素子の破壊を抑制する。【解決手段】交流磁界を発生させる発振器1と、直流電流または直流電圧を交流電力に変換する磁性発振素子2と、磁性発振素子2が発生させる交流電力の位相を制御する位相制御部6と、を備え、発振器1が発生させる交流磁界を磁性発振素子2に印加することによって、磁性発振素子2を共鳴させ、発振器1と磁性発振素子2とを同期させる。【選択図】図1

82. 发明专利

JP2019022190A 交流発生装置有权
公开(公告)号：JP2019022190A
公开(公告)日：2019-02-07
申请号：JP2017142048
申请日：2017-07-21
申请人： DENSO CORP , AIST , UNIV TOHOKU
发明人： MIZUNUMA KOTARO , SATO MASASHIGE , KONO YASUSHI , KUBOTA HITOSHI , FUKUSHIMA AKIO , TSUNEKI SUMITO , TAMARU SHINGO , MIZUKAMI NARUMI , SUZUKI KAZUYA
IPC分类号： H03B19/00 , H03B15/00
摘要：【課題】位相誤差を低減することができる交流発生装置を提供する。【解決手段】交流発生装置100は、直流電流または直流電圧を交流電力に変換する複数の磁性発振素子2と、交流磁界を複数の磁性発振素子に印加する発振器1と、を備え、磁性発振素子と発振器とを同期させる。発振器1の出力の周波数をf1とし、複数の磁性発振素子2が発生させる交流電力の周波数をf2としたとき、周波数f2は、f1/4、f1/3、f1/2、f1、2f1、3f1、4f1のいずれかに等しい。【選択図】図1

83. 发明专利

JP2002357467A FLOW SENSOR AND ITS MANUFACTURING METHOD 审中-公开
公开(公告)号：JP2002357467A
公开(公告)日：2002-12-13
申请号：JP2001376176
申请日：2001-12-10
申请人： DENSO CORP
发明人： ISOGAI TOSHIKI , KONO YASUSHI , YAMAMOTO TOSHIMASA , WADO HIROYUKI
IPC分类号： G01F1/692 , G01F1/684
摘要： PROBLEM TO BE SOLVED: To provide a flow sensor and its manufacturing method capable of reducing the plane size of a flow sensor chip. SOLUTION: In the sensor chip 10, a thin film part 7 is formed on a cavity part 6 when the cavity part 6 is formed excepting thin film layers 2-4 formed on the front surface 1a of a base board 1, and a conductor 9 is arranged on the inside wall face of a through hole 8 formed through the front and back faces of the base board 1, while a detection part constructed of a conductive film 3 in the thin film layer is electrically connected to a board conductor part 11 formed on the back face side of the through hole 8. On the front face 20a of a circuit base board 20, a control circuit 21 and a base conductor body part electrically connected to the control circuit 21 are formed. The sensor chip 10 and the circuit board 20 are layered together, and the board conductor part 11 and the base conductor part are electrically connected to each other.

84. 发明专利

JP2002295292A DEVICE FOR CONTROLLING FUEL INJECTION AND APPARATUS FOR MEASURING FLUID FLOW 失效
公开(公告)号：JP2002295292A
公开(公告)日：2002-10-09
申请号：JP2001101319
申请日：2001-03-30
申请人： DENSO CORP
发明人： KITAHARA NOBORU , KONO YASUSHI
IPC分类号： G01F1/68 , F02D35/00 , F02D41/18 , F02D45/00 , G01F1/684 , G01F1/692 , G01F1/696 , G01F1/72
摘要： PROBLEM TO BE SOLVED: To provide a fuel injection control device and a fluid flow measuring apparatus, capable of detecting a fluid flow at high accuracy, in either case in which the fluid flows in the forward or the reverse direction. SOLUTION: This heating resistor type fluid flow measuring apparatus or fuel injection control device is provided with a secondary fluid passage (69), which is arranged in an air passage (65) and has a bend, and a heating resistor (43) disposed in the secondary fluid passage for detecting the flow of fluid and its direction of flow. In the apparatus or device, as a table value used for converting an output value into a fluid flow value, flow-output static characteristics are used in an output region in the forward direction, and compensated flow-output static characteristics are used in the output region in the reverse direction. Alternatively, a compensation effect amount at pulsation is changed by the cases of forward, and reverse flows is made in the secondary fluid passage.

85. 发明专利

JP2002286521A METHOD FOR MANUFACTURING FLOW MEASURING INSTRUMENT 失效
公开(公告)号：JP2002286521A
公开(公告)日：2002-10-03
申请号：JP2001087809
申请日：2001-03-26
申请人： DENSO CORP
发明人： GOTO KOICHI , IWAKI TAKAO , KONO YASUSHI
IPC分类号： G01F1/692 , G01F1/698
摘要： PROBLEM TO BE SOLVED: To prevent counter diffusion from developing between electrode pads and lead parts of metallic resistive layers even when the metallic resistive layers are heat-treated. SOLUTION: An under insulation film 3 is formed on a semiconductor substrate 2. A conductive film 4 is formed on the film 3. The film 4 is etched to form a heating resistor 5, a resistor 6 for flow detection, resistors 7 and 8 for fluid temperature detection, and the lead parts 9 to 14 of these resistors. An upper insulation film 15 is formed on the resistors 5 to 8 and lead parts 9 to 14. The film 15 is etched at portions where the electrode pads are to be formed. The electrode pads 16 to 21 are formed on the lead parts 9 to 14. A hollow part 2a is formed in the substrate 2 to form a diaphragm 22. The resistors 5 and 6 are heat-treated by irradiating the diaphragm 22 with light, with the pads 16 to 21 covered by a heat-shield material.

86. 发明专利

JPH11132810A AIR FLOWMETER AND ADJUSTMENT THEREOF 失效
公开(公告)号：JPH11132810A
公开(公告)日：1999-05-21
申请号：JP30031097
申请日：1997-10-31
申请人： DENSO CORP
发明人： KONO YASUSHI , NAGASAKA REI , KONDO MINORU
IPC分类号： G01F1/68 , G01F1/684 , G01F1/698
摘要： PROBLEM TO BE SOLVED: To provide an air flowmeter, allowing the manufacturing man-hour to be lessened by omitting the resistance adjustment of a bridge circuit and the size to be reduced by compacting the resistor of this circuit. SOLUTION: The resistances of a heating resistor and temp. compensating resistor are measured and selected, a selected heating element and thermosensitive element are mounted on a support, air flow rate is measured, output voltage of an amplifier circuit is adjusted for desired board, and final output characteristic is tested to thereby permit the resistance value adjustment of a second and third fixed resistors 113, 114 in a Wheatstone bridge circuit to be omitted and hence the yarn man-our to be lessened. No need of the resistance value adjustment of a second and third fixed resistors 113, 114 results in that these resistors 113, 114 can be comparatively small and the flow-meter itself can be compact.

87. 发明专利

JPH11118558A AIR FLOW RATE MEASURING APPARATUS 失效
公开(公告)号：JPH11118558A
公开(公告)日：1999-04-30
申请号：JP27875897
申请日：1997-10-13
申请人： DENSO CORP
发明人： TAKIGUCHI TOMOYUKI , KONO YASUSHI , TSUNEKAWA MAKOTO
IPC分类号： G01F1/68 , G01F1/684
摘要： PROBLEM TO BE SOLVED: To provide an apparatus for measuring the air flow rate with high accuracy by suppressing disturbance of air flow in a bypath through a simple structure. SOLUTION: A bypath 34 comprises an upstream channel 34a for passing the air from an intake port 31d in one radial direction of an air channel 2, a downstream channel 34b for passing the air in the opposite radial direction to the upstream channel 34a disposed in parallel with the upstream channel 34a on the downstream side thereof, and a channel 34c communicating between the upstream channel 34a and the downstream channel 34b. A corner part 35 facing the joint between the upstream channel 34a and the downstream channel 34b is formed into a smooth concave face having arcuate cross-section. Since generation of vortexes in the air flow passing a heat-sensitive resistor 25 and a heating resistor 26 arranged in the vicinity of the corner part 35 or disturbance of the air flow can be suppressed, fluctuation in the output of air flow rate being detected by the heat-sensitive resistor 25 and the heating resistor 26 can be suppressed and the air flow rate can be detected with high accuracy.

88. 发明专利

JP2019022191A 交流発生装置审中-公开
公开(公告)号：JP2019022191A
公开(公告)日：2019-02-07
申请号：JP2017142049
申请日：2017-07-21
申请人： DENSO CORP , AIST , UNIV TOHOKU
发明人： MIZUNUMA KOTARO , SATO MASASHIGE , KONO YASUSHI , KUBOTA HITOSHI , FUKUSHIMA AKIO , TSUNEKI SUMITO , TAMARU SHINGO , MIZUKAMI NARUMI , SUZUKI KAZUYA
IPC分类号： H03B15/00 , H01L29/82 , H01L43/08
摘要：【課題】スレーブの位相をより広い範囲で制御できる交流発生装置を提供する。【解決手段】交流電流を出力する発振器1と、電気的エネルギーを交流電力に変換する磁性発振素子2と、発振器1および磁性発振素子2を電気的または磁気的に接続する接続部3と、交流電力の位相を制御する第1位相制御部7と、第1位相制御部7とは異なる方法で交流電力の位相を制御する第2位相制御部6と、を備え、発振器1と磁性発振素子2とを同期させる。【選択図】図1

89. 发明专利

JP2002357131A WATERPROOFING STRUCTURE OF THROTTLE BODY 失效
公开(公告)号：JP2002357131A
公开(公告)日：2002-12-13
申请号：JP2001125983
申请日：2001-04-24
申请人： DENSO CORP
发明人： KONO YASUSHI , MIURA YUICHIRO
IPC分类号： F02D9/10 , F02D9/02
摘要： PROBLEM TO BE SOLVED: To provide a waterproofing structure manufacturable by simple machining without increasing the number of part items and capable of preventing the infiltration of water into a storage space. SOLUTION: This waterproofing structure of a throttle body is constituted by a water drain hole 25 communicating with the storage space 9 of a valve element driving system part formed in a main body 1 and a breathing hole 23 communicating with the storage space 9. The water drain hole 25 is positioned on the lower side of the storage space 9 on a vehicle. The breathing hole 23 forms a labyrinth by a through hole 22 passing through an intake manifold abutting face 14 of the body main body 1 from the storage space 9 and a groove 15 which is positioned along the intake manifold abutting face 14 from the through hole 22 and whose end part is communicated with the outside air.

90. 发明专利

JP2002243516A METHOD OF MANUFACTURING SENSOR HAVING THIN FILM PART 失效
公开(公告)号：JP2002243516A
公开(公告)日：2002-08-28
申请号：JP2001035937
申请日：2001-02-13
申请人： DENSO CORP
发明人： YAMAMOTO TOSHIMASA , WADO HIROYUKI , KONO YASUSHI
IPC分类号： G01F1/692
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing a sensor having a thin film part capable of improving a fracture withstand pressure of the thin film part. SOLUTION: A thin film layer 8 comprising a conductor film held between insulating films is formed on a surface of a substrate 1 of silicon. Then a cavity part 2 is partially formed by carrying out anisotropic etching relying on an orientation of the substrate 1 until a thickness of the substrate 1 remaining in a surface side of the substrate 1 is 10 μm or less by using a KOH solution from a backside of the substrate 1. By forming an oxide film so that an upper bottom face 1a of the substrate 1 is exposed and performing ICP etching by using the oxide film as a mask, the remaining substrate 1 is etched perpendicularly to the surface of the substrate 1, the cavity part 2 is formed by exposing the thin film layer 8, and a thin film part 3 comprising the thin film layer 8 is formed above the cavity part 2.

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