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81. 发明授权

US08220527B2 Heat dissipation device with heat pipe 有权
标题翻译：散热装置带热管
公开(公告)号：US08220527B2
公开(公告)日：2012-07-17
申请号：US12056295
申请日：2008-03-27
申请人： Peng Liu , Shi-Wen Zhou , Chun-Chi Chen , Yi-Jiun Li
发明人： Peng Liu , Shi-Wen Zhou , Chun-Chi Chen , Yi-Jiun Li
IPC分类号： F28D15/02
CPC分类号： F28D15/0233
摘要： A heat dissipation device includes a heat spreader for thermally engaging with a heat generating electronic device, a heat sink assembly located above the heat spreader, and first and second heat pipes connecting with the heat spreader and the heat sink assembly. Each of the first and second heat pipes comprises an evaporation section engaged in the heat spreader, two arc-shaped condensation sections thermally inserted in the heat sink assembly, and two connecting sections interconnecting corresponding condensation sections and the evaporation section. The condensation sections are coplanar with each other and located in a same circle. The condensation sections of the first heat pipe extend in a clockwise direction, while the condensation sections of the second heat pipe extend in an anticlockwise direction.
摘要翻译：散热装置包括用于与发热电子设备热接合的散热器，位于散热器上方的散热器组件，以及与散热器和散热器组件连接的第一和第二热管。第一和第二热管中的每一个包括接合在散热器中的蒸发部分，热插入散热器组件中的两个弧形冷凝部分和互连相应的冷凝部分和蒸发部分的两个连接部分。冷凝段彼此共面并且位于同一个圆中。第一热管的冷凝部沿顺时针方向延伸，第二热管的冷凝部沿逆时针方向延伸。

82. 发明授权

US08199508B2 Heat dissipation device 失效
标题翻译：散热装置
公开(公告)号：US08199508B2
公开(公告)日：2012-06-12
申请号：US12503021
申请日：2009-07-14
申请人： Xu-Xin Min , Meng Fu , Chun-Chi Chen
发明人： Xu-Xin Min , Meng Fu , Chun-Chi Chen
IPC分类号： H05K7/20 , H05K5/00 , H01L23/10 , F28F7/00
CPC分类号： H01L23/427 , F28D15/0275 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device dissipates heat generated by a heat-generating electronic element mounted on a top surface printed circuit board. The printed circuit board defines a plurality of first through holes. The heat dissipation device comprises a heat spreader located at a top side of the printed circuit board. The heat spreader defines a plurality of second through holes corresponding to the first through holes, respectively. A first heat sink is located over the heat spreader, and a plurality of second heat sinks is located at a bottom side of the printed circuit board. A plurality of heat pipes extending through the second through holes of the heat spreader and the first through holes of the printed circuit board to thermally connect the first and second heat sinks to the heat spreader.
摘要翻译：散热装置散发由安装在顶面印刷电路板上的发热电子元件产生的热量。印刷电路板限定多个第一通孔。散热装置包括位于印刷电路板顶侧的散热器。散热器分别限定与第一通孔相对应的多个第二通孔。第一散热器位于散热器上方，并且多个第二散热器位于印刷电路板的底侧。多个热管延伸穿过散热器的第二通孔和印刷电路板的第一通孔，以将第一和第二散热器热连接到散热器。

83. 发明授权

US08109323B2 Heat dissipation device having a clip 失效
标题翻译：具有夹子的散热装置
公开(公告)号：US08109323B2
公开(公告)日：2012-02-07
申请号：US12409502
申请日：2009-03-24
申请人： Zhi-Sheng Lian , Gen-Ping Deng , Chun-Chi Chen
发明人： Zhi-Sheng Lian , Gen-Ping Deng , Chun-Chi Chen
IPC分类号： F28F7/00 , H05K7/20 , F28D15/00
CPC分类号： H01L23/427 , F28D15/0266 , F28D15/0275 , F28F1/32 , H01L23/3672 , H01L23/4006 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device removing heat from a heat generating electronic device on a printed circuit board includes a base, a plurality of fins attached to the base and a clip for mounting the base and the fins onto the heat generating electronic device. Each of the fins defines a closed through hole therein. The holes of the fins cooperatively define a channel. The clip includes a locking beam extending through the channel of the fins and two fasteners engaging the locking beam mounting the base and the fins onto the heat generating electronic device.
摘要翻译：从印刷电路板上的发热电子装置中除去热的散热装置包括底座，安装在基座上的多个翅片以及用于将基座和翅片安装在发热电子设备上的夹子。每个翅片在其中限定了一个封闭的通孔。翅片的孔协同地限定通道。夹具包括延伸穿过翅片的通道的锁定梁和两个紧固件，其接合将基座和翅片安装到发热电子设备上的锁定梁。

84. 发明授权

US08050038B2 Heat dissipation device 失效
标题翻译：散热装置
公开(公告)号：US08050038B2
公开(公告)日：2011-11-01
申请号：US12504681
申请日：2009-07-17
申请人： Chun-Chi Chen , Hong-Cheng Yang , Xin-Lei Liu
发明人： Chun-Chi Chen , Hong-Cheng Yang , Xin-Lei Liu
IPC分类号： H05K7/20 , G06F1/20
CPC分类号： H01L23/427 , F28D15/0233 , F28D15/0266 , H01L23/3672 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device for dissipating heat from an electronic component mounted on a printed circuit board, includes a fin unit, a heat-conducting board attached to the electronic component, a heat pipe thermally connecting the fin unit and the heat-conducting board, and a clip disposed on the heat pipe. Two engaging portions protrude upwardly from a top face of the heat-conducting board towards each other. The heat pipe extends between the two engaging portions. The two engaging portions press two opposite ends of the clip downwardly, thereby securing the heat pipe to the top face of the heat-conducting board.
摘要翻译：一种用于从安装在印刷电路板上的电子部件散热的散热装置，包括翅片单元，安装在电子部件上的导热板，热连接翅片单元和导热板的热管，以及设置在热管上的夹子。两个接合部分从导热板的顶面朝向彼此向上突出。热管在两个接合部分之间延伸。两个接合部分向下按压夹子的两个相对端，从而将热管固定到导热板的顶面。

85. 发明授权

US08002019B2 Heat dissipation device 失效
标题翻译：散热装置
公开(公告)号：US08002019B2
公开(公告)日：2011-08-23
申请号：US12051853
申请日：2008-03-20
申请人： Xu-Xin Min , Meng Fu , Chun-Chi Chen
发明人： Xu-Xin Min , Meng Fu , Chun-Chi Chen
IPC分类号： H05K7/20
CPC分类号： F28D15/0275 , H01L23/3672 , H01L23/427 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device includes a base, a fin group located on the base, a first heat pipe and a second heat pipe. The fin group includes a first fin group, a second fin group arranged on the first fin group and a third fin group arranged on the second fin group. The first heat pipe includes an evaporating portion sandwiched between the base and the first fin group, a condensing portion sandwiched between the first fin group and the second fin group, and a connecting portion interconnecting the evaporating portion and the condensing portion. The second heat pipe includes an evaporating portion sandwiched between the base and the first fin group, a condensing portion located between the second fin group and the third fin group, and a connecting portion interconnecting the evaporating portion and the condensing portion thereof.
摘要翻译：散热装置包括基座，位于基座上的翅片组，第一热管和第二热管。翅片组包括布置在第一鳍片组上的第一鳍片组，第二鳍片组和布置在第二鳍片组上的第三鳍片组。第一热管包括夹在基部和第一翅片组之间的蒸发部分，夹在第一翅片组和第二翅片组之间的冷凝部分和将蒸发部分和冷凝部分互连的连接部分。第二热管包括夹在基座和第一翅片组之间的蒸发部分，位于第二翅片组和第三翅片组之间的冷凝部分和将蒸发部分和其冷凝部分互连的连接部分。

86. 发明授权

US07990719B2 Electronic system with heat dissipation device 有权
标题翻译：具有散热装置的电子系统
公开(公告)号：US07990719B2
公开(公告)日：2011-08-02
申请号：US12610388
申请日：2009-11-02
申请人： Guo Chen , Shi-Wen Zhou , Chun-Chi Chen
发明人： Guo Chen , Shi-Wen Zhou , Chun-Chi Chen
IPC分类号： H05K7/20 , G06F1/20
CPC分类号： H05K7/20154
摘要： A heat dissipation device is provided for dissipating heat generated by electronic components mounted on a printed circuit board in an electronic system. The electronic components have different heights. The heat dissipation device includes a connecting plate, at least two elastic members mounted on the connecting plate, and a heat sink having a substrate mounted on the connecting plate and located above one of the electronic components. A number of joining members extend through the printed circuit board and engage with the substrate to attach the substrate on the one electronic component on the printed circuit board. A distance between the substrate and the connecting plate is adjustable by adjusting the joining members to make the substrate intimately contact the one electronic component.
摘要翻译：散热装置用于散发电子系统中安装在印刷电路板上的电子元件产生的热量。电子元件具有不同的高度。所述散热装置包括连接板，安装在所述连接板上的至少两个弹性部件和散热器，所述散热器具有安装在所述连接板上且位于所述电子部件之一上方的基板。多个接合构件延伸穿过印刷电路板并与衬底接合以将衬底附着在印刷电路板上的一个电子部件上。基板和连接板之间的距离可通过调节连接部件来调节，以使基板与一个电子部件紧密接触。

87. 发明授权

US07969728B2 Heat dissipation device with a fan holder attached with a position-adjustable air guiding member 失效
标题翻译：带散热装置的风扇架带有一个位置可调导风构件
公开(公告)号：US07969728B2
公开(公告)日：2011-06-28
申请号：US12399027
申请日：2009-03-06
申请人： Dong-Bo Zheng , Meng Fu , Chun-Chi Chen
发明人： Dong-Bo Zheng , Meng Fu , Chun-Chi Chen
IPC分类号： H05K7/20 , F28F7/00 , H01L23/34
CPC分类号： H01L23/467 , H01L23/3672 , H01L23/4006 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device includes a heat sink having a plurality of fins defining a plurality of passageways therebetween. The passageways have an inlet and an outlet at front and rear sides of the heat sink. Two adjusting members are mounted at two lateral sides of the heat sink. A fan is located at the inlet of the passageways of the heat sink for providing airflow to the heat sink. A guiding member is positioned at the outlet of the passageways of the heat sink for guiding the airflow to electronic components around the heat dissipation device. The guiding member engages the adjusting members and can move vertically relative to adjusting members, thereby adjusting a height of the guiding member along a height of the heat sink.
摘要翻译：散热装置包括具有限定多个通道之间的多个翅片的散热器。通道在散热器的前侧和后侧具有入口和出口。两个调节构件安装在散热器的两个侧面。风扇位于散热器通道的入口处，用于向散热器提供气流。引导构件定位在散热器的通道的出口处，用于将气流引导到散热装置周围的电子部件。引导构件与调节构件接合并且可相对于调节构件垂直移动，从而沿着散热器的高度调节引导构件的高度。

88. 发明申请

US20110080109A1 HIGH EFFICIENCY LED DRIVER WITH CURRENT SOURCE REGULATIONS 有权
标题翻译：高效LED驱动器与电流源规范
公开(公告)号：US20110080109A1
公开(公告)日：2011-04-07
申请号：US12762386
申请日：2010-04-19
申请人： Ta-Yung Yang , Byung-Hak Ahn , Jin-Hwa Chung , Chun-Chi Chen
发明人： Ta-Yung Yang , Byung-Hak Ahn , Jin-Hwa Chung , Chun-Chi Chen
IPC分类号： H05B37/02
CPC分类号： H05B33/0815 , H05B33/0827 , Y02B20/347
摘要： The present invention provides a control circuit for LED driver. A voltage-feedback circuit is coupled to LEDs to sense a voltage-feedback signal for generating a voltage loop signal. Current sources are coupled to the LEDs to control LED currents. A detection circuit is connected to sense voltages of current sources for generating a current-source loop signal in response to a minimum voltage of the current sources. Furthermore, a buffer circuit generates a feedback signal in accordance with the voltage loop signal and the current-source loop signal. The feedback signal is coupled to limit a maximum voltage of the LEDs and regulate the minimum voltage across the current sources.
摘要翻译：本发明提供一种LED驱动器的控制电路。电压反馈电路耦合到LED以感测用于产生电压环路信号的电压反馈信号。电流源耦合到LED以控制LED电流。连接检测电路以响应于电流源的最小电压来感测用于产生电流 - 源极环路信号的电流源的电压。此外，缓冲电路根据电压环路信号和电流 - 源极环路信号产生反馈信号。耦合反馈信号以限制LED的最大电压并调节跨过电流源的最小电压。

89. 发明授权

US07866376B2 Heat dissipation device with U-shaped and S-shaped heat pipes 有权
标题翻译：具有U形和S形热管的散热装置
公开(公告)号：US07866376B2
公开(公告)日：2011-01-11
申请号：US11926701
申请日：2007-10-29
申请人： Lei Jiang , Dong-Bo Zheng , Meng Fu , Chun-Chi Chen
发明人： Lei Jiang , Dong-Bo Zheng , Meng Fu , Chun-Chi Chen
IPC分类号： F28D15/00 , H05K7/20 , H01L23/34 , F28F7/00
CPC分类号： F28D15/0233 , H01L23/427 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device includes a base for contacting an electronic device, a fin set thermally contacting the base, a first heat pipe and a second heat pipe connecting the base and the fin set. The fin set has a bottom larger than the base and an upper portion apart from the bottom thereof. The first heat pipe has a flat top face thermally contacting the bottom of the fin set, including a first transferring portion thermally engaging with the base and a second transferring portion extending from the first transferring portion and projecting beyond the base. The second heat pipe includes an evaporation portion thermally engaging with the base and a condensation portion extending from the evaporation portion and engaging with the upper portion of the fin set.
摘要翻译：散热装置包括用于接触电子设备的基座，与基座热接触的翅片组，第一热管和连接基座和翅片组的第二热管。翅片组具有比基部大的底部和与其底部分离的上部。第一热管具有与翅片组的底部热接触的平坦顶面，包括与基部热接合的第一传递部分和从第一传递部分延伸并突出超出基部的第二传递部分。第二热管包括与基座热接合的蒸发部分和从蒸发部分延伸并与翅片组的上部接合的冷凝部分。

90. 发明授权

US07866375B2 Heat dissipation device with heat pipes 有权
标题翻译：带热管的散热装置
公开(公告)号：US07866375B2
公开(公告)日：2011-01-11
申请号：US11566003
申请日：2006-12-01
申请人： Shi-Wen Zhou , Chun-Chi Chen , Bao-Chun Chen
发明人： Shi-Wen Zhou , Chun-Chi Chen , Bao-Chun Chen
IPC分类号： F28D15/00 , F28F7/00 , H01L23/24 , H05K7/20
CPC分类号： H01L23/427 , F28D15/0233 , F28D15/0275 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device includes a base (10), a plurality of fins (20), first and second heat pipes (30), (40), a fan holder (50) and a fan (60) secured to the fan holder. The first heat pipe includes a heat-receiving section (32) and two heat-discharging sections (34). The second heat pipe includes an evaporating portion (42) and two condensing portions (44). The condensing portions of the second heat pipe extend into the fins and are disposed adjacent to opposite ends of each of the fins. One heat-discharging section extends in the fins and is disposed between the condensing portions, thus allowing heat absorbed from the base to be evenly distributed throughout the fins by the heat-discharging sections and the condensing portions.
摘要翻译：一种散热装置，包括底座（10），多个翅片（20），第一和第二热管（30），（40），风扇架（50）和固定到风扇架的风扇（60）。第一热管包括受热部（32）和两个散热部（34）。第二热管包括蒸发部分（42）和两个冷凝部分（44）。第二热管的冷凝部分延伸到翅片中并且与每个翅片的相对端相邻设置。一个放热部分在翅片中延伸并且设置在冷凝部分之间，从而允许从基座吸收的热量通过散热部分和冷凝部分均匀分布在整个翅片上。

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