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    • 82. 发明公开
    • 단차 평탄화를 위한 신규한 평탄제 및 이를 이용하는 구리전해 도금 방법
    • 用于水平和铜电沉积的新的水平使用它
    • KR1020070067813A
    • 2007-06-29
    • KR1020050129075
    • 2005-12-23
    • 주식회사 엘지화학
    • 김민균이상철고민진
    • C25D3/38
    • C25D3/38H01L21/2885
    • A leveling agent capable of performing superconformal deposition without fine defects on a trench with various aspect ratios and providing a flat copper thin film without a step height difference, a copper electroplating solution comprising the leveling agent, and a copper electroplating method using the copper electroplating solution are provided. A quarternary ammonium bromide leveling agent has an alcohol functional group used in copper electroplating. The leveling agent is benzyl-di-(3-hydroxypropyl)-methyl ammonium bromide. A copper electroplating solution comprises a quarternary ammonium bromide leveling agent having an alcohol functional group used in copper electroplating. The copper electroplating solution comprises: a basic copper electroplating solution including 40 g/L of copper(Cu), 10 g/L of sulfuric acid(H2SO4) and 50 ppm of chlorine ions(Cl^-); additives including 13.68 mg/L of bis(3-sulfopropyl)disulfide(SPS) as an accelerant and 2 ml/L of an Enthone VS solution as an inhibitor; and 20 mg/L of the prepared leveling agent. A copper electroplating method comprises performing an electrodeposition process using the copper electroplating solution comprising a quarternary ammonium bromide leveling agent having an alcohol functional group used in copper electroplating.
    • 一种能够在具有各种纵横比的沟槽上进行超合金沉积而没有精细缺陷的流平剂,并且提供不具有台阶高差的扁平铜薄膜,包含流平剂的铜电镀溶液和使用铜电镀溶液的铜电镀方法 被提供。 季铵溴化物流平剂具有用于电镀铜的醇官能团。 流平剂是苄基 - 二 - (3-羟丙基) - 甲基溴化铵。 铜电镀溶液包括具有用于铜电镀的醇官能团的季铵溴化物流平剂。 铜电镀溶液包括:铜(Cu)为40g / L,硫酸(H2SO4)为10g / L,氯离子为ClO2为50ppm的碱性铜电镀液。 作为促进剂的含有13.68mg / L的双(3-磺丙基)二硫化物(SPS)和2ml / L的Enthone VS溶液作为抑制剂的添加剂; 和20mg / L的制备的流平剂。 铜电镀方法包括使用包括具有用于铜电镀中的醇官能团的季铵溴化物流平剂的铜电镀溶液进行电沉积方法。