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    • 82. 发明授权
    • ESD clamp circuit applied to power amplifier
    • ESD钳位电路应用于功率放大器
    • US08169761B2
    • 2012-05-01
    • US12400799
    • 2009-03-10
    • Chih-Ting YehYung-Chih LiangShih-Hung Chen
    • Chih-Ting YehYung-Chih LiangShih-Hung Chen
    • H02H9/00
    • H03F1/523H01L27/0266H03F2200/441
    • An ESD clamp circuit applied to a power amplifier is provided. The ESD clamp circuit includes a first line, a second line, a first circuit, a second circuit, an ESD detecting unit, a buffer unit, and an ESD clamp unit. The first line is coupled to the output terminal of the power amplifier. The first circuit is coupled to the first line. The second circuit is coupled to the first circuit. The ESD detecting unit is coupled to the first circuit and the second line. The buffer unit is coupled to the second circuit, the second line and the ESD detecting unit. The ESD clamp unit is coupled to the buffer unit, the first line and the second line. Therefore, at normal operation mode, the problem of signal loss caused by the leakage current of ESD clamp circuit can be avoided.
    • 提供了应用于功率放大器的ESD钳位电路。 ESD钳位电路包括第一线,第二线,第一电路,第二电路,ESD检测单元,缓冲单元和ESD钳位单元。 第一行耦合到功率放大器的输出端。 第一电路耦合到第一线。 第二电路耦合到第一电路。 ESD检测单元耦合到第一电路和第二线。 缓冲单元耦合到第二电路,第二线路和ESD检测单元。 ESD钳位单元耦合到缓冲单元,第一线和第二线。 因此,在正常工作模式下,可以避免由ESD钳位电路的漏电流引起的信号损失问题。
    • 84. 发明授权
    • Initial-on SCR device for on-chip ESD protection
    • 初始化SCR器件,用于片上ESD保护
    • US08102001B2
    • 2012-01-24
    • US12891474
    • 2010-09-27
    • Ming-Dou KerShih-Hung ChenKun-Hsien Lin
    • Ming-Dou KerShih-Hung ChenKun-Hsien Lin
    • H01L23/62
    • H01L23/62H01L27/0262H01L2924/0002H01L2924/00
    • A semiconductor device for electrostatic discharge (ESD) protection includes a silicon controlled rectifier (SCR) including a semiconductor substrate, a first well formed in the substrate, a second well formed in the substrate, a first p-type region formed in the first well to serve as an anode, and a first n-type region partially formed in the second well to serve as a cathode, a p-type metal-oxide-semiconductor (PMOS) transistor formed in the first well including a gate, a first diffused region and a second diffused region separated apart from the first diffused region, a second n-type region formed in the first well electrically connected to the first diffused region of the PMOS transistor, and a second p-type region formed in the substrate electrically connected to the second diffused region of the PMOS transistor.
    • 一种用于静电放电(ESD)保护的半导体器件包括可控硅整流器(SCR),其包括半导体衬底,形成在衬底中的第一阱,形成在衬底中的第二阱,形成在第一阱中的第一p型区 用作阳极,以及部分地形成在第二阱中用作阴极的第一n型区域,形成在包括栅极的第一阱中的p型金属氧化物半导体(PMOS)晶体管,第一扩散层 区域和与第一扩散区域分离的第二扩散区域,形成在电连接到PMOS晶体管的第一扩散区域的第一阱中的第二n型区域和形成在衬底中的第二p型区域电连接 到PMOS晶体管的第二扩散区域。
    • 85. 发明授权
    • I-shaped phase change memory cell
    • I形相变存储单元
    • US07993962B2
    • 2011-08-09
    • US12614902
    • 2009-11-09
    • Shih-Hung ChenHsiang-Lan Lung
    • Shih-Hung ChenHsiang-Lan Lung
    • H01L21/06
    • H01L27/2436G11C13/0004H01L45/06H01L45/1233H01L45/1246H01L45/144H01L45/148H01L45/1666
    • A memory device includes two electrodes, vertically separated and having mutually opposed contact surfaces, between which lies a phase change cell. The phase change cell includes an upper phase change member, having a contact surface in electrical contact with the first electrode; a lower phase change member, having a contact surface in electrical contact with the second electrode; and a kernel member disposed between and in electrical contact with the upper and lower phase change members. The phase change cell is formed of material having at least two solid phases, and the lateral extent of the upper and lower phase change members is substantially greater than that of the kernel member. An intermediate insulating layer is disposed between the upper and lower phase change members adjacent to the kernel member.
    • 存储器件包括垂直分离并具有相互相对的接触表面的两个电极,它们位于相变单元之间。 相变单元包括上相变构件,具有与第一电极电接触的接触表面; 下部相变构件,具有与第二电极电接触的接触表面; 以及设置在上部和下部相变构件之间并与之电连接的内部构件。 相变单元由具有至少两个固相的材料形成,并且上下相变构件的横向范围基本上大于内核构件的横向范围。 中间绝缘层设置在与内核构件相邻的上下相变构件之间。
    • 86. 发明授权
    • I-shaped phase change memory cell with thermal isolation
    • 具有热隔离的I形相变存储单元
    • US07956358B2
    • 2011-06-07
    • US11348846
    • 2006-02-07
    • Shih Hung Chen
    • Shih Hung Chen
    • H01L47/00
    • H01L45/1233G11C11/5678G11C13/0004G11C2213/79H01L27/2436H01L45/06H01L45/1246H01L45/144H01L45/1666
    • A memory device includes two electrodes, vertically separated and having mutually opposed contact surfaces, between which lies a phase change cell. The phase change cell includes an upper phase change member, having a contact surface in electrical contact with the first electrode; a lower phase change member, having a contact surface in electrical contact with the second electrode; and a kernel member disposed between and in electrical contact with the upper and lower phase change members. The phase change cell is formed of material having at least two solid phases, and the lateral extent of the upper and lower phase change members is substantially greater than that of the kernel member. An intermediate insulating layer is disposed between the upper and lower phase change members adjacent to the kernel member.
    • 存储器件包括垂直分离并具有相互相对的接触表面的两个电极,它们位于相变单元之间。 相变单元包括上相变构件,具有与第一电极电接触的接触表面; 下部相变构件,具有与第二电极电接触的接触表面; 以及设置在上部和下部相变构件之间并与之电连接的内部构件。 相变单元由具有至少两个固相的材料形成,并且上下相变构件的横向范围基本上大于内核构件的横向范围。 中间绝缘层设置在与内核构件相邻的上下相变构件之间。
    • 88. 发明申请
    • ESD CLAMP CIRCUIT APPLIED TO POWER AMPLIFIER
    • ESD钳位电路适用于功率放大器
    • US20100149703A1
    • 2010-06-17
    • US12400799
    • 2009-03-10
    • Chih-Ting YehYung-Chih LiangShih-Hung Chen
    • Chih-Ting YehYung-Chih LiangShih-Hung Chen
    • H02H9/04
    • H03F1/523H01L27/0266H03F2200/441
    • An ESD clamp circuit applied to a power amplifier is provided. The ESD clamp circuit includes a first line, a second line, a first circuit, a second circuit, an ESD detecting unit, a buffer unit, and an ESD clamp unit. The first line is coupled to the output terminal of the power amplifier. The first circuit is coupled to the first line. The second circuit is coupled to the first circuit. The ESD detecting unit is coupled to the first circuit and the second line. The buffer unit is coupled to the second circuit, the second line and the ESD detecting unit. The ESD clamp unit is coupled to the buffer unit, the first line and the second line. Therefore, at normal operation mode, the problem of signal loss caused by the leakage current of ESD clamp circuit can be avoided.
    • 提供了应用于功率放大器的ESD钳位电路。 ESD钳位电路包括第一线,第二线,第一电路,第二电路,ESD检测单元,缓冲单元和ESD钳位单元。 第一行耦合到功率放大器的输出端。 第一电路耦合到第一线。 第二电路耦合到第一电路。 ESD检测单元耦合到第一电路和第二线。 缓冲单元耦合到第二电路,第二线路和ESD检测单元。 ESD钳位单元耦合到缓冲单元,第一线和第二线。 因此,在正常工作模式下,可以避免由ESD钳位电路的漏电流引起的信号损失问题。
    • 89. 发明授权
    • I-shaped phase change memory cell
    • I形相变存储单元
    • US07635855B2
    • 2009-12-22
    • US11348848
    • 2006-02-07
    • Shih Hung ChenHsiang Lan Lung
    • Shih Hung ChenHsiang Lan Lung
    • H01L47/00
    • H01L27/2436G11C13/0004H01L45/06H01L45/1233H01L45/1246H01L45/144H01L45/148H01L45/1666
    • A memory device includes two electrodes, vertically separated and having mutually opposed contact surfaces, between which lies a phase change cell. The phase change cell includes an upper phase change member, having a contact surface in electrical contact with the first electrode; a lower phase change member, having a contact surface in electrical contact with the second electrode; and a kernel member disposed between and in electrical contact with the upper and lower phase change members. The phase change cell is formed of material having at least two solid phases, and the lateral extent of the upper and lower phase change members is substantially greater than that of the kernel member. An intermediate insulating layer is disposed between the upper and lower phase change members adjacent to the kernel member.
    • 存储器件包括垂直分离并具有相互相对的接触表面的两个电极,它们位于相变单元之间。 相变单元包括上相变构件,具有与第一电极电接触的接触表面; 下部相变构件,具有与第二电极电接触的接触表面; 以及设置在上部和下部相变构件之间并与之电连接的内部构件。 相变单元由具有至少两个固相的材料形成,并且上下相变构件的横向范围基本上大于内核构件的横向范围。 中间绝缘层设置在与内核构件相邻的上下相变构件之间。
    • 90. 发明授权
    • Thin film fuse phase change cell with thermal isolation layer and manufacturing method
    • 薄膜保险丝相变电池与隔热层及制造方法
    • US07598512B2
    • 2009-10-06
    • US11466421
    • 2006-08-22
    • Shih Hung Chen
    • Shih Hung Chen
    • H01L47/00
    • H01L45/144G11C13/0004H01L27/2436H01L27/2463H01L45/06H01L45/1226H01L45/1293H01L45/148H01L45/1675
    • A memory device comprising a first electrode having a top side, a second electrode having a top side and an insulating member between the first electrode and the second electrode. The insulating member has a thickness between the first and second electrodes near the top side of the first electrode and the top side of the second electrode. A bridge of memory material crosses the insulating member, and defines an inter-electrode path between the first and second electrodes across the insulating member. An array of such memory cells is provided. The bridge comprises an active layer of memory material on the first side having at least two solid phases and a blanket of thermal insulating material overlying the memory material having thermal conductivity less than that of an overlying electrically insulating layer.
    • 一种存储器件,包括具有顶侧的第一电极,具有顶侧的第二电极和位于第一电极和第二电极之间的绝缘构件。 绝缘构件在第一电极的顶侧附近和第二电极的顶侧之间具有在第一和第二电极之间的厚度。 记忆材料桥跨越绝缘构件,并且在绝缘构件之间限定了第一和第二电极之间的电极间路径。 提供这样的存储单元阵列。 该桥包括在第一侧上具有至少两个固相的存储材料的有源层和覆盖存储材料的热绝缘材料的毯子,其热导率小于上覆电绝缘层的热导率。