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81. 发明授权

US08831073B2 Wireless transmission system, wireless communication device, and wireless communication method 有权
标题翻译：无线传输系统，无线通信设备和无线通信方式
公开(公告)号：US08831073B2
公开(公告)日：2014-09-09
申请号：US12805552
申请日：2010-08-05
申请人： Kenichi Kawasaki
发明人： Kenichi Kawasaki
IPC分类号： H04L7/00 , H04B1/40
CPC分类号： H04L27/04 , H04B1/40 , H04L27/122 , H04L27/20 , H04L27/365
摘要： A wireless transmission system includes: a communication unit for transmission; and a communication unit for reception. The communication units for transmission and reception are housed in a housing of the same electronic apparatus, or the communication unit for transmission is housed in a housing of first electronic apparatus and the communication unit for reception is housed in a housing of second electronic apparatus and a wireless signal transmission path enabling wireless information transmission between the communication units is formed between the communication units when the first and the second electronic apparatus are disposed at given positions to be integrated with each other. The communication unit for transmission includes a first carrier signal generating unit and a first frequency converter, and the communication unit for reception includes a second carrier signal generating unit, and a second frequency converter.
摘要翻译：无线传输系统包括：用于传输的通信单元; 以及用于接收的通信单元。用于发送和接收的通信单元被容纳在同一电子设备的壳体中，或者用于传输的通信单元容纳在第一电子设备的壳体中，并且用于接收的通信单元容纳在第二电子设备的壳体和当第一和第二电子设备被布置在彼此集成的给定位置时，在通信单元之间形成能够实现通信单元之间的无线信息传输的无线信号传输路径。用于传输的通信单元包括第一载波信号生成单元和第一频率转换器，并且用于接收的通信单元包括第二载波信号生成单元和第二频率转换器。

82. 发明授权

US08792640B2 Systems and methods for securing a digital communications link 有权
标题翻译：用于确保数字通信链路的系统和方法
公开(公告)号：US08792640B2
公开(公告)日：2014-07-29
申请号：US12021668
申请日：2008-01-29
申请人： Kenichi Kawasaki , Robert Hardacker
发明人： Kenichi Kawasaki , Robert Hardacker
IPC分类号： H04L29/06
CPC分类号： H04N19/85 , H04L25/08 , H04L27/0008 , H04N7/1675 , H04N21/2383 , H04N21/4382
摘要： A digital data signal, such as a digital video signal, is intentionally pre-distorted before being sent over a network. In one embodiment, this pre-distortion may be performed in accordance with a pre-distortion pattern or algorithm which is shared with only intended receivers. The pre-distortion pattern may be used to vary the pre-distortion on a periodic basis, as frequently as on a symbol-by-symbol basis. The pre-distortion function may include distorting the phase and/or the amplitude of the digital signal's modulation.
摘要翻译：诸如数字视频信号的数字数据信号在通过网络发送之前有意地被预先失真。在一个实施例中，该预失真可以根据仅与预期接收机共享的预失真模式或算法来执行。可以使用预失真模式来周期性地改变预失真，如在逐个符号的基础上那样频繁地进行。预失真功能可以包括使数字信号调制的相位和/或振幅失真。

83. 发明申请

US20130342244A1 SIGNAL PROCESSOR AND SIGNAL PROCESSING METHOD 有权
标题翻译：信号处理器和信号处理方法
公开(公告)号：US20130342244A1
公开(公告)日：2013-12-26
申请号：US13984974
申请日：2012-02-08
申请人： Kenichi Kawasaki
发明人： Kenichi Kawasaki
IPC分类号： H03D7/00
CPC分类号： H03D7/00 , H03F1/223 , H03F3/193 , H03F3/211 , H03F3/245 , H03F2200/111 , H04B1/06 , H04L27/26
摘要： A signal processor includes: a plurality of frequency converters which perform frequency conversion of input signals to output converted signals; and an output section which combines the converted signals output from the plurality of frequency converters and outputs a composite signal, wherein the plurality of frequency converters are formed in a one-chip semiconductor chip, and the plurality of frequency converters perform frequency conversion into converted signals in different frequency bands.
摘要翻译：信号处理器包括：多个频率转换器，其执行输入信号的频率转换以输出转换的信号; 以及输出部，其组合从所述多个变频器输出的转换后的信号，并输出复合信号，其中，所述多个变频器形成在单芯片半导体芯片中，并且所述多个频率转换器对变换后的信号进行频率转换在不同的频带。

84. 发明授权

US08471770B2 Antenna and a method of manufacturing 有权
标题翻译：天线和制造方法
公开(公告)号：US08471770B2
公开(公告)日：2013-06-25
申请号：US12938709
申请日：2010-11-03
申请人： Yugang Ma , Kenichi Kawasaki
发明人： Yugang Ma , Kenichi Kawasaki
IPC分类号： H01Q1/38
CPC分类号： H01Q19/005 , H01L2224/48091 , Y10T29/49018 , H01L2924/00014
摘要： A method of manufacturing an antenna comprising: providing a millimeter wave (MMW) antenna attached to a signal pad on an integrated circuit mounted on a substrate, and adjusting one or more parameters of the antenna to conform to predetermined desired thresholds, levels or ranges, wherein the adjustment is selected from the group consisting of: locating a conducting or dielectric object at a desired tuner location in proximity to the antenna to tune the central signal frequency, locating a conducting reflector at a desired reflector location in proximity to the antenna to tune the radiation direction or pattern, and selecting a conducting patch or object as a radiator/detector element to modify the bandwidth. Also a millimeter wave (MMW) antenna.
摘要翻译：一种制造天线的方法，包括：提供附接到安装在基板上的集成电路上的信号焊盘上的毫米波（MMW）天线，以及调整所述天线的一个或多个参数以符合预定的期望阈值，电平或范围，其中所述调整选自以下组：将导电或介电物体定位在靠近天线的所需调谐器位置处，以调谐中心信号频率，将导电反射器定位在靠近天线的所需反射器位置，以调谐辐射方向或图案，并且选择导电贴片或物体作为辐射器/检测器元件以修改带宽。还有一个毫米波（MMW）天线。

85. 发明授权

US08315036B2 Ceramic electronic component and method for manufacturing the same 有权
标题翻译：陶瓷电子元件及其制造方法
公开(公告)号：US08315036B2
公开(公告)日：2012-11-20
申请号：US12405399
申请日：2009-03-17
申请人： Makoto Ogawa , Akihiro Motoki , Junichi Saito , Shunsuke Takeuchi , Kenichi Kawasaki
发明人： Makoto Ogawa , Akihiro Motoki , Junichi Saito , Shunsuke Takeuchi , Kenichi Kawasaki
IPC分类号： H01G4/00
CPC分类号： H01G4/30 , H01G4/005 , H01G4/12 , H01G4/232 , Y10T29/435
摘要： A ceramic electronic component includes a ceramic body and a plurality of external electrodes disposed at a surface of the ceramic body. The external electrodes include a plating layer containing glass particles each coated with a metal film. The plating layer is formed by co-deposition of a plating metal and the metal-coated glass particles.
摘要翻译：陶瓷电子部件包括陶瓷体和设置在陶瓷体的表面的多个外部电极。外部电极包括含有各自涂覆有金属膜的玻璃颗粒的镀层。镀层通过电镀金属和金属涂覆的玻璃颗粒的共沉积形成。

86. 发明授权

US08213534B2 Transmission apparatus and communication system 失效
标题翻译：传输设备和通信系统
公开(公告)号：US08213534B2
公开(公告)日：2012-07-03
申请号：US12731425
申请日：2010-03-25
申请人： Shigenori Uchida , Norihito Mihota , Kenichi Kawasaki
发明人： Shigenori Uchida , Norihito Mihota , Kenichi Kawasaki
IPC分类号： H04L27/00
CPC分类号： H01P1/182 , H04L27/36
摘要： Disclosed herein is a transmission apparatus including a first transmission block configured to modulate a carrier-wave signal having a predetermined frequency on the basis of a first input signal, thereby outputting a first transmission signal; and a second transmission block configured to modulate a carrier-wave signal having a predetermined frequency on the basis of a second input signal, thereby outputting a second transmission signal; wherein a first input point for inputting the first transmission signal outputted from the first transmission block into a waveguide and a second input point for inputting the second transmission signal outputted from the second transmission block into the waveguide are shifted by a distance for providing a predetermined phase difference between the first transmission signal and the second transmission signal.
摘要翻译：这里公开了一种传输装置，包括：第一传输块，被配置为基于第一输入信号调制具有预定频率的载波信号，从而输出第一传输信号; 以及第二传输块，被配置为基于第二输入信号来调制具有预定频率的载波信号，从而输出第二传输信号; 其中用于将从第一传输块输出的第一传输信号输入波导的第一输入点和用于将从第二传输块输出的第二传输信号输入波导的第二输入点移位一定距离，以提供预定相位第一发送信号和第二发送信号之间的差。

87. 发明授权

US08194391B2 Multilayer ceramic electronic component and manufacturing method thereof 有权
标题翻译：多层陶瓷电子元件及其制造方法
公开(公告)号：US08194391B2
公开(公告)日：2012-06-05
申请号：US12340570
申请日：2008-12-19
申请人： Shunsuke Takeuchi , Kenichi Kawasaki , Akihiro Motoki , Makoto Ogawa , Shuji Matsumoto , Seiichi Nishihara
发明人： Shunsuke Takeuchi , Kenichi Kawasaki , Akihiro Motoki , Makoto Ogawa , Shuji Matsumoto , Seiichi Nishihara
IPC分类号： H01G4/20 , H01G4/06 , B05D5/12
CPC分类号： H01G4/12 , H01G4/005 , H01G4/232
摘要： A multilayer ceramic electronic component including thin external terminal electrodes each having a superior bonding force to a ceramic base body is provided. In order to form the external terminal electrodes, after Cu plating films are deposited on exposed portions of internal electrodes by direct plating on a ceramic base body, a Cu liquid phase, an O2-containing liquid phase, and a Cu solid phase are generated between the Cu plating film and the ceramic base body by a heat treatment, so that Cu oxides are dispersed in the Cu plating film, at least near an interface with the ceramic base body. Since the Cu oxides function as an adhesive, a bonding force of the Cu plating film to the ceramic base body can be increased, and hence the external terminal electrode having a superior bonding force to the ceramic base body can be obtained.
摘要翻译：提供了一种多层陶瓷电子部件，其包括对陶瓷基体具有优良的结合力的薄的外部端子电极。为了形成外部端子电极，通过在陶瓷基体上直接电镀将Cu电镀膜沉积在内部电极的露出部分上之后，会产生Cu液相，含O2液相和Cu固相， Cu镀膜和陶瓷基体进行热处理，使得Cu氧化物至少在陶瓷基体的界面附近分散在Cu镀膜中。由于Cu氧化物作为粘合剂发挥功能，所以可以提高Cu镀膜对陶瓷基体的结合力，因此能够获得与陶瓷基体的粘接力优异的外部端子电极。

88. 发明授权

US08193855B2 Semiconductor device and power control method used for same 有权
标题翻译：半导体器件和功率控制方法相同
公开(公告)号：US08193855B2
公开(公告)日：2012-06-05
申请号：US12893056
申请日：2010-09-29
申请人： Kenichi Kawasaki
发明人： Kenichi Kawasaki
IPC分类号： G05F1/10
CPC分类号： H02J1/10 , H02H9/005
摘要： A semiconductor device includes an internal circuit; a plurality of power switches arranged in parallel configured to supply a current to the internal circuit; an instruction circuit configured to output a instruction signal for controlling power supply to the internal circuit; a variation detection circuit configured to detect the current and to output a detection result; and a logic circuit configured to control a timing when the plurality of power switches becomes a conducting state in accordance with the detection result and the instruction signal.
摘要翻译：半导体器件包括内部电路; 并联配置的多个电源开关，用于向内部电路提供电流; 指令电路，被配置为输出用于控制对所述内部电路的电力供给的指令信号; 变化检测电路，被配置为检测电流并输出检测结果; 以及逻辑电路，被配置为根据检测结果和指示信号来控制多个电源开关变为导通状态的定时。

89. 发明授权

US08149566B2 Laminated electronic component and manufacturing method therefor 有权
标题翻译：层压电子部件及其制造方法
公开(公告)号：US08149566B2
公开(公告)日：2012-04-03
申请号：US12781058
申请日：2010-05-17
申请人： Akihiro Motoki , Makoto Ogawa , Kenichi Kawasaki , Shunsuke Takeuchi
发明人： Akihiro Motoki , Makoto Ogawa , Kenichi Kawasaki , Shunsuke Takeuchi
IPC分类号： H01G4/008
CPC分类号： H01G4/30 , H01G4/232 , H01G4/2325
摘要： A method for manufacturing a laminated electronic component includes the steps of preparing a component main body having a laminated structure, the component main body including a plurality of internal electrodes formed therein, and each of the internal electrodes being partially exposed on an external surface of the component main body, and forming an external terminal electrode on the external surface of the component main body such that the external terminal electrode is electrically connected to the internal electrodes. The step of forming the external terminal electrode includes the steps of forming a first plating layer on exposed surfaces of the internal electrodes of the component main body, applying a water repellant at least on a surface of the first plating layer and on a section in the external surface of the component main body at which an end edge of the first plating layer is located, and then forming a second plating layer on the first plating layer having the water repellant applied thereon.
摘要翻译：层叠电子部件的制造方法包括以下步骤：制备具有层叠结构的部件主体，所述部件主体包括形成在其中的多个内部电极，所述内部电极部分地露出在所述内部电极的外表面上并且在所述部件主体的外表面上形成外部端子电极，使得所述外部端子电极与所述内部电极电连接。形成外部端子电极的步骤包括以下步骤：在组件主体的内部电极的暴露的表面上形成第一镀层，至少在第一镀层的表面上以及在第一镀层的表面上施加防水剂在第一镀层的端边缘所在的部件主体的外表面，然后在其上施加有防水剂的第一镀层上形成第二镀层。

90. 发明授权

US08139342B2 Laminated electronic component and method for manufacturing the same 有权
标题翻译：层压电子部件及其制造方法
公开(公告)号：US08139342B2
公开(公告)日：2012-03-20
申请号：US12466393
申请日：2009-05-15
申请人： Shunsuke Takeuchi , Kenichi Kawasaki , Akihiro Motoki , Makoto Ogawa , Toshiyuki Iwanaga
发明人： Shunsuke Takeuchi , Kenichi Kawasaki , Akihiro Motoki , Makoto Ogawa , Toshiyuki Iwanaga
IPC分类号： H01G4/228
CPC分类号： H01G4/008 , H01G4/005 , H01G4/2325 , Y10T29/417 , Y10T29/43 , Y10T29/435
摘要： A laminated electronic component is configured to include substrate plating films disposed on outer surfaces of an electronic component main body through direct plating such that external terminal electrodes are connected to exposed portions of internal conductors (internal electrodes), and the average particle diameter of metal particles defining the substrate plating film is at least about 1.0 μm. The external terminal electrode includes at least one layer of an upper plating film disposed on the substrate plating film. The metal particles defining the substrate plating film are Cu particles.
摘要翻译：层叠电子部件被配置为包括通过直接电镀设置在电子部件主体的外表面上的基板镀膜，使得外部端子电极与内部导体（内部电极）的露出部分连接，金属粒子的平均粒径限定衬底镀膜至少约1.0μm。外部端子电极包括设置在基板镀膜上的至少一层上镀层。限定衬底镀膜的金属颗粒是Cu颗粒。

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