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    • 88. 发明申请
    • Method for forming a fine pattern in a semiconductor
    • 在半导体中形成精细图案的方法
    • US20080166661A1
    • 2008-07-10
    • US11804674
    • 2007-05-18
    • Jae Chang Jung
    • Jae Chang Jung
    • H01L21/02G03C1/04G03C5/00
    • H01L21/0274G03F7/0397H01L21/0338
    • A method for forming a fine pattern in a semiconductor device includes the steps of: coating a first photoresist composition over a semiconductor substrate including an underlying layer, thereby forming a first photoresist film; exposing and developing the first photoresist film, thereby forming a first photoresist pattern; forming a second photoresist film that does not react with the first photoresist pattern over the resulting structure; and exposing and developing the second photoresist film, thereby forming a second photoresist pattern; wherein the first and second photoresist patterns each comprise a plurality of elements, and individual elements of the second photoresist pattern are located between adjacent individual elements of the first photoresist pattern.
    • 在半导体器件中形成微细图案的方法包括以下步骤:在包括下层的半导体衬底上涂覆第一光致抗蚀剂组合物,由此形成第一光致抗蚀剂膜; 曝光和显影第一光致抗蚀剂膜,从而形成第一光致抗蚀剂图案; 在所得结构上形成不与第一光致抗蚀剂图案反应的第二光致抗蚀剂膜; 曝光和显影第二光致抗蚀剂膜,从而形成第二光致抗蚀剂图案; 其中所述第一和第二光致抗蚀剂图案各自包括多个元件,并且所述第二光致抗蚀剂图案的各个元件位于所述第一光致抗蚀剂图案的相邻单独元件之间。