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81. 发明申请

US20120118235A1 FILM COATING DEVICE 审中-公开
标题翻译：电影涂装装置
公开(公告)号：US20120118235A1
公开(公告)日：2012-05-17
申请号：US12981566
申请日：2010-12-30
申请人： CHUNG-PEI WANG
发明人： CHUNG-PEI WANG
IPC分类号： C23C16/458 , C23C16/455
CPC分类号： C23C14/042 , C23C14/505 , C23C16/042 , C23C16/4584
摘要： A film coating device includes a film coating holder, a film coating cover, and a filter plate. The film coating holder includes a number of through holes defined therein for receiving workpieces to be coated. The film coating cover covers the film coating holder from a top side of the film coating holder. The filter plate is mounted on a bottom of the film coating holder, and defines a number of filter holes for letting vaporized coating material through and blocking impurities.
摘要翻译：薄膜涂布装置包括薄膜涂覆保持器，薄膜涂覆盖和过滤板。薄膜涂覆保持器包括限定在其中的多个通孔，用于接收待涂覆的工件。薄膜涂覆盖从薄膜涂覆保持器的顶侧覆盖薄膜涂覆保持器。过滤板安装在薄膜涂层保持器的底部，并且限定了许多过滤孔，用于使汽化的涂料通过并阻挡杂质。

82. 发明申请

US20120097106A1 PHYSICAL VAPOR DEPOSITION DEVICE FOR COATING WORKPIECE 审中-公开
标题翻译：用于涂装工作的物理蒸气沉积装置
公开(公告)号：US20120097106A1
公开(公告)日：2012-04-26
申请号：US13037126
申请日：2011-02-28
申请人： CHUNG-PEI WANG
发明人： CHUNG-PEI WANG
IPC分类号： C23C16/458
CPC分类号： C23C14/3407 , C23C14/3464 , C23C14/505 , H01J37/3417 , H01J37/3423
摘要： A physical vapor deposition device includes a deposition chamber, a workpiece carrier received in the deposition chamber, at least one cylindrical inner target, and a plurality of cylindrical outer targets. The workpiece carrier is rotatable about a rotation axis thereof. The workpiece carrier includes an inner carrier, and an outer carrier surrounding and being fixed relative to the inner carrier. The inner target is located at a central area of the inner carrier. The outer targets surround the outer carrier.
摘要翻译：物理气相沉积装置包括沉积室，容纳在沉积室中的工件载体，至少一个圆柱形内部靶和多个圆柱形外部靶。工件托架可绕其旋转轴线旋转。工件载体包括内部载体和围绕相对于内部载体固定的外部载体。内部靶位于内部载体的中心区域。外部目标围绕外部载体。

83. 发明申请

US20120097103A1 PHYSICAL VAPOR DEPOSITION DEVICE FOR COATING WORKPIECE 审中-公开
标题翻译：用于涂装工作的物理蒸气沉积装置
公开(公告)号：US20120097103A1
公开(公告)日：2012-04-26
申请号：US13037129
申请日：2011-02-28
申请人： CHUNG-PEI WANG
发明人： CHUNG-PEI WANG
IPC分类号： C23C16/458
CPC分类号： C23C14/3464 , C23C14/505 , H01J37/32715 , H01L21/6719
摘要： A physical vapor deposition device includes a deposition chamber, a workpiece carrier received in the deposition chamber, a plurality of plate-shaped inner targets, and a plurality of plate-shaped outer targets. The workpiece carrier rotates about a rotation axis thereof. The workpiece carrier includes an inner carrier, and an outer carrier fixed relative to the inner carrier. The outer carrier surround the inner carrier. The inner targets are arranged between the inner carrier and the outer carrier. The outer targets surround the outer carrier.
摘要翻译：物理气相沉积装置包括沉积室，容纳在沉积室中的工件载体，多个板状内部靶和多个板状外部靶。工件托架绕其旋转轴线旋转。工件载体包括内部载体和相对于内部载体固定的外部载体。外部载体围绕内部载体。内部目标设置在内部载体和外部载体之间。外部目标围绕外部载体。

84. 发明申请

US20120090541A1 WORKPIECE CARRIER AND DEPOSITION DEVICE HAVING SAME 审中-公开
标题翻译：具有相同功能的工作载体和沉积装置
公开(公告)号：US20120090541A1
公开(公告)日：2012-04-19
申请号：US13015586
申请日：2011-01-28
申请人： CHUNG-PEI WANG
发明人： CHUNG-PEI WANG
IPC分类号： B05C13/00 , B23Q1/40 , B23Q3/00
CPC分类号： C23C14/505 , B05B13/0242 , B05B13/0285
摘要： A workpiece carrier includes a first carrier and a second carrier. The first carrier includes a plurality of first posts substantially parallel to each other. Each of the first posts is rotatable about a central axis thereof. The second carrier includes a plurality of second posts substantially parallel to each other. Each of the second posts is rotatable about a central axis thereof. The first carrier surrounds the second carrier therein. The workpiece carrier further includes at least one connecting arm interconnected between the first carrier and the second carrier, such that the first carrier and the second carrier are jointly rotatable about a rotation axis.
摘要翻译：工件载体包括第一载体和第二载体。第一载体包括基本上彼此平行的多个第一柱。每个第一柱可围绕其中心轴线旋转。第二载体包括基本上彼此平行的多个第二柱。每个第二柱可围绕其中心轴线旋转。第一载体围绕第二载体。所述工件载体还包括互连在所述第一载体和所述第二载体之间的至少一个连接臂，使得所述第一载体和所述第二载体可围绕旋转轴线共同旋转。

85. 发明申请

US20120073963A1 SPUTTERING APPARATUS HAVING SHIELDING DEVICE 审中-公开
标题翻译：具有屏蔽装置的溅射装置
公开(公告)号：US20120073963A1
公开(公告)日：2012-03-29
申请号：US12944748
申请日：2010-11-12
申请人： CHUNG-PEI WANG
发明人： CHUNG-PEI WANG
IPC分类号： C23C14/04 , C23C14/35
CPC分类号： C23C14/568 , C23C14/564
摘要： An exemplary sputtering apparatus includes a deposition chamber, a anode support, a cathode support, and a shield device all received in the deposition chamber. The anode support supports workpieces. The cathode support is positioned opposite to the anode support and supports a target. The shield includes a rotary disk, a first arm, a second arm, a first shield plate and a second shield plate. The first and second arms are securely mounted to the rotary disk along the radial direction of the rotary disk. A radial extending direction of the first arm from the rotary disk is opposite to that of the second arm. The first shield plate is securely mounted to the first arm, and the second shield plate securely mounted to the second arm. The rotary disk rotates the first and second shield plates to selectively expose or shield the target.
摘要翻译：示例性的溅射装置包括全部接收在沉积室中的沉积室，阳极支撑件，阴极支撑件和屏蔽装置。阳极支撑件支撑工件。阴极支撑件与阳极支撑件相对定位并且支撑目标。屏蔽包括旋转盘，第一臂，第二臂，第一屏蔽板和第二屏蔽板。第一臂和第二臂沿着旋转盘的径向牢固地安装到旋转盘。第一臂从旋转盘的径向延伸方向与第二臂的径向延伸方向相反。第一屏蔽板牢固地安装到第一臂上，第二屏蔽板牢固地安装到第二臂上。旋转盘旋转第一和第二屏蔽板以选择性地暴露或屏蔽目标。

86. 发明申请

US20120034381A1 METHOD FOR FORMING A PATTERNED COATING 审中-公开
标题翻译：形成图案涂料的方法
公开(公告)号：US20120034381A1
公开(公告)日：2012-02-09
申请号：US12915062
申请日：2010-10-29
申请人： CHUNG-PEI WANG
发明人： CHUNG-PEI WANG
IPC分类号： B05D1/32
CPC分类号： B05D1/322 , B05B12/20
摘要： A method for forming a coating on a plate-shaped workpiece is disclosed. In the method, a plate-shaped workpiece and a masking fixture are provided. The workpiece includes a surface including a coating region and a pattern region. The masking fixture includes a resilient liquid masking applicator having a groove. An outline shape of the groove conforms to the pattern region. The groove is filled with liquid masking material. The workpiece is pressed onto the liquid masking applicator with the pattern region aligned with the groove. The liquid masking material is solidified thereby the solidified liquid masking material is attached to the pattern region of the workpiece. A coating is formed on the coating region. The solidified liquid masking material is removed from the workpiece.
摘要翻译：公开了一种在板状工件上形成涂层的方法。在该方法中，设置有板状工件和掩模固定装置。工件包括包括涂覆区域和图案区域的表面。掩模夹具包括具有凹槽的弹性液体掩模施加器。凹槽的轮廓形状符合图案区域。槽被液体掩蔽材料填充。工件被压到液体掩模施加器上，图案区域与凹槽对准。液体掩蔽材料固化，固化的液体掩模材料附着到工件的图案区域。在涂层区域上形成涂层。将固化的液体掩模材料从工件中取出。

87. 发明申请

US20110278164A1 SPUTTERING DEVICE 审中-公开
标题翻译：喷射装置
公开(公告)号：US20110278164A1
公开(公告)日：2011-11-17
申请号：US12860916
申请日：2010-08-22
申请人： CHUNG-PEI WANG
发明人： CHUNG-PEI WANG
IPC分类号： C23C14/34
CPC分类号： C23C14/0063 , C23C14/505 , H01J37/3244 , H01J37/3411 , H01J37/3417 , H01J37/3435
摘要： A sputtering device includes a chamber having a number of targets mounted therein, a supporting frame, and a gas supplying frame. The chamber defines an engaging hole and a gas input hole therein. The supporting frame is capable of having a revolution in the chamber, the supporting frame includes a number of supporting poles for supporting workpieces, and the supporting poles is capable of having a rotation relative to the supporting frame. The gas supplying frame is received in the supporting frame, the gas supplying frame includes a gas input pipe engaging in and extending through the engaging hole of the chamber, and a number of gas guiding pipes are in communication with the gas input pipe and are substantially parallel with the supporting poles. Each of the gas guiding pipes has a number of gas output holes around the workpieces.
摘要翻译：溅射装置包括其中安装有多个靶的腔室，支撑框架和气体供应框架。该室在其中限定了一个接合孔和一个气体输入孔。支撑框架能够在腔室中具有旋转，支撑框架包括用于支撑工件的多个支撑杆，并且支撑杆能够相对于支撑框架具有旋转。气体供给框架容纳在支撑框架中，气体供给框架包括接合并延伸通过室的接合孔的气体输入管，并且多个气体导管与气体输入管连通，并且基本上与支撑杆平行。每个气体导向管在工件周围具有多个气体输出孔。

88. 发明申请

US20110266144A1 SPUTTERING APPARATUS 审中-公开
标题翻译：溅射装置
公开(公告)号：US20110266144A1
公开(公告)日：2011-11-03
申请号：US12910844
申请日：2010-10-24
申请人： CHUNG-PEI WANG
发明人： CHUNG-PEI WANG
IPC分类号： C23C14/50 , C23C14/34
CPC分类号： C23C14/505 , C23C14/02 , C23C14/56 , H01J37/34
摘要： A sputtering apparatus for coating workpieces includes a preheating case defining a preheating cavity, a deposition case defining a deposition cavity, a bridge assembly connecting the preheating case to the deposition case, two supporting assemblies, posts for fixing the workpieces, and a transmission assembly positioned in the preheating case. The bridge assembly includes a bridge member defining a passage and a valve moveably connected to the bridge member. The valve communicates the preheating cavity with the deposition cavity through the passage or separates the preheating cavity from the deposition cavity. One supporting assembly is received in the preheating cavity, and the other supporting assembly is received in the deposition cavity. The transmission assembly removes the posts from one of the supporting assemblies and fixes the posts to the other supporting assembly.
摘要翻译：用于涂覆工件的溅射装置包括限定预热腔的预热壳体，限定沉积腔的沉积壳体，将预热壳体连接到沉积壳体的桥接组件，两个支撑组件，用于固定工件的柱以及定位的传动组件在预热箱中。桥组件包括限定通道的桥构件和可移动地连接到桥构件的阀。阀通过通道将预热腔与沉积腔连通，或将预热腔与沉积腔分离。一个支撑组件被容纳在预热腔中，另一个支撑组件被容纳在沉积腔中。传动组件从支撑组件中的一个移除柱，并将柱固定到另一支撑组件。

89. 发明申请

US20110266143A1 SPUTTERING SYSTEM 审中-公开
标题翻译：喷射系统
公开(公告)号：US20110266143A1
公开(公告)日：2011-11-03
申请号：US12857503
申请日：2010-08-16
申请人： CHUNG-PEI WANG
发明人： CHUNG-PEI WANG
IPC分类号： C23C14/34 , C23C14/35
CPC分类号： C23C14/568
摘要： A sputtering system includes at least two treatment chambers, at least two antechambers, a gas withdrawal device, a placement device, a removal device, and a transport device. The antechambers and the treatment chambers are connected to each other alternatively to form a loop. Each of the treatment chambers includes arcing sources received therein. The arcing sources are configured for carrying target materials and ionizing the target materials by electronic arc. The gas withdrawal device is configured for vacuuming the treatment chambers and the antechambers. When working, the placement device places workpieces into the loop, the transport device transports the workpieces in the loop for undergoing continuously sputtering, the removal device removes the workpieces from the loop after the sputtering process is finished.
摘要翻译：溅射系统包括至少两个处理室，至少两个前室，抽气装置，放置装置，去除装置和输送装置。前室和处理室彼此连接以形成环路。每个处理室包括容纳在其中的电弧源。电弧源被配置为承载目标材料并通过电弧电离目标材料。气体取出装置构造成用于对处理室和前室进行抽真空。工作时，放置装置将工件放置在回路中，输送装置将工件输送到循环中以进行连续溅射，在溅射过程完成后，去除装置将工件从环中移除。

90. 发明申请

US20110056830A1 SPUTTERING DEPOSITION APPARATUS 审中-公开
标题翻译：溅射沉积装置
公开(公告)号：US20110056830A1
公开(公告)日：2011-03-10
申请号：US12766904
申请日：2010-04-25
申请人： Chung-Pei Wang , Chia-Ying Wu
发明人： Chung-Pei Wang , Chia-Ying Wu
IPC分类号： C23C14/34
CPC分类号： C23C14/3464 , C23C14/505 , C23C14/568 , H01J37/185 , H01J37/34 , H01J2237/184
摘要： A sputtering type deposition apparatus includes a chamber device and a target. The chamber device defines an access chamber, a first entrance from exterior to the access chamber, a depositing chamber, and a second entrance from the access chamber to the depositing chamber. The chamber device includes an access door, a separating door, and a carrier. The access door is disposed at the first entrance and configured to open or close the first entrance. The separating door is disposed at the second entrance and configured to open or close the second entrance. The carrier is disposed in the access chamber and configured to carry a substrate from the access chamber to the depositing chamber. The target is received in the depositing chamber.
摘要翻译：溅射型沉积装置包括室装置和靶。腔室装置限定进入腔室，从外部到进入腔室的第一入口，沉积室以及从进入腔室到沉积室的第二入口。腔室装置包括进入门，分离门和托架。检修门设置在第一入口处并构造成打开或关闭第一入口。分离门设置在第二入口处并且构造成打开或关闭第二入口。载体设置在进入室中并且构造成将基板从进入室运送到沉积室。目标被接收在存放室中。

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