专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

81. 发明授权

US11871575B2 Electronic devices including pillars in array regions and non-array regions 有权
公开(公告)号：US11871575B2
公开(公告)日：2024-01-09
申请号：US17806829
申请日：2022-06-14
申请人： Micron Technology, Inc.
发明人： S M Istiaque Hossain , Christopher J. Larsen , Anilkumar Chandolu , Wesley O. McKinsey , Tom J. John , Arun Kumar Dhayalan , Prakash Rau Mokhna Rau
IPC分类号： H10B43/35 , H10B41/27 , H10B41/35 , H10B43/20
CPC分类号： H10B43/35 , H10B41/27 , H10B41/35 , H10B43/20
摘要： An electronic device comprising a lower deck and an upper deck adjacent to a source. Each of the lower deck and the upper deck comprise tiers of alternating conductive materials and dielectric materials. Each of the lower deck and the upper deck also comprise an array region and one or more non-array regions. Memory pillars are in the lower deck and the upper deck of the array region and the memory pillars are configured to be operably coupled to the source. Dummy pillars are in the upper deck of the one or more non-array regions and the dummy pillars are configured to be electrically isolated from the source. Another conductive material is in the upper deck and the lower deck of the one or more non-array regions. Additional electronic devices and related systems and methods of forming an electronic device are also disclosed.

82. 发明授权

US11869862B2 Microelectronic components including metal pillars secured to bond pads, and related methods, assemblies, and systems 有权
公开(公告)号：US11869862B2
公开(公告)日：2024-01-09
申请号：US17653610
申请日：2022-03-04
申请人： Micron Technology, Inc.
发明人： Shams U. Arifeen , Christopher Glancey , Koustav Sinha
IPC分类号： H01L23/00
CPC分类号： H01L24/13 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/81 , H01L2924/01028 , H01L2924/01029 , H01L2924/01079 , H01L2924/1434
摘要： A microelectronic component comprises a substrate having at least one bond pad on a surface thereof and a metal pillar structure on the at least one bond pad, the metal pillar structure comprising a metal pillar on the at least one bond pad and a solder material having a portion within a reservoir within the metal pillar and another portion protruding from an end of the metal pillar opposite the at least one bond pad. Methods for forming the metal pillar structures, metal pillar structures, assemblies and systems incorporating the metal pillar structures are also disclosed.

83. 发明授权

US11863120B2 Solar arrays and related vehicles and assemblies 有权
公开(公告)号：US11863120B2
公开(公告)日：2024-01-02
申请号：US17931068
申请日：2022-09-09
申请人： Northrop Grumman Systems Corporation
发明人： Michael I. Eskenazi , Michael Edward McEachen , Christopher Peterson
IPC分类号： H02S30/20 , H02S30/10
CPC分类号： H02S30/20 , H02S30/10
摘要： A solar array may include a first rigid composite solar panel including solar cells secured to a first substrate. The solar array may further include a second rigid composite solar panel including solar cells secured to a second substrate. The solar array may also include solar panel modules including solar cells secured to a flexible sheet of material. The solar panel modules may be coupled between the first composite solar panel and the second composite solar panel. The solar array may be configured to be retained in a stowed arrangement with the solar panel modules between the first rigid composite solar panel and the second rigid composite solar panel. The solar array further configured to be extended with an extendable arm until each of the first rigid composite solar panel, the second rigid composite solar panel and the solar panel modules are arranged in a substantially straight line.

84. 发明授权

US11860022B2 Capacitive sensing utilizing a differential value indication 有权
公开(公告)号：US11860022B2
公开(公告)日：2024-01-02
申请号：US17336068
申请日：2021-06-01
申请人： Microchip Technology Incorporated
发明人： Lorenzo Bellina , Maurizio Fiammeni
IPC分类号： G01F23/26 , G01F23/263 , G01D5/24
CPC分类号： G01F23/263 , G01D5/2405
摘要： One or more examples relate to a detector. A signal that the detector is configured to sense is a differential value. Such a differential value may be indicative of a difference in self-capacitance indications that are exhibited at first and second internal capacitors. Such a differential value may be proportional to a relationship between a first material and a second material present at a device-under-test coupled to electrodes of the detector. Such a differential value may be proportional to a vertical elevation of a surface of a material present at a device-under-test coupled to electrodes of the detector. A difference in coupling capacitances may be obtained by performing complimentary acquisition processes utilizing symmetric capacitive sensors. When the acquisition processes are performed substantially simultaneously, coupling error indications that may be present in the self-capacitance indications are not present in the differential value.

85. 发明授权

US11855120B2 Substrate for a front-side-type image sensor and method for producing such a substrate 有权
公开(公告)号：US11855120B2
公开(公告)日：2023-12-26
申请号：US17649982
申请日：2022-02-04
申请人： Soitec
发明人： Walter Schwarzenbach , Oleg Kononchuk , Ludovic Ecarnot , Christelle Michau
IPC分类号： H01L27/146 , H01L21/762
CPC分类号： H01L27/14685 , H01L21/76254 , H01L27/14625
摘要： A substrate for a front-side type image sensor includes a supporting semiconductor substrate, an electrically insulating layer, and a silicon-germanium semiconductor layer, known as the active layer. The electrically insulating layer includes a stack of dielectric and metallic layers selected such that the reflectivity of the stack in a wavelength range of between 700 nm and 3 μm is greater than the reflectivity of a silicon oxide layer having a thickness equal to that of the stack. The substrate also comprises a silicon layer between the electrically insulating layer and the silicon-germanium active layer. The disclosure also relates to a method for the production of such a substrate.

86. 发明授权

US11852269B2 Device for connecting tubular elements 有权
公开(公告)号：US11852269B2
公开(公告)日：2023-12-26
申请号：US17272185
申请日：2019-08-14
申请人： A. RAYMOND ET CIE
发明人： Matthieu David , Olivier Bizzini , Sébastien Hamitouche
IPC分类号： F16L3/237 , F16B7/04
CPC分类号： F16L3/237 , F16B7/0433 , F16B7/0493
摘要： A device for connecting tubular elements, comprises a first body provided with a first reception housing for accommodating a longitudinal portion of a first tubular element and provided with a first connection component; a second body provided with a second reception housing for accommodating a longitudinal portion of a second tubular element and provided with a second connection component, the second body being formed by two half-shells each comprising a portion of the second housing and a portion of the second connection component; the first and the second connection component being configured to keep the first and second bodies assembled, while allowing a rotation movement between them along a transverse axis. The first and second body, respectively, have a first and a second face with a circular profile, the first and second connection component respectively, being disposed on the periphery of the first and second face with a circular profile.

87. 发明授权

US11849910B2 Methods, systems, and devices for heart valve decalcification, regeneration, and repair 有权
公开(公告)号：US11849910B2
公开(公告)日：2023-12-26
申请号：US16842683
申请日：2020-04-07
申请人： VALVUBLATOR INC.
发明人： Howard J. Leonhardt , Brett M. Burton , Kapil K. Sharma , Betty Vowles
IPC分类号： A61B17/22 , A61F2/24
CPC分类号： A61B17/2202 , A61F2/2409 , A61F2/2412 , A61B2017/22079 , A61B2017/22098 , A61B2217/007
摘要： Methods of heart valve decalcification may include mechanically removing calcium deposits on a heart valve, and removing debris from the mechanical decalcification via suction. The mechanical removal of the calcium deposits may be accomplished with a burr and/or an ultrasonic device. In some embodiments, mechanical removal of the calcium deposits may be accomplished with a handheld mechanical decalcification device comprising a bur extending from a hand piece. A catheter system for removing plaque deposits from a heart valve may include at least one mechanical decalcification device configured for cleaning the edges of heart valve leaflets, and at least one active aspiration device. The at least one mechanical decalcification device may comprise a bur and/or an ultrasonic device. The system may additionally include a deployable net apparatus configured to encompass at least a portion of a heart valve.

88. 外观设计

USD1007959S1 Pan bottom 有权
公开(公告)号：USD1007959S1
公开(公告)日：2023-12-19
申请号：US29824285
申请日：2022-01-24
申请人： Lamb Weston, Inc.
设计人： Casey Bettendorf , Celso S. Martinez
摘要： FIG. 1 is an isometric view of a pan bottom.
FIG. 2 is another isometric view of the pan bottom of FIG. 1.
FIG. 3 is a top plan view of the pan bottom of FIG. 1.
FIG. 4 is a bottom plan view of the pan bottom of FIG. 1.
FIG. 5 is a front elevation view of the pan bottom of FIG. 1.
FIG. 6 is a rear elevation view of the pan bottom of FIG. 1.
FIG. 7 is a left side elevation view of the pan bottom of FIG. 1.
FIG. 8 is a right side elevation view of the pan bottom of FIG. 1.
FIG. 9 is an isometric view of the pan bottom of FIG. 1; and,
FIG. 10 is another isometric view of the pan bottom of FIG. 1.
Portions of FIGS. 1 through 10 are shown in evenly spaced broken lines illustrating portions of the article that form no part of the claimed design, and phantom lines illustrating environmental subject matter including a pan top that form no part of the claimed design.

89. 外观设计

USD1007950S1 Cutter for food products 有权
公开(公告)号：USD1007950S1
公开(公告)日：2023-12-19
申请号：US29818557
申请日：2021-12-09
申请人： Lamb Weston, Inc.
设计人： Samuel Monk , Tayler Wonders
摘要： FIG. 1 is an isometric view of a cutter for food products.
FIG. 2 is a top plan view of the cutter for food products of FIG. 1.
FIG. 3 is a bottom view of the cutter for food products of FIG. 1.
FIG. 4 is a front elevation view of the cutter for food products of FIG. 1.
FIG. 5 is a rear elevation view of the cutter for food products of FIG. 1.
FIG. 6 is a left side elevation view of the cutter for food products for FIG. 1; and,
FIG. 7 is a right side elevation view of the cutter for food products of FIG. 1.
Portions of FIGS. 1 through 7 are shown in dash broken lines and dash-dot-dash broken lines. The dash broken lines show portions of the article and form no part of the claimed design. The dash-dot-dash broken lines show boundary and form no part of the claimed design.

90. 发明授权

US11848427B2 Non-linear voltammetry-based method for charging a battery and fast charging system implementing this method 有权
公开(公告)号：US11848427B2
公开(公告)日：2023-12-19
申请号：US16770568
申请日：2018-12-07
申请人： Yazami IP PTE. LTD.
发明人： Rachid Yazami , Thannehene Gedara Thusitha Asela Bandara
IPC分类号： H02J7/00 , H01M10/44
CPC分类号： H01M10/44 , H02J7/007 , H02J7/0071 , H02J7/00718 , H02J7/007182 , H02J7/007184 , H02J7/007194 , H02J7/005 , H02J7/0048 , H02J7/00712
摘要： A Non-Linear Voltammetry (NLV)-based method for charging batteries. It also relates to a fast charging system implementing this method. Adaptive charging, Non-Linear Voltage changing, and Relaxation are the key cornerstones of this method. Adaptive charging allows the system to balance the charging based on the user's time requirements, required charge capacity and the SOC and SOH of the battery. Non-linearly changing the voltage coupled with a suitable relaxation pattern allows this method to gain the maximum charge capacity without straining the battery.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式