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    • 82. 发明公开
    • Method for fabricating printed circuits
    • 韦尔法罕zur Herstellung von gedruckten Schaltungen。
    • EP0475567A2
    • 1992-03-18
    • EP91306486.1
    • 1991-07-17
    • MACDERMID INCORPORATED
    • Bengston, Jon E.Larson, Gary B.
    • H05K1/09
    • H05K3/244Y10T29/4921
    • Conductive copper areas of printed circuits, such as through-holes, pads and lands, to which electronic components can thereafter be electrically connected by, e.g., wave soldering, are provided with a coating of nickel or cobalt, such as by electroless deposition from nickel- or cobalt-boron and nickel-or cobalt-phosphorous plating baths, or entirely or partly electrolytically, followed by a coating of a protective material which protects the nickel or cobalt coating from oxidation prior to the subsequent solder connection operation, is wettable by solder in the subsequent solder connection operation, and substantially dissolves in the solder in the subsequent solder connection operation without adverse effect on the solder joint between the electronic component and the through-hole, pad or land. A particular preferred protective material is gold, such as applied by deposition from immersion or electroless gold plating baths. The invention renders the so-treated areas readily susceptible to the soldering of components thereat, thereby avoiding the need for hot air solder levelling.
    • 诸如通孔,焊盘和焊盘的印刷电路的导电铜区域,其中电子部件之后可以通过例如波峰焊接电连接,提供有镍或钴的涂层,例如通过镍的无电沉积 - 或钴 - 硼和镍 - 或钴 - 磷电镀浴,或完全或部分电解,然后涂覆保护材料,保护镍或钴涂层在随后的焊接连接操作之前免受氧化,可被焊料润湿 在随后的焊接连接操作中,并且在随后的焊接连接操作中基本上溶解在焊料中,而不会对电子部件和通孔,焊盘或焊盘之间的焊接接头产生不利影响。 特别优选的保护材料是金,例如通过从浸没或无电镀金浴沉积而施加的。 本发明使如此处理的区域易于在其上焊接部件,从而避免了热空气焊料平整的需要。