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81. 发明申请

US20120055916A1 METHOD AND SYSTEM FOR THERMAL TREATMENT OF SUBSTRATES 审中-公开
标题翻译：基板热处理方法及系统
公开(公告)号：US20120055916A1
公开(公告)日：2012-03-08
申请号：US13036915
申请日：2011-02-28
申请人： Leon Volfovski , Harald Herchen , Jay D. Pinson
发明人： Leon Volfovski , Harald Herchen , Jay D. Pinson
IPC分类号： H05B3/68 , H05B1/00
CPC分类号： H05B3/68
摘要： A rapid temperature change (RTC) system includes a bake plate assembly including a heat spreader; a heater substrate coupled to the heat spreader; and a heater layer coupled to the heater substrate. The RTC system also includes a passive chill structure positioned adjacent the bake plate assembly. The passive chill structure is moveable to make physical contact with the heater layer. The passive chill structure includes a chill plate and a thermal pad coupled to the chill plate. The RTC system further includes an active chill structure positioned adjacent the passive chill structure. The passive chill structure is moveable to make physical contact with the active chill structure.
摘要翻译：快速温度变化（RTC）系统包括包括散热器的烘烤板组件; 联接到散热器的加热器基板; 以及耦合到所述加热器基板的加热器层。 RTC系统还包括邻近烘烤板组件定位的被动冷却结构。被动冷却结构可移动以与加热器层物理接触。被动冷却结构包括冷却板和耦合到冷却板的散热垫。 RTC系统还包括邻近被动冷却结构定位的主动冷却结构。被动冷却结构可移动以与主动冷却结构物理接触。

82. 发明授权

US08122851B2 Temperature measurement in a substrate processing apparatus 有权
标题翻译：基板处理装置中的温度测量
公开(公告)号：US08122851B2
公开(公告)日：2012-02-28
申请号：US12267267
申请日：2008-11-07
申请人： Tetsuya Hamada
发明人： Tetsuya Hamada
IPC分类号： B05C5/02
CPC分类号： H01L21/67248 , H01L21/67051 , H01L21/67178 , H01L21/67184
摘要： A substrate processing apparatus is configured to provide in series a plurality of processing blocks, each block including a processing unit and a transport robot transporting a substrate. A substrate rest is provided in a connecting portion of adjacent processing blocks. A sensor plate with sensor coils is provided spanning over support pins of the substrate rest. Once a temperature-measurement substrate with temperature-measuring elements, each element formed by connecting a coil to a quartz resonator, is placed on the support pins, a transmitter-receiver transmits transmission waves corresponding to the characteristic frequencies of the quartz resonators to the temperature-measuring elements through the sensor coils. After the stop of the transmission, the transmitter-receiver receives electromagnetic waves from the temperature-measuring elements through the sensor coils, and the temperature computer computes the substrate temperature based on the frequencies of the electromagnetic waves.
摘要翻译：基板处理装置被构造为串联提供多个处理块，每个块包括处理单元和传送基板的传送机器人。在相邻的处理块的连接部分中提供衬底。具有传感器线圈的传感器板被提供跨越衬底的支撑销。一旦具有温度测量元件的温度测量基板，通过将线圈连接到石英谐振器形成的每个元件被放置在支撑引脚上，发射器 - 接收器将对应于石英谐振器的特征频率的传输波传输到温度 - 通过传感器线圈测量元件。在传输停止之后，发射机 - 接收机通过传感器线圈接收来自温度测量元件的电磁波，温度计算机基于电磁波的频率来计算衬底温度。

83. 发明授权

US08015985B2 Substrate processing apparatus and substrate processing method using the same 有权
标题翻译：基板处理装置及其基板处理方法
公开(公告)号：US08015985B2
公开(公告)日：2011-09-13
申请号：US12349356
申请日：2009-01-06
申请人： Tetsuya Hamada , Koji Nishiyama
发明人： Tetsuya Hamada , Koji Nishiyama
IPC分类号： B08B3/00
CPC分类号： H01L21/67051 , H01L21/67178 , H01L21/67225
摘要： A fluid supply pipe is inserted through a motor supporting member, a spin motor, a rotating shaft, and a plate supporting member. A first flange is integrally formed in the vicinity of a curved portion of a straight portion, extending in the vertical direction, of the fluid supply pipe. The first flange is fixed to a motor supporting member. Thus, the fluid supply pipe is fixed to the spin motor through the motor supporting member. The fluid supply pipe has a configuration in which a gas supply pipe made of resin and a plurality of cleaning liquid supply pipes made of resin are accommodated inside a guide pipe made of stainless. Inside the guide pipe, the one gas supply pipe is surrounded by the plurality of cleaning liquid supply pipes.
摘要翻译：流体供给管插入电动机支撑部件，旋转电动机，旋转轴和板支撑部件。第一凸缘一体地形成在流体供给管的沿垂直方向延伸的直线部分的弯曲部分附近。第一凸缘固定到电动机支撑构件。因此，流体供给管通过马达支撑构件固定到旋转马达。流体供给管具有将由树脂制成的供气管和由树脂制成的多个清洗液供给管容纳在由不锈钢构成的导管内的结构。在导管的内部，一个供气管被多个清洗液供给管包围。

84. 发明申请

US20100151690A1 MULTI-CHANNEL DEVELOPER SYSTEM 有权
标题翻译：多通道开发系统
公开(公告)号：US20100151690A1
公开(公告)日：2010-06-17
申请号：US12334156
申请日：2008-12-12
申请人： Eric B. Britcher , Yevgeniy Rabinovich , Svetlana Sherman , Masami Otani
发明人： Eric B. Britcher , Yevgeniy Rabinovich , Svetlana Sherman , Masami Otani
IPC分类号： H01L21/30 , C23F1/00 , B05B15/02 , B05C5/00
CPC分类号： H01L21/6719 , G03F7/162 , H01L21/67051 , H01L21/68771 , Y10T29/41
摘要： An apparatus for dispensing fluid during semiconductor substrate processing operations comprises an enclosure having a first side and a second side. The enclosure comprises a first processing station and a second processing station. The second processing station is positioned adjacent to the first processing station. In addition, the substrate processing apparatus includes a first dispense arm configured to deliver a fluid to the first processing station wherein the first dispense arm is positioned between the first side and the first processing station and a second dispense arm configured to deliver the fluid to the second processing station wherein the second dispense arm is positioned between the second side and the second processing station. The substrate processing apparatus also comprises a first rinse arm configured to deliver a rinsing fluid to the first processing station and a second rinse arm configured to deliver the rinsing fluid to the second processing station.
摘要翻译：在半导体衬底处理操作期间用于分配流体的设备包括具有第一侧和第二侧的外壳。外壳包括第一处理站和第二处理站。第二处理站位于第一处理站附近。此外，基板处理装置包括：第一分配臂，被配置为将流体输送到第一处理站，其中第一分配臂位于第一侧和第一处理站之间，第二分配臂被配置为将流体输送到第二处理站，其中第二分配臂位于第二侧和第二处理站之间。衬底处理设备还包括构造成将冲洗流体输送到第一处理站的第一冲洗臂和被构造成将冲洗流体输送到第二处理站的第二冲洗臂。

85. 发明申请

US20100136492A1 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD 有权
标题翻译：基板处理装置和基板处理方法
公开(公告)号：US20100136492A1
公开(公告)日：2010-06-03
申请号：US12698870
申请日：2010-02-02
申请人： Shuichi Yasuda , Masashi Kanaoka , Koji Kaneyama , Tadashi Miyagi , Kazuhito Shigemori , Toru Asano , Yukio Toriyama , Takashi Taguchi , Tsuyoshi Mitsuhashi , Tsuyoshi Okumura
发明人： Shuichi Yasuda , Masashi Kanaoka , Koji Kaneyama , Tadashi Miyagi , Kazuhito Shigemori , Toru Asano , Yukio Toriyama , Takashi Taguchi , Tsuyoshi Mitsuhashi , Tsuyoshi Okumura
IPC分类号： G03F7/20
CPC分类号： G03F7/70991 , G03F7/70341
摘要： A method of processing a substrate in a substrate processing apparatus that is arranged adjacent to an exposure device and includes first, second and third processing units, includes the steps of: forming a photosensitive film made of a photosensitive material on the substrate by said first processing unit before exposure processing by said exposure device. The method also includes applying washing processing to the substrate by said second processing unit after the formation of said photosensitive film by said first processing unit and before the exposure processing by said exposure device and transporting the substrate after the washing processing to said exposure device. The method further includes transporting the substrate from said exposure device and applying development processing by said third processing unit to the substrate transported after the exposure processing by said exposure device.
摘要翻译：一种在与曝光装置相邻并且包括第一，第二和第三处理单元的基板处理装置中处理基板的方法，包括以下步骤：通过所述第一处理在基板上形成由感光材料制成的感光膜所述曝光装置进行曝光处理之前的单元。该方法还包括在由所述第一处理单元形成所述感光膜之后并且在所述曝光装置进行曝光处理之前，通过所述第二处理单元对所述基板进行洗涤处理，并将所述基板在所述清洗处理之后传送到所述曝光装置。所述方法还包括从所述曝光装置运送所述基板并将所述第三处理单元的显影处理应用于由所述曝光装置进行曝光处理之后运送的所述基板。

86. 发明授权

US07699021B2 Cluster tool substrate throughput optimization 有权
标题翻译：集群工具基板吞吐量优化
公开(公告)号：US07699021B2
公开(公告)日：2010-04-20
申请号：US11344565
申请日：2006-01-30
申请人： Leon Volfovski , Tetsuya Ishikawa
发明人： Leon Volfovski , Tetsuya Ishikawa
IPC分类号： B05C13/02 , C23C14/00 , H01L21/677
CPC分类号： H01L21/67742 , G03B27/32 , G03D13/006 , G03F7/40 , H01L21/67109 , H01L21/6715 , H01L21/67161 , H01L21/67173 , H01L21/67178 , H01L21/67184 , H01L21/6719 , H01L21/67225 , H01L21/67745 , H01L21/67748 , H01L21/6831 , H01L21/6838 , H01L22/26 , Y10S414/135 , Y10S414/136
摘要： Embodiments generally provide an apparatus and method for processing substrates using a multi-chamber processing system (e.g., a cluster tool) that has an increased system throughput, increased system reliability, substrates processed in the cluster tool have a more repeatable wafer history. In one embodiment, non-orthogonal robot trajectories are used to assure reliable and high speed substrate transfer. In another embodiment, at least one buffering station is used to avoid collision and improve throughput. In another embodiment, optimal positioning of the robots are used to improve throughput.
摘要翻译：实施例通常提供使用具有增加的系统吞吐量，增加的系统可靠性的多腔室处理系统（例如，集群工具）来处理衬底的装置和方法，在群集工具中处理的衬底具有更可重复的晶片历史。在一个实施例中，使用非正交的机器人轨迹来确保可靠和高速的衬底传送。在另一个实施例中，使用至少一个缓冲站来避免冲突并提高吞吐量。在另一个实施例中，使用机器人的最佳定位来提高吞吐量。

87. 发明申请

US20090179366A1 APPARATUS FOR SUPPORTING A SUBSTRATE DURING SEMICONDUCTOR PROCESSING OPERATIONS 审中-公开
标题翻译：用于在半导体加工操作期间支撑基板的装置
公开(公告)号：US20090179366A1
公开(公告)日：2009-07-16
申请号：US12015060
申请日：2008-01-16
申请人： Harald Herchen , Kim Vellore , Erica Renee Porras
发明人： Harald Herchen , Kim Vellore , Erica Renee Porras
IPC分类号： B25B11/00
CPC分类号： H01L21/68735 , H01L21/67126 , H01L21/6875
摘要： An apparatus for supporting a substrate during semiconductor processing includes a substrate support structure having a first surface, a second surface opposing the first surface, and a groove recessed into the first surface and defining a peripheral portion of the substrate support structure. The substrate support structure is substantially free of guide pins. The apparatus also includes an annular sealing member coupled to the groove and a plurality of proximity pins projecting to a first height above the first surface. The apparatus further includes a plurality of purge ports passing from the second surface to the first surface, a plurality of vacuum ports passing from the second surface to the first surface, and a heating mechanism coupled to the substrate support structure.
摘要翻译：一种用于在半导体处理期间支撑衬底的装置包括具有第一表面，与第一表面相对的第二表面的衬底支撑结构以及凹入第一表面并限定衬底支撑结构的周边部分的凹槽。衬底支撑结构基本上没有引导销。该装置还包括联接到凹槽的环形密封构件和突出到第一表面上方的第一高度的多个接近销。所述设备还包括从所述第二表面到所述第一表面通过的多个清洗端口，从所述第二表面到所述第一表面通过的多个真空端口，以及联接到所述基板支撑结构的加热机构。

88. 发明申请

US20090139833A1 MULTI-LINE SUBSTRATE TREATING APPARATUS 审中-公开
标题翻译：多线基板处理设备
公开(公告)号：US20090139833A1
公开(公告)日：2009-06-04
申请号：US12324788
申请日：2008-11-26
申请人： Hiroyuki Ogura , Tsuyoshi Mitsuhashi , Yoshiteru Fukutomi , Kenya Morinishi , Yasuo Kawamatsu , Hiromichi Nagashima
发明人： Hiroyuki Ogura , Tsuyoshi Mitsuhashi , Yoshiteru Fukutomi , Kenya Morinishi , Yasuo Kawamatsu , Hiromichi Nagashima
IPC分类号： B65G43/08
CPC分类号： H01L21/67178 , H01L21/6715 , H01L21/67173 , H01L21/67276 , H01L21/67742
摘要： A substrate treating apparatus includes substrate treatment lines arranged one over another, each for treating substrates while transporting the substrates substantially horizontally. The apparatus further includes an interface section for transporting the substrates between the substrate treatment lines and an exposing machine having a plurality of exposing stages, the exposing machine being provided separately from the apparatus, and a controller for controlling transport of the substrates in the interface section to cause all the substrates similarly treated in each of the substrate treatment lines to be exposed on one of the exposing stages. This apparatus can uniform the quality of treatment among a plurality of substrates receiving the same type of treatment in the same substrate treating line.
摘要翻译：基板处理装置包括彼此重叠布置的基板处理线，每个基板处理线基本上水平地输送基板，用于处理基板。该装置还包括用于在基板处理线之间输送基板的接口部分和具有多个曝光台的曝光机，所述曝光机与所述装置分开设置，以及用于控制所述基板在所述界面部分中的传送的控制器使得在每个基板处理线中类似地处理的所有基板在一个曝光阶段上暴露。该装置可以在同一基板处理线中接收相同类型处理的多个基板之间使处理质量均匀。

89. 发明申请

US20090139450A1 MULTI-STORY SUBSTRATE TREATING APPARATUS WITH FLEXIBLE TRANSPORT MECHANISMS 有权
标题翻译：具有灵活运输机制的多层底板处理设备
公开(公告)号：US20090139450A1
公开(公告)日：2009-06-04
申请号：US12324802
申请日：2008-11-26
申请人： Hiroyuki Ogura , Tsuyoshi Mitsuhashi , Yoshiteru Fukutomi , Kenya Morinishi , Yasuo Kawamatsu , Hiromichi Nagashima
发明人： Hiroyuki Ogura , Tsuyoshi Mitsuhashi , Yoshiteru Fukutomi , Kenya Morinishi , Yasuo Kawamatsu , Hiromichi Nagashima
IPC分类号： B05C11/00
CPC分类号： B05C13/00 , B05C9/12 , B05C11/08 , B05C13/02 , C23C14/568 , G03F7/16 , H01L21/67173 , H01L21/67178 , H01L21/67276 , H01L21/67703 , H01L21/67742 , H01L21/67745 , Y10S414/135
摘要： A treating section includes a plurality of treating blocks juxtaposed horizontally. Each treating block is vertically divided into stories. Each story includes treating units and a main transport mechanism. Substrates are transportable between the same stories of the treating blocks. Further, the substrates are transportable between different stories. Thus, the apparatus can transport the substrates flexibly between the treating blocks.
摘要翻译：处理部包括水平并列的多个处理块。每个处理块垂直分为故事。每个故事包括处理单位和主要运输机制。底物可在治疗块的相同故事之间运输。此外，基材可在不同的故事之间运输。因此，该装置可以在处理块之间灵活地输送基板。

90. 发明申请

US20090109595A1 METHOD AND SYSTEM FOR PERFORMING ELECTROSTATIC CHUCK CLAMPING IN TRACK LITHOGRAPHY TOOLS 审中-公开
标题翻译：轨道切割工具中静电切割夹具的方法和系统
公开(公告)号：US20090109595A1
公开(公告)日：2009-04-30
申请号：US11933152
申请日：2007-10-31
申请人： Harald Herchen , Kim Vellore , Brian C. Lue
发明人： Harald Herchen , Kim Vellore , Brian C. Lue
IPC分类号： H01L21/683
CPC分类号： H01L21/6831
摘要： A method of clamping/declamping a semiconductor wafer on an electrostatic chuck in ambient air includes disposing the semiconductor wafer at a predetermined distance above a dielectric surface of the electrostatic chuck having one or more electrodes and applying a first voltage greater than a predetermined threshold to the one or more electrodes of the electrostatic chuck for a first time period. The method includes reducing the first voltage to a second voltage substantially equal to a self bias potential of the semiconductor wafer after the first time period. The method includes maintaining the second voltage for a second time period and adjusting the second voltage to a third voltage characterized by a polarity opposite to that of the first voltage and a magnitude smaller than the predetermined threshold. The method includes reducing the third voltage to a fourth voltage substantially equal to the second voltage after a third time period.
摘要翻译：在环境空气中将静电卡盘上的半导体晶片夹紧/放大的方法包括将半导体晶片设置在具有一个或多个电极的静电卡盘的电介质表面之上的预定距离处，并将大于预定阈值的第一电压施加到静电卡盘的一个或多个电极第一时间段。该方法包括在第一时间段之后将第一电压降低到基本上等于半导体晶片的自偏压电位的第二电压。该方法包括将第二电压维持第二时间段，并将第二电压调整到第三电压，其特征在于具有与第一电压相反的极性和小于预定阈值的幅度。该方法包括在第三时间段之后将第三电压降低到基本上等于第二电压的第四电压。

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