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    • 78. 发明授权
    • Composite material and process for manufacturing same
    • 复合材料及其制造方法相同
    • US06221795B1
    • 2001-04-24
    • US08954199
    • 1997-10-20
    • Siegfried SikorskiMichael SchoberReinhold Schönacher
    • Siegfried SikorskiMichael SchoberReinhold Schönacher
    • B32B1502
    • B32B5/26B29C70/025B29C70/64B32B5/024B32B5/22B32B2260/021B32B2262/103Y10T442/112Y10T442/131Y10T442/3382Y10T442/339Y10T442/3463Y10T442/655Y10T442/658
    • The invention relates to a composite material having a substrate, which contains at least one fiber layer, and a cover layer, which adjoins the substrate and which, at least adjacent to the at least one fiber layer, contains metallic fibers and/or threads. The at least one fiber layer of the substrate and the metallic fibers and/or threads of the cover layer being saturated with binder and, as a result, the substrate and the cover layer are formed together or connected. Metallic, ceramic or glass-type particles are embedded in the cover layer in the area of the metallic fibers and/or threads. Preferably, the particles may be one or more or a combination of TiC, TiN, TiAl, Fe, steel, Ni, Si, metal alloys, diamond, or glass. In addition, the invention provides a process for manufacturing a composite material and articles of manufacture comprising the composite material, especially for rotor blades or propellers. The composite material and products comprising it display improved abrasion and erosion resistance and are protected from electrical damages.
    • 本发明涉及一种复合材料,其具有包含至少一个纤维层的基底和覆盖层,所述覆盖层邻接所述基底,并且至少邻近所述至少一个纤维层包含金属纤维和/或线。 衬底的至少一个纤维层和覆盖层的金属纤维和/或螺纹被粘合剂饱和,结果,基底和覆盖层形成在一起或连接。 金属,陶瓷或玻璃型颗粒被嵌入在金属纤维和/或螺纹区域的覆盖层中。 优选地,颗粒可以是TiC,TiN,TiAl,Fe,钢,Ni,Si,金属合金,金刚石或玻璃中的一种或多种或组合。 此外,本发明提供了一种制造复合材料和制品的方法,其包括复合材料,特别是用于转子叶片或螺旋桨。 包含它的复合材料和产品显示出改进的耐磨损和抗腐蚀性,并且防止电损坏。
    • 79. 发明授权
    • Product for producing viaholes in reinforced laminates and the related
method for manufacturing viaholes
    • 用于在增强层压板中生产通孔的产品和用于制造通孔的相关方法
    • US6020049A
    • 2000-02-01
    • US982714
    • 1997-12-02
    • Anthony J Cucinotta
    • Anthony J Cucinotta
    • B32B15/08B32B15/20H05K1/03H05K3/00H05K3/42B32B3/00G03C3/00H01R9/09
    • H05K3/0023B32B15/08B32B15/20H05K1/0366H05K3/422H05K2201/029Y10S428/901Y10T428/24917Y10T442/131Y10T442/138Y10T442/152
    • A reinforced laminate that is consists of conventional glass mesh, TEFLON mesh, etc. with copper clad to one or both sides and a positive or negative acting photoimageable dielectric material impregnated in the mesh. This photoimageable dielectric material is a substitute for conventional dielectrics like epoxy, polyimides, etc. This laminate construction will allow for via formation using established manufacturing methods for producing vias in printed circuits with minor process variations. This product will eliminate major process steps such as mechanical drilling, laser drilling and plasma etching. It will allow most printed circuit producers the capability of producing complex multilayer circuits that currently produced by relatively few circuit manufacturers. It eliminates processes such as plasma etching and laser processing and other capital-intensive methods that are currently in development or use. A further development as a result of this product allows for producing vias of any shape e.g. square holes, elliptical holes, slots, etc. It also results in certain designs for producing solid metal vias e.g. copper posts, which have higher conductivity and superior mechanical properties.
    • 一种增强层压板,由常规的玻璃网,TEFLON网等组成,铜包覆到一侧或两侧,以及浸渍在网中的正或负作用的可光成像的介电材料。 这种可光成像的介电材料是诸如环氧树脂,聚酰亚胺等的常规电介质的替代物。该层压结构将允许使用已建立的用于在具有小的工艺变化的印刷电​​路中制造通孔的制造方法的通孔形成。 该产品将消除主要的工艺步骤,如机械钻孔,激光钻孔和等离子体蚀刻。 这将允许大多数印刷电路制造商生产目前由相对较少的电路制造商生产的复杂多层电路的能力。 它消除了诸如等离子体蚀刻和激光加工的过程以及目前正在开发或使用的其他资本密集型方法。 作为该产品的结果的进一步发展允许生产任何形状的通孔,例如 方孔,椭圆孔,槽等。它还产生用于生产固体金属通孔的某些设计,例如, 铜柱具有较高的导电性和优异的机械性能。