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    • 80. 发明授权
    • Process for producing electronic parts
    • 电子零件生产工艺
    • US06015523A
    • 2000-01-18
    • US993020
    • 1997-12-18
    • Tetsuo Yumoto
    • Tetsuo Yumoto
    • B29C45/16B29C45/44H05K3/00H05K3/18B29C33/52B29C59/00
    • B29C45/4457B29C45/16H05K3/0014B29C2045/169B29C2045/4464B29K2105/0079H05K2201/0187H05K2201/09118H05K2203/0769H05K2203/1476H05K3/182Y10S264/44
    • An electronic part, which has a complicated internal configuration and has a movable part rotatably and movably accommodated therein, is integrally molded without dividing the configuration into a plurality of sections to carry out a number of molding operations for separate sections of the electronic part, thereby reducing the cost and enhancing the quality of the electronic part. The manufacturing process comprises producing a core for the injection molding by the injection molding of a polyvinyl alcohol-based resin containing an oxyalkylene group, producing a second stage product, which has the core inserted therein so as to be partly exposed, by the injection molding of a metallization-grade aromatic polyester liquid crystalline polymer, which contains a catalyst, producing a third stage product so that the second stage product is partly exposed by the injection molding of a nonmetallization-grade aromatic polyester liquid crystalline polymer, immersing the third stage product in hot water so that the core is dissolved in hot water, etching the surface of the circuit pattern forming area, which is exposed on the surface and is made from the metallization-grade polymer, and then metallizing the etched surface so that an electrically conductive circuit is formed thereon. In the above-described process, the movable part is embedded in the core.
    • 具有复杂的内部构造并且具有可旋转和可移动地容纳在其中的可动部件的电子部件被一体地模制而不将构造分成多个部分,以对电子部件的分离部分进行多个模制操作,从而 降低成本,提高电子部件的质量。 该制造方法包括通过注塑成型含有氧化烯基的聚乙烯醇类树脂来制造用于注射成型的芯,通过注射成型制造具有插入其中以使其部分露出的芯的第二阶段产品 的金属化级芳族聚酯液晶聚合物,其含有催化剂,制备第三级产品,使得第二级产品通过非金属化级芳族聚酯液晶聚合物的注射成型部分暴露,将第三级产品 在热水中使芯体溶解在热水中,蚀刻暴露在表面上并由金属化级聚合物制成的电路图案形成区域的表面,然后对蚀刻表面进行金属化,使得导电 电路形成在其上。 在上述处理中,可动部嵌入在芯体中。