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    • 71. 发明申请
    • METHOD FOR PRODUCING SUBSTRATES FOR SUPERCONDUCTING LAYERS
    • 用于生产超级层的基板的方法
    • US20160276067A1
    • 2016-09-22
    • US15034146
    • 2014-11-20
    • DANMARKS TEKNISKE UNIVERSITET
    • Anders Christian Wulff
    • H01B12/10H01L39/04H01L39/12H01B12/06C25D3/12C25D5/14C25D5/40C25D5/48C25D5/02C25D5/12C25D3/38C25F3/02H01B13/00H01B13/008H01L39/24
    • H01B12/10C25D3/12C25D3/38C25D5/022C25D5/12C25D5/14C25D5/40C25D5/48C25F3/02H01B12/06H01B13/0009H01B13/008H01L39/04H01L39/126H01L39/143H01L39/2454H01L39/248
    • There is provided a method for producing a substrate suitable for supporting an elongated superconducting element, wherein one or more elongated strips of masking material are placed on a solid element (202) so as to form one or more exposed elongated areas being delimited on one or two sides by elongated strip of masking material, and placing filling material on the solid element so that each exposed elongated area within the one or more exposed elongated areas is covered by a portion of filling material (318a-c) where each portion of filling material also covers at least a portion of the adjacent elongated strip of masking material and subsequently removing the one or more elongated strips of masking material so as to form one or more corresponding undercut volumes, where each undercut volume within the one or more undercut volumes is formed along a portion of filling material and between the portion of filling material and the solid element. The method may further comprise placing buffer material (640) and or superconducting material (642, 644, 646)) on the substrate, so as to provide a superconducting structure (601) with reduced AC losses.
    • 提供了一种用于制造适合于支撑细长超导元件的基底的方法,其中一个或多个细长的掩模材料条被放置在固体元件(202)上,以便形成一个或多个暴露的细长区域, 两边通过细长的掩蔽材料带,并且将填充材料放置在固体元件上,使得一个或多个暴露的细长区域内的每个暴露的细长区域被填充材料(318a-c)的一部分覆盖,其中填充材料的每一部分 还覆盖相邻细长条带的至少一部分掩模材料,随后移除一个或多个细长的掩模材料条,以便形成一个或多个相应的底切体积,其中形成一个或多个底切体积内的每个底切体积 沿着填充材料的一部分和填充材料的部分和固体元件之间。 该方法还可以包括将缓冲材料(640)和/或超导材料(642,644,646)放置在衬底上,以便提供具有减小的AC损耗的超导结构(601)。
    • 75. 发明授权
    • Mounting structure for semiconductor device
    • 半导体器件的安装结构
    • US06323426B1
    • 2001-11-27
    • US09222313
    • 1998-12-29
    • Hiroki HoshizakiMasashi Fuse
    • Hiroki HoshizakiMasashi Fuse
    • H01D1200
    • H01P1/20372H01L39/04
    • A mounting structure for a high temperature superconductor device, such as a filter, housed in a closed vacuum chamber and operated at a low temperature. The filter has dielectric substrate having: first and second surfaces; a circuit portion made of a superconducting thin film formed on the first surface of the dielectric substrate; and a ground layer consisting of a superconducting thin film formed on second surface of the dielectric substrate and a metal film deposited on the superconducting thin film. The mounting structure comprises: a device holder for holding the filter thereon; a conductive layer intervening between the ground layer of the filter and the device holder; urging parts for resiliently urging the filter toward the device holder. The conductive layer is made of a metal selected from among the group consisting of gold, silver, copper, aluminum and an alloy made of at least one of gold, silver, copper, and aluminum. The mounting structure can securely ground the ground layer of the filter enough to have an extremely low contact resistance as well as can have the amount of the released gas restricted.
    • 用于高温超导体器件(例如过滤器)的安装结构,其容纳在密闭的真空室中并在低温下操作。 该滤波器具有电介质基片,其具有:第一和第二表面; 形成在所述电介质基板的所述第一表面上的由超导薄膜构成的电路部分; 以及由形成在电介质基板的第二表面上的超导薄膜和沉积在超导薄膜上的金属膜组成的接地层。 安装结构包括:用于在其上保持过滤器的装置保持器; 介于过滤器的接地层和器件保持器之间的导电层; 推动部件用于将过滤器弹性地推向装置保持器。 导电层由选自金,银,铜,铝的金属和由金,银,铜和铝中的至少一种制成的合金制成。安装结构可以牢固地将接地层 过滤器足够具有极低的接触电阻以及可以限制释放气体的量。