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71. 发明公开

EP0660360A2 Method of providing a pattern of apertures and/or cavities in a plate or layer of non-metallic material 失效
标题翻译：一种用于制造在非金属板或层中的开口和/或坑模式的方法。
公开(公告)号：EP0660360A2
公开(公告)日：1995-06-28
申请号：EP94203600.5
申请日：1994-12-12
申请人： PHILIPS ELECTRONICS N.V.
发明人： Dings, Jacobus Maria , Horne, Remko , van Veen, Gerardus Nicolaas Anne , Bosman, Joseph Cornelis Marie
IPC分类号： H01J9/14 , H01J17/49 , B24C1/04 , B24C3/32
CPC分类号： H01J9/148 , B24C1/04 , B24C3/322 , H01J9/242 , H01J2217/49207 , H01J2329/863
摘要： After a plate or layer of non-metallic, particularly hard and brittle material has been provided with a (metal) mask having a plurality of apertures arranged in a pattern, it is exposed to at least one jet of abrasive powder particles, which jet is moved relative to the plate. The mask has its surface facing the surface on which the jet impinges secured to the plate or layer of non-metallic material by means of a layer of adhesive material having a thickness which is smaller than the size of the abrasive powder particles.
摘要翻译：板或非金属，特别是硬而脆的材料的层之后，已经设置有具有孔径的成图案排列的多个A（金属）掩模，其暴露于磨料粉粒中的至少一个喷嘴，其中喷射是移动相对于板。该掩模具有其面向其上喷射撞击由厚度全部比该磨料粉粒的尺寸粘合剂材料的层的方式固定到板或非金属材料的层的表面的表面。

72. 发明公开

EP0562670A1 Method of manufacturing a plate of electrically insulating material having a pattern of apertures and/or cavities 失效
标题翻译：制造具有孔或腔的用于Wiedergbeanordungen使用的图案的电绝缘材料制成的板的方法。
公开(公告)号：EP0562670A1
公开(公告)日：1993-09-29
申请号：EP93200757.8
申请日：1993-03-16
申请人： Philips Electronics N.V.
发明人： De Haas, Franciscus Cupertinus Maria , Van Laarhoven, Franicscus Martinus Henricus , Van Beek, Johannes Gerardus
IPC分类号： H01J9/14 , H01J17/49 , B24C1/04 , B24C3/32
CPC分类号： H01J9/148 , B24C1/04 , B24C3/322 , B24C11/00 , H01J17/49 , H01J31/124 , H01J2329/8625 , H05K1/0306 , H05K3/0044
摘要： After a plate of electrically insulating, particularly hard and brittle material (28) has been provided with a mask (30) having a very large number of patterned apertures, it is exposed to at least one jet of abrasive powder particles, which jet is moved relative to the plate. In this way a plate is manufactured with a pattern of apertures and/or cavities which are eminently suitable for manipulating electron currents in electronic displays. Plates manufactured in this way may be used, for example as control plates, spacer plates, or electron transport duct plates in electronic displays.
摘要翻译：电的绝缘，特别是硬质板和脆性材料（28）之后，已经提供用掩模（30），其具有非常大数量的图案化光圈的，它暴露于磨料粉粒中的至少一个喷嘴，其中喷射被移动相对于板。以这种方式，板与光圈和/或腔体的图案，其非常适用于在电子显示器操纵电子电流来制造。以这种方式制造的板也可以使用，例如，作为控制板，隔离板，或在电子显示器的电子传输通道的板。

73. 发明授权

US11866798B2 Method for manufacturing magnetostrictive torque sensor shaft 有权
公开(公告)号：US11866798B2
公开(公告)日：2024-01-09
申请号：US15854102
申请日：2017-12-26
申请人： Hitachi Metals, Ltd.
发明人： Teruyuki Nakamura
IPC分类号： C21D9/00 , C21D9/28 , B24C1/10 , C21D6/00 , C21D7/06 , C21D8/06 , C21D8/12 , G01L3/10 , B24C3/32 , B24C11/00
CPC分类号： C21D9/0075 , B24C1/10 , C21D6/004 , C21D7/06 , C21D8/065 , C21D8/1216 , C21D8/1255 , C21D8/1277 , C21D9/28 , G01L3/103 , B24C3/322 , B24C11/00
摘要： Provided is a method for manufacturing a magnetostrictive torque sensor shaft mounting a sensor portion of a magnetostrictive torque sensor. The method includes conducting heat treatment on a shaft material including chrome steel or chrome-molybdenum steel by carburizing, quenching and tempering, and conducting shot peening on the shaft material after the heat treatment at least on a position where the sensor portion is to be mounted. The shot peening is conducted by firing shot with a particle size of not less than 0.6 mm and a Rockwell hardness of not less than 60 at a jet pressure of not less than 0.4 MPa for a jet exposure time of not less than 2 minutes.

74. 发明申请

US20180264623A1 A NON-CONDUCTIVE SUBSTRATE WITH TRACKS FORMED BY SAND BLASTING 审中-公开
公开(公告)号：US20180264623A1
公开(公告)日：2018-09-20
申请号：US15542567
申请日：2016-01-08
申请人： DIRECTOR GENERAL, CENTRE FOR MATERIALS FOR ELECTRONICS TECHNOLOGY
发明人： Girish PHATAK , Shrikant KULKARNI , Vijaya GIRAMKAR , Shany JOSEPH
IPC分类号： B24C3/32 , B24C1/04 , B24C11/00 , H05K3/02
CPC分类号： B24C3/322 , B24C1/04 , B24C11/00 , H05K3/027 , H05K2203/025 , H05K2203/1126
摘要： A method for forming track(s) on low temperature co-fired ceramic (LTCC) substrate, the method comprising the steps of, forming a layer of coating material on an operative face of the LTCC substrate, disposing a stencil on the layer of coating material thereby covering a selected portion of the layer of coating material while leaving exposed a portion of the layer of coating material corresponding to the track(s) to be formed and forming an assembly of the LTCC substrate, the layer of coating material and the stencil, eroding the exposed portion of the layer of coating material by propelling an abrasive material using a blasting gun towards the assembly on the face on which the layer of coating material is formed and the stencil is disposed and separating the stencil from the abraded assembly, wherein the abrasive material has a composition that is compatible with that of the LTCC substrate.

75. 发明授权

US10000854B2 Method for preventing elution of Bi from copper alloy 有权
公开(公告)号：US10000854B2
公开(公告)日：2018-06-19
申请号：US13817187
申请日：2011-08-24
申请人： Tomoyuki Ozasa
发明人： Tomoyuki Ozasa
IPC分类号： C23F1/18 , C23F1/00 , B24C3/32 , E03B7/00
CPC分类号： C23F1/18 , B24C3/322 , C23F1/00 , E03B7/006
摘要： Provided is a method for preventing the elution of Bi from copper alloy, in which the elution of Bi is prevented in leadless copper-alloy plumbing equipment and the like containing a trace of lead and a predetermined amount of Bi. The present invention relates to a method for preventing the elution of Bi from copper alloy in which at least Bi present on the surface of copper alloy containing Bi is selectively removed by preferentially dissolving Bi in a 4 to 20 mass % concentration of nitric acid while suppressing Cu dissolution. Furthermore, elution of Pb is suppressed using a 10-20 mass % concentration of nitric acid. In this case, by removing at least Bi present on the surface of copper alloy containing Bi using nitric acid and then treating the surface of the copper alloy by shot-blasting corrosive products, such as oxides, produced from the nitric acid are removed, and gloss is imparted to the surface.

76. 发明授权

US08834231B2 Method and system for removing contaminants 有权
标题翻译：清除污染物的方法和系统
公开(公告)号：US08834231B2
公开(公告)日：2014-09-16
申请号：US13055750
申请日：2008-07-25
申请人： Sandeep Sharma
发明人： Sandeep Sharma
IPC分类号： B24C3/04
CPC分类号： H01L21/67051 , B24C1/003 , B24C1/08 , B24C3/322 , H01L21/565 , H01L2924/0002 , H01L2924/00
摘要： A method and apparatus for removing contaminants from at least one portion of a semiconductor mold are disclosed. A nozzle is positioned at a preset position with respect to the portion of the semiconductor mold. Solid particles of a material that sublimes instantaneously along with at least one of the abrasives and additives are blasted at a predefined temperature and/or pressure over the portion, through the nozzle. On impact, the particles remove the contaminants from the portion of the semiconductor mold.
摘要翻译：公开了一种用于从半导体模具的至少一部分去除污染物的方法和装置。喷嘴相对于半导体模具的部分定位在预设位置。材料的固体颗粒与至少一种研磨剂和添加剂一起瞬间升华，并通过喷嘴以预定的温度和/或压力喷射到该部分上。在冲击时，颗粒从半导体模具的部分去除污染物。

77. 发明授权

US08569094B2 Selective removal and contacting of thin film solar cells 有权
标题翻译：选择性去除和接触薄膜太阳能电池
公开(公告)号：US08569094B2
公开(公告)日：2013-10-29
申请号：US12997041
申请日：2009-06-12
申请人： Lars Stolt , Olle Lundberg , Peter Neretnieks , Johannes Segner
发明人： Lars Stolt , Olle Lundberg , Peter Neretnieks , Johannes Segner
IPC分类号： H01L31/0224 , H01L31/18
CPC分类号： H01L31/02008 , B24C1/04 , B24C3/322 , H01L31/046 , H01L31/0463 , Y02E10/50
摘要： A method for manufacturing a thin film solar cell device including a CIGS based thin film solar cell module (17). Edge deletion by selective removal of a multilayer structure (13) that includes at least a front contact (15) and a CIGS layer (7) to expose the back contact (5) in at least a peripheral area (22) in the circumferential region (21) of the module (17) adjacent to a first longitudinal thin film solar cell segment (18) allows for contacting of the module (17) by attaching at least a first contacting element (27) to the back contact (5). Preferably a blasting operation using simultaneous supply of blasting agents and gathering of debris in a blasting chamber (32) arranged on the thin film solar cell module (17) is used for the selective removal.
摘要翻译：一种用于制造包括基于CIGS的薄膜太阳能电池模块（17）的薄膜太阳能电池装置的方法。通过选择性去除包括至少前触点（15）和CIGS层（7）的多层结构（13）以在至少周边区域（22）中露出背接触（5）的边缘缺失，与第一纵向薄膜太阳能电池段（18）相邻的模块（17）的第二端（21）允许通过将至少第一接触元件（27）附接到背接触件（5）而与模块（17）接触。优选地，使用同时供应爆破剂并将布置在薄膜太阳能电池模块（17）上的喷射室（32）中的碎屑聚集）的喷砂操作用于选择性去除。

78. 发明申请

US20130142691A1 METHOD FOR PREVENTING ELUTION OF Bi FROM COPPER ALLOY 有权
标题翻译：从铜合金中预防铋的方法
公开(公告)号：US20130142691A1
公开(公告)日：2013-06-06
申请号：US13817187
申请日：2011-08-24
申请人： Tomoyuki Ozasa
发明人： Tomoyuki Ozasa
IPC分类号： C23F1/18
CPC分类号： C23F1/18 , B24C3/322 , C23F1/00 , E03B7/006
摘要： Provided is a method for preventing the elution of Bi from copper alloy, in which the elution of Bi is prevented in leadless copper-alloy plumbing equipment and the like containing a trace of lead and a predetermined amount of Bi. The present invention relates to a method for preventing the elution of Bi from copper alloy in which at least Bi present on the surface of copper alloy containing Bi is selectively removed by preferentially dissolving Bi in a 4 to 20 mass % concentration of nitric acid while suppressing Cu dissolution. Furthermore, elution of Pb is suppressed using a 10-20 mass % concentration of nitric acid. In this case, by removing at least Bi present on the surface of copper alloy containing Bi using nitric acid and then treating the surface of the copper alloy by shot-blasting corrosive products, such as oxides, produced from the nitric acid are removed, and gloss is imparted to the surface.
摘要翻译：本发明提供一种防止从铜合金中洗脱Bi的方法，其中在含铅铅和预定量的Bi的无铅铜合金管道设备等中防止Bi的洗脱。本发明涉及一种防止Bi从铜合金中溶出的方法，其中通过优先将Bi浓缩至4〜20质量％的硝酸浓度来选择性除去含有Bi的铜合金表面上至少存在Bi，同时抑制铜溶解。此外，使用10-20质量％浓度的硝酸抑制Pb的洗脱。在这种情况下，通过使用硝酸除去存在于含有Bi的铜合金表面上的至少Bi，然后除去由硝酸生成的喷射腐蚀性产物如氧化物来处理铜合金的表面，并且光泽赋予表面。

79. 发明授权

US08173228B2 Particle reduction on surfaces of chemical vapor deposition processing apparatus 有权
标题翻译：化学气相沉积处理装置表面的减少颗粒
公开(公告)号：US08173228B2
公开(公告)日：2012-05-08
申请号：US11498606
申请日：2006-08-02
申请人： Soo Young Choi , John M. White , Beom Soo Park , Dong Kil Yim
发明人： Soo Young Choi , John M. White , Beom Soo Park , Dong Kil Yim
IPC分类号： H05H1/24 , B05D3/00 , B05C13/00
CPC分类号： B24C1/003 , B24C3/322
摘要： A method of reducing the amount of particulates generated from the surface of a processing component used during plasma enhanced chemical vapor deposition of thin films. The body of the processing component comprises an aluminum alloy, and an exterior surface of said processing component is texturized to increase the amount of surface area present on the exterior surface. The texturizing process includes at least one step in which the surface to be texturized is bead blasted or chemically grained, so that the surface roughness of the texturized surface ranges from about 50 μ-inch Ra to about 1,000 μ-inch Ra.
摘要翻译：一种减少在等离子体增强化学气相沉积薄膜期间使用的处理部件表面产生的微粒量的方法。处理部件的主体包括铝合金，并且所述处理部件的外表面被组织化以增加外表面上存在的表面积的量。该组织化工艺包括至少一个步骤，其中待组织的表面经过喷砂处理或化学粒化，使得织构化表面的表面粗糙度范围为约50μ英寸Ra至约1,000μ英寸Ra。

80. 发明授权

US07586047B2 Method for manufacturing patterned porous molded product or nonwoven fabric, and electric circuit component 失效
标题翻译：图案化多孔成型体或无纺布的制造方法以及电路部件
公开(公告)号：US07586047B2
公开(公告)日：2009-09-08
申请号：US10586341
申请日：2005-01-13
申请人： Fumihiro Hayashi , Yasuhito Masuda , Yasuhiro Okuda
发明人： Fumihiro Hayashi , Yasuhito Masuda , Yasuhiro Okuda
IPC分类号： H05K1/11 , B31D3/00
CPC分类号： B24C3/322 , B24C1/04 , B24C11/00 , C23C18/1605 , C23C18/1644 , C23C18/1651 , C23C18/1653 , C23C18/30 , H05K1/0284 , H05K3/107 , H05K3/182 , H05K3/184 , H05K2201/0116 , H05K2201/015 , H05K2201/0209 , H05K2201/0293 , H05K2201/09036 , H05K2201/09118 , H05K2203/025 , H05K2203/0565 , Y10T428/24479 , Y10T428/24496 , Y10T428/24612 , Y10T428/249953 , Y10T428/249987 , Y10T442/674
摘要： An object of the present invention is to provide a method for manufacturing a porous material in which complicated and fine through portions, recessed portions, and the like have been patterned. It is to provide a patterned porous molded product or nonwoven fabric, in which a plated layer has been selectively formed on the surfaces of the through portions and the recessed portions.With the invention, a mask having through portions in a pattern is placed on at least one side of the porous molded product or the nonwoven fabric. A fluid or a fluid containing abrasive grains is sprayed from above the mask, thereby to form through portions or recessed portions, or both of them, to which the opening shape of each through portion of the mask has been transferred, in the porous molded product or the nonwoven fabric. The invention provides a porous molded product or a nonwoven fabric in which a plated layer has been selectively formed on the surfaces of the through portions or the recessed portions, or both of these, an electric circuit component, or the like.
摘要翻译：本发明的一个目的是提供一种多孔材料的制造方法，其中图形化了复杂而精细的通过部分，凹陷部分等。提供一种图案化的多孔模制产品或非织造织物，其中已经在通孔部分和凹进部分的表面上选择性地形成镀层。通过本发明，将具有图案部分的面罩放置在多孔成型品或无纺布的至少一侧。含有磨粒的流体或流体从掩模上方喷射，从而形成通过部分或凹陷部分或两者，其中通过掩模的每个通过部分的开口形状被转移到多孔模制产品中或无纺布。本发明提供一种多孔成型体或非织造布，其中，在贯通部或凹部的表面，或这两者，电路部件等的表面上选择性地形成镀层。

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