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    • 71. 发明公开
    • SENSOR
    • 传感器
    • EP1887371A1
    • 2008-02-13
    • EP06746210.1
    • 2006-05-10
    • Tyco Electronics AMP K.K.
    • OKAZAKI, HiroyukiAZUMA, YughoMINEMATSU, Takayuki
    • G01R33/07
    • G01R33/07
    • [PROBLEMS] In a sensor provided with a Hall element in a housing, the Hall element is arranged exactly in the nonflux region of a U-shaped magnet. [MEANS FOR SOLVING PROBLEMS] The sensor comprises a U-shaped magnet (50) having a pair of portions (51) opposing each other through an interval with a nonflux region A being formed between them, a Hall element (80) producing an output voltage depending on the density of passing flux, a spacer (40) for regulating positional relation of the Hall element (80) and the U-shaped magnet (50) such that the Hall element (80) is positioned in the nonflux region A of the U-shaped magnet (50), and a housing (10) covering the spacer (40).
    • [问题]在壳体中设置有霍尔元件的传感器中,霍尔元件精确地布置在U形磁体的非通流区域中。 解决问题的手段传感器包括具有一对部分(51)的U形磁体(50),其间形成有在其间形成有非通量区域A的间隔;霍尔元件(80),其产生输出 用于调节霍尔元件(80)和U形磁体(50)的位置关系的间隔件(40),使得霍尔元件(80)位于通向区域A的非通流区域A中 U形磁体(50)和覆盖间隔物(40)的壳体(10)。
    • 74. 发明公开
    • SURFACE MOUNT ELECTRIC PART
    • ELEKTRISCHES TEIL MITOBERFLÄCHENANBRINGUNG
    • EP1850644A1
    • 2007-10-31
    • EP06702531.2
    • 2006-01-06
    • Tyco Electronics AMP K.K.
    • TSUJI, Junya c/o Tyco Electronics AMP K.K.,
    • H05K1/18H05K3/34
    • H05K3/3415H05K2201/10189H05K2201/10477H05K2201/1084H05K2203/1572H05K2203/159Y02P70/613Y10T29/49144
    • A surface mounted electric part not requiring any additional facility investment on soldering and free from coming off a substrate even when the substrate is turned over and subjected to reflow. In a state that an electrical part is placed under a circuit board (100), the sum B of the periphery length of a second soldering portion (P2) is so set that the relationship between a downward rotation moment (M1) around a first soldering portion (P1) produced by the gravity and an upward rotation movement (M2) acting on a second soldering portion (P2) produced by the surface tension of solder melted during soldering using the overall heating method is M1 ≤ M2, and the sum A of the periphery length of the first soldering portion (P1) is so set that the relationship between a downward rotation movement (M3) around the second soldering portion (P2) produced by the gravity and an upward rotation movement (M4) acting on the first soldering portion (P1) produced by the surface tension is M3 ≤ M4.
    • 一种表面安装的电气部件,即使当基板翻转并经受回流时,也不需要额外的焊接投资并且不会脱离基板。 在将电气部件配置在电路基板(100)的状态下,第二焊接部(P2)的周长的总和B被设定为使得第一焊接周围的向下旋转力矩(M1) 通过重力产生的部分(P1)和通过使用整体加热方法在焊接期间熔化的焊料的表面张力产生的作用在第二焊接部分(P2)上的向上旋转运动(M2)为M1‰M2,并且总和A为 第一焊接部(P1)的周边长度被设定为使得由重力产生的第二焊接部(P2)周围的向下旋转运动(M3)与作用在第一焊接上的向上旋转运动(M4)之间的关系 由表面张力产生的部分(P1)为M3‰M4。