会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 73. 发明授权
    • Noise suppression for open bit line DRAM architectures
    • 开放位线DRAM架构的噪声抑制
    • US06721222B2
    • 2004-04-13
    • US10300398
    • 2002-11-19
    • Dinesh SomasekharShih-Lien L. LuVivek K. De
    • Dinesh SomasekharShih-Lien L. LuVivek K. De
    • G11C702
    • G11C11/4097G11C7/02G11C11/4094
    • An open bit line dynamic random access memory (DRAM) architecture uses a multiple layer bit line configuration to reduce coupling between switching bit lines in the device. In one approach, each successive cell within a row of DRAM cells is coupled to a bit line segment that is on a different metallization layer than a previous cell in the row. Shielding members are also provided between adjacent bit lines on a common metallization layer to further reduce noise coupling. Functionality is also provided for reducing the effect of word line to bit line coupling in the DRAM device using dummy signal injection techniques. In this manner, common mode noise that could otherwise saturate one or more sense amplifiers within the DRAM device is reduced or eliminated before such saturation can take place. In one approach, dummy cells and reference cells are provided for use in performing the signal injection. The principles of the present invention are particularly well suited for use within embedded DRAM structures where low charge storage capacity within individual cells reduces the signal voltage levels that are achievable.
    • 开放式位线动态随机存取存储器(DRAM)架构使用多层位线配置来减少器件中的开关位线之间的耦合。 在一种方法中,DRAM单元行内的每个连续单元被耦合到位于与行中的先前单元格不同的金属化层上的位线段。 屏蔽构件也设置在公共金属化层上的相邻位线之间,以进一步减少噪声耦合。 还提供了功能,用于使用虚拟信号注入技术来减少DRAM设备中字线对位线耦合的影响。 以这种方式,在这种饱和可能发生之前,可以减少或消除在DRAM装置内可以饱和一个或多个感测放大器的共模噪声。 在一种方法中,提供虚拟单元和参考单元用于执行信号注入。 本发明的原理特别适用于嵌入式DRAM结构,其中各个单元内的低电荷存储容量降低了可实现的信号电压电平。
    • 75. 发明授权
    • Noise suppression for open bit line DRAM architectures
    • 开放位线DRAM架构的噪声抑制
    • US06496402B1
    • 2002-12-17
    • US09690513
    • 2000-10-17
    • Dinesh SomasekharShih-Lien L. LuVivek K. De
    • Dinesh SomasekharShih-Lien L. LuVivek K. De
    • G11C506
    • G11C11/4097G11C7/02G11C11/4094
    • An open bit line dynamic random access memory (DRAM) architecture uses a multiple layer bit line configuration to reduce coupling between switching bit lines in the device. In one approach, each successive cell within a row of DRAM cells is coupled to a bit line segment that is on a different metallization layer than a previous cell in the row. Shielding members are also provided between adjacent bit lines on a common metallization layer to further reduce noise coupling. Functionality is also provided for reducing the effect of word line to bit line coupling in the DRAM device using dummy signal injection techniques. In this manner, common mode noise that could otherwise saturate one or more sense amplifiers within the DRAM device is reduced or eliminated before such saturation can take place. In one approach, dummy cells and reference cells are provided for use in performing the signal injection. The principles of the present invention are particularly well suited for use within embedded DRAM structures where low charge storage capacity within individual cells reduces the signal voltage levels that are achievable.
    • 开放式位线动态随机存取存储器(DRAM)架构使用多层位线配置来减少器件中的开关位线之间的耦合。 在一种方法中,DRAM单元行内的每个连续单元被耦合到位于与行中的先前单元格不同的金属化层上的位线段。 屏蔽构件也设置在公共金属化层上的相邻位线之间,以进一步减少噪声耦合。 还提供了功能,用于使用虚拟信号注入技术来减少DRAM设备中字线对位线耦合的影响。 以这种方式,在这种饱和可能发生之前,可以减少或消除在DRAM装置内可以饱和一个或多个感测放大器的共模噪声。 在一种方法中,提供虚拟单元和参考单元用于执行信号注入。 本发明的原理特别适合于在嵌入式DRAM结构中使用,其中各个单元内的低电荷存储容量降低可实现的信号电压电平。
    • 76. 发明授权
    • Low-leakage MOS planar capacitors for use within DRAM storage cells
    • 用于DRAM存储单元的低泄漏MOS平面电容器
    • US06421269B1
    • 2002-07-16
    • US09690687
    • 2000-10-17
    • Dinesh SomasekharShih-Lien L. LuVivek K. De
    • Dinesh SomasekharShih-Lien L. LuVivek K. De
    • G11C1124
    • H01L29/66181H01L27/0218H01L27/10805H01L29/94
    • A planar capacitor for use within a dynamic random access memory (DRAM) cell is operated within semiconductor depletion during normal storage operations to increase the charge retention time of the capacitor. Operation within semiconductor depletion allows a significant increase in charge retention time in a capacitor for which gate oxide leakage is the predominant leakage mechanism. The voltages that are applied to the storage cell during DRAM operation are controlled so that the storage capacitor within the cell remains in depletion during storage of both a logic zero and a logic one. Although the capacitance of the cell is decreased by operating in depletion, the charge retention time of the cell can be increased by multiple orders of magnitude. In one application, the inventive structures and techniques are implemented within a DRAM device that is embedded within logic circuitry.
    • 用于动态随机存取存储器(DRAM)单元的平面电容器在正常存储操作期间在半导体耗尽中运行,以增加电容器的电荷保留时间。 在半导体耗尽中的操作允许在电容器中的电荷保持时间显着增加,其中栅极氧化物泄漏是主要的泄漏机制。 控制在DRAM操作期间施加到存储单元的电压,使得在存储逻辑0和逻辑1期间,单元内的存储电容器保持耗尽。 尽管电池的电容通过在耗尽中操作而降低,但电池的电荷保持时间可以增加多个数量级。 在一个应用中,本发明的结构和技术在嵌入在逻辑电​​路内的DRAM器件内实现。
    • 77. 发明授权
    • Systolic memory arrays
    • 收缩记忆阵列
    • US07246215B2
    • 2007-07-17
    • US10721178
    • 2003-11-26
    • Shih-Lien L. LuDinesh SomasekharYibin Ye
    • Shih-Lien L. LuDinesh SomasekharYibin Ye
    • G06F12/00
    • G11C7/1039G06F13/1615G06F2212/271G11C7/10
    • A short latency and high bandwidth memory includes a systolic memory that is sub-divided into a plurality of memory arrays, including banks and pipelines that access these banks. Shorter latency and faster performance is achieved with this memory, because each bank is smaller in size and is accessed more rapidly. A high throughput rate is accomplished because of the pipelining. Memory is accessed at the pipeline frequency with the proposed read and write mechanism. Design complexity is reduced because each bank within the memory is the same and repeated. The memory array size is re-configured and organized to fit within desired size and area parameters.
    • 短暂的延迟和高带宽存储器包括细分为多个存储器阵列的收缩记忆体,包括存储这些存储体的存储体和管线。 由于每个存储体的尺寸较小,访问速度更快,因此可以实现更短的延迟和更快的性能。 由于流水线而实现了高吞吐量。 使用提出的读写机制,在流水线频率处访问存储器。 存储器中的每个存储单元都相同并重复,因此减少了设计复杂度。 重新配置和组织存储器阵列大小以适应所需的大小和面积参数。