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71. 发明申请

US20060076242A1 Producing method of wired circuit board 有权
标题翻译：有线电路板的生产方法
公开(公告)号：US20060076242A1
公开(公告)日：2006-04-13
申请号：US11236823
申请日：2005-09-28
申请人： Toshiki Naito
发明人： Toshiki Naito
IPC分类号： C25D5/02
CPC分类号： H05K3/28 , H05K1/0393 , H05K3/0023 , H05K3/007 , H05K3/0082 , H05K3/0097 , H05K3/108 , H05K2201/0108 , H05K2201/09736 , H05K2203/0156 , H05K2203/0191 , H05K2203/1383
摘要： A producing method of a wired circuit board that can prevent meandering of the elongate base material conveyed with the rolls and also prevent entry of air bubbles in between a light-transparency protecting film and a photosensitive solder resist layer when the light-transparency protecting film is laminated on the photosensitive solder resist layer. After a conductive pattern 3 is formed on the front side of the elongate base material 1 by the additive process, a narrow stiffener sheet 7 smaller in width than the elongate base material 1 is provided on the back side of the elongate base material 1. Then, after the photosensitive solder resist layer 10 is formed on the front side of the elongate base material 1 to cover the conductive pattern 3, the light-transparency protecting film 11 is laminated on the front side of the photosensitive solder resist layer 10. Thereafter, the photosensitive solder resist layer 10 is exposed to light through the light-transparency protecting film 11. Then, after the light-transparency protecting film 11 is stripped off from the photosensitive solder resist layer 10, the photosensitive solder resist layer 10 was developed and then cured by heating. Thereafter, the narrow stiffener sheet 7 is stripped off from the elongate base material. The flexible wired circuit board is produced in the manner described above.
摘要翻译：一种布线电路板的制造方法，其可以防止由辊传送的细长基材的曲折，并且当透光保护膜为光透射保护膜时防止透光保护膜和光敏抗蚀剂层之间的气泡进入层压在光敏抗蚀剂层上。在通过添加工艺在细长基材1的前侧上形成导电图案3之后，在细长基材1的背面设置有宽度小于细长基材1的窄加强板7。然后，在细长基材1的前侧形成感光性阻焊层10以覆盖导电图案3之后，在感光性阻焊层10的前侧层叠透光保护膜11。此后，光敏抗蚀剂层10通过透光保护膜11曝光。然后，在从光敏抗蚀剂层10剥离光透射保护膜11之后，将感光性阻焊层10显影，然后通过加热固化。此后，从细长的基材剥离窄的加强板7。柔性布线电路板以上述方式制造。

72. 发明申请

US20050191473A1 Wired circuit board 审中-公开
标题翻译：有线电路板
公开(公告)号：US20050191473A1
公开(公告)日：2005-09-01
申请号：US11064833
申请日：2005-02-25
申请人： Naoto Iwasaki , Toshiki Naito
发明人： Naoto Iwasaki , Toshiki Naito
IPC分类号： H05K1/09 , B32B3/00 , C25D3/48 , C25D5/34 , H05K1/02 , H05K1/11 , H05K3/24 , H05K3/28 , H05K3/32
CPC分类号： H05K3/244 , C25D3/48 , C25D5/34 , H05K3/28 , H05K2203/072 , H05K2203/0723 , Y10T428/24917
摘要： In order to provide a wired circuit board capable of enhancing the connection reliability and reducing the cost, in a wired circuit board including an insulating base layer, a conductor layer formed on the insulating base layer, and an insulating cover layer formed on the conductor layer and having an opening through which the conductor layer is exposed, an electrode is formed on the surface of the conductor layer exposed through the opening by forming a nickel plating layer by electroless nickel plating, and then forming a gold plating layer on the nickel plating layer by electrolytic gold plating.
摘要翻译：为了提供能够提高连接可靠性并降低成本的布线电路板，在包括绝缘基底层的布线电路板，形成在绝缘基底层上的导体层和形成在导体层上的绝缘覆盖层并且具有导体层露出的开口，通过通过无电镀镍形成镀镍层，在通过开口露出的导体层的表面上形成电极，然后在镀镍层上形成镀金层通过电解镀金。

73. 发明申请

US20050053868A1 Process for producing wiring circuit board 有权
标题翻译：制造布线电路板的工艺
公开(公告)号：US20050053868A1
公开(公告)日：2005-03-10
申请号：US10934703
申请日：2004-09-07
申请人： Toshiki Naito
发明人： Toshiki Naito
IPC分类号： H05K3/00 , H05K3/28 , G03F7/00
CPC分类号： H05K3/0082 , H05K3/0023 , H05K3/28 , H05K2201/0108 , H05K2203/0191 , H05K2203/1545 , Y10S430/162 , Y10T156/1089 , Y10T156/1092 , Y10T156/1093 , Y10T156/1095 , Y10T156/1097 , Y10T156/1098
摘要： The invention provides a process for producing a wiring circuit board, which comprises the steps of: (A) forming a conductor layer of a predetermined pattern on an insulating layer; (B) forming a photosensitive solder resist layer on the insulating layer and the patterned conductor layer formed on the insulating layer; (C) disposing a transparent protective film on the photosensitive solder resist layer; and (D) exposing the photosensitive solder resist layer to a light through the transparent protective film.
摘要翻译：本发明提供一种制造布线电路板的方法，包括以下步骤：（A）在绝缘层上形成预定图案的导体层; （B）在绝缘层上形成感光性阻焊层和形成在绝缘层上的图案化导体层; （C）在感光性阻焊层上设置透明保护膜; 和（D）将光敏抗蚀剂层曝光通过透明保护膜。

74. 发明授权

US6017438A Method for producing circuit substrate having bump contact point and jet stream type plating apparatus used therefor 失效
标题翻译：一种具有凸点接触点的电路基板的制造方法以及用于其的喷流式电镀装置
公开(公告)号：US6017438A
公开(公告)日：2000-01-25
申请号：US938555
申请日：1997-09-26
申请人： Yoshinari Takayama , Toshiki Naito , Kazuo Ouchi
发明人： Yoshinari Takayama , Toshiki Naito , Kazuo Ouchi
IPC分类号： C25D5/02 , C25D5/08 , H01L21/60
CPC分类号： C25D5/08 , C25D5/026 , H01L24/11 , H01L2224/13099 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01016 , H01L2924/01022 , H01L2924/01024 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01041 , H01L2924/01044 , H01L2924/01045 , H01L2924/01047 , H01L2924/01049 , H01L2924/01074 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14
摘要： A method for producing a circuit substrate having a bump contact point, comprising the steps of (a) disposing a positive electrode in a plating solution stored in a storage tank, (b) exposing a conductive circuit formed on an insulating substrate, above the surface of the plating solution, (c) disposing a jet stream opening below the surface of the plating solution, and (d) spouting out the plating solution from the jet stream opening toward the negative electrode for electroplating using said conductive circuit as a negative electrode, to form the bump contact point on the surface of the negative electrode, and a jet stream type plating apparatus used therefor. According to the present invention, mixing of air bubbles in the plating solution can be inhibited, which in turn enables suppression of oxidative decomposition of the brightener components. As a consequence, the bump contact point can have a mushroom shape, and variation in the height of the bump contact points can be minimized. In addition, slip of the vertex of the bump contact point and loss of bump contact points can be avoided.
摘要翻译：一种具有凸点接触点的电路基板的制造方法，其特征在于，包括以下步骤：（a）将正极放置在储存在储罐中的电镀溶液中，（b）将形成在绝缘基板上的导电电路露出，，（c）设置在电镀液表面下方开口的射流，（d）使用所述导电电路作为负极，从喷射流开口朝向负极喷射电镀溶液，以形成负极表面上的凸点接触点，以及用于其的射流式电镀装置。根据本发明，能够抑制电镀溶液中的气泡的混合，从而能够抑制增白剂成分的氧化分解。结果，凸块接触点可以具有蘑菇形状，并且可以使凸块接触点的高度的变化最小化。此外，可以避免凸块接触点的顶点滑动和凸点接触点的损失。

75. 发明授权

US5374469A Flexible printed substrate 失效
标题翻译：柔性印刷基板
公开(公告)号：US5374469A
公开(公告)日：1994-12-20
申请号：US945929
申请日：1992-09-17
申请人： Atsushi Hino , Amane Mochizuki , Kazuo Ouchi , Shoji Morita , Toshiki Naito , Kazumi Higashi , Masako Maeda , Masayuki Kaneto , Munekazu Tanaka , Masakazu Sugimoto
发明人： Atsushi Hino , Amane Mochizuki , Kazuo Ouchi , Shoji Morita , Toshiki Naito , Kazumi Higashi , Masako Maeda , Masayuki Kaneto , Munekazu Tanaka , Masakazu Sugimoto
IPC分类号： H05K1/00 , H05K1/03 , H05K3/00 , H05K3/20 , H05K3/28 , H05K3/40 , H05K3/42 , H05K3/46 , B32B9/00
CPC分类号： H05K3/4635 , H05K1/036 , H05K3/205 , H05K3/281 , H05K3/4007 , H05K3/421 , H05K3/4617 , H05K3/4632 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H05K1/0346 , H05K1/0393 , H05K2201/0129 , H05K2201/0154 , H05K2201/0195 , H05K2201/0347 , H05K2201/0355 , H05K2201/0358 , H05K2201/0367 , H05K2201/0394 , H05K2201/068 , H05K2201/09481 , H05K2201/10378 , H05K2203/0152 , H05K2203/0156 , H05K2203/0376 , H05K2203/063 , H05K2203/0726 , H05K2203/0733 , H05K2203/107 , H05K2203/1572 , H05K3/0035 , H05K3/28 , H05K3/423 , H05K3/427 , H05K3/4647 , Y10S428/901 , Y10T428/24917 , Y10T428/24942 , Y10T428/31721
摘要： A flexible printed substrate imparted with an adhesive property for loading on an external substrate, a double printed substrate having formed on both surfaces thereof a metal layer or a wiring circuit, and a multilayer substrate having a multilayer structure are disclosed. The flexible printed substrate comprises an insulating resin layer comprising a low-linear expansion polyimide resin layer and a thermoplastic polyimide resin layer, and a metal layer or a wiring circuit formed on the low-linear expansion polyimide resin layer of the insulating resin layer, wherein a mixed region of the polyimide resin components is formed in the interface between the low-linear expansion polyimide resin layer and the thermoplastic polyimide resin layer.
摘要翻译：公开了一种赋予外部基板的粘合性的柔性印刷基板，在其两面形成金属层或布线电路的双面印刷基板以及具有多层结构的多层基板。柔性印刷基板包括绝缘树脂层，其包含低线膨胀聚酰亚胺树脂层和热塑性聚酰亚胺树脂层，以及形成在绝缘树脂层的低线性膨胀聚酰亚胺树脂层上的金属层或布线电路，其中在低线膨胀聚酰亚胺树脂层和热塑性聚酰亚胺树脂层之间的界面形成聚酰亚胺树脂成分的混合区域。

76. 发明授权

US09412920B2 Phosphor reflecting sheet, light emitting diode device, and producing method thereof 有权
标题翻译：荧光体反射片，发光二极管装置及其制造方法
公开(公告)号：US09412920B2
公开(公告)日：2016-08-09
申请号：US13446540
申请日：2012-04-13
申请人： Yasunari Ooyabu , Hisataka Ito , Tsutomu Nishioka , Toshiki Naito
发明人： Yasunari Ooyabu , Hisataka Ito , Tsutomu Nishioka , Toshiki Naito
IPC分类号： H01L33/50 , H01L33/56 , H01L33/46 , H01L23/00
CPC分类号： H01L33/56 , H01L24/97 , H01L33/46 , H01L33/505 , H01L2224/16 , H01L2924/12041 , H01L2924/12042 , H01L2924/15787 , H01L2933/005 , H01L2924/00
摘要： A phosphor reflecting sheet provides a phosphor layer on one side in a thickness direction of a light emitting diode element and provides a reflecting resin layer at the side of the light emitting diode element. The phosphor reflecting sheet includes the phosphor layer and the reflecting resin layer provided on one surface in the thickness direction of the phosphor layer. The reflecting resin layer is formed corresponding to the light emitting diode element so as to be disposed in opposed relation to the side surface of the light emitting diode element.
摘要翻译：荧光体反射片在发光二极管元件的厚度方向的一侧提供荧光体层，并且在发光二极管元件侧提供反射树脂层。荧光体反射片包括荧光体层和设置在荧光体层的厚度方向的一个表面上的反射树脂层。反射树脂层相对于发光二极管元件形成为与发光二极管元件的侧面相对设置。

77. 发明授权

US09214611B2 Reflecting resin sheet, light emitting diode device and producing method thereof 有权
标题翻译：反射树脂片，发光二极管装置及其制造方法
公开(公告)号：US09214611B2
公开(公告)日：2015-12-15
申请号：US13446517
申请日：2012-04-13
申请人： Yasunari Ooyabu , Tsutomu Nishioka , Hisataka Ito , Toshiki Naito
发明人： Yasunari Ooyabu , Tsutomu Nishioka , Hisataka Ito , Toshiki Naito
IPC分类号： H01L33/00 , H01L33/56 , H01L33/60 , H01L23/00 , H01L33/50
CPC分类号： H01L33/60 , H01L24/97 , H01L25/0753 , H01L33/505 , H01L33/54 , H01L33/56 , H01L2224/16225 , H01L2224/97 , H01L2924/12041 , H01L2924/12042 , H01L2924/15787 , H01L2924/181 , H01L2924/18161 , H01L2933/0041 , H01L2933/005 , H01L2933/0058 , H01L2924/00 , H01L2924/00012 , H01L2224/81
摘要： A reflecting resin sheet provides a reflecting resin layer at the side of a light emitting diode element. The reflecting resin sheet includes a release substrate and the reflecting resin layer provided on one surface in a thickness direction of the release substrate. The reflecting resin layer is formed corresponding to the light emitting diode element so as to be capable of being in close contact with the light emitting diode element.
摘要翻译：反射树脂片在发光二极管元件的一侧提供反射树脂层。反射树脂片包括剥离基板和设置在剥离基板的厚度方向的一个表面上的反射树脂层。对应于发光二极管元件形成反射树脂层，以便能够与发光二极管元件紧密接触。

78. 发明授权

US08587904B2 Suspension board with circuit having a light emitting device exposed from a surface thereof opposite to that on which a slider is mounted 有权
标题翻译：具有电路的悬挂板具有从与安装滑块的表面相反的表面暴露的发光器件
公开(公告)号：US08587904B2
公开(公告)日：2013-11-19
申请号：US12588797
申请日：2009-10-28
申请人： Tetsuya Ohsawa , Hayato Abe , Yoshinari Yoshida , Toshiki Naito
发明人： Tetsuya Ohsawa , Hayato Abe , Yoshinari Yoshida , Toshiki Naito
IPC分类号： G11B5/48 , G11B13/08
CPC分类号： G11B13/04 , G11B5/4833 , G11B5/484 , G11B5/4853 , G11B2005/0021 , H05K1/056 , H05K1/182 , H05K3/06 , H05K3/445 , H05K2201/0394 , H05K2201/09509 , H05K2201/096 , H05K2201/0969 , H05K2201/10106 , H05K2201/10537 , H05K2201/10545 , H05K2201/10727 , H05K2203/0323 , H05K2203/0361
摘要： A suspension board with circuit includes a conductive pattern, including a slider arranged on a surface side of the suspension board with circuit and mounted with a magnetic head, the magnetic head being electrically connected with the conductive pattern; and a light emitting device arranged on the back surface side of the suspension board with circuit and electrically connected with the conductive pattern, in which the conductive pattern includes a first terminal provided on a surface of the suspension board with circuit and electrically connected with the magnetic head; and a second terminal provided on the back surface of the suspension board with circuit and electrically connected with the light emitting device.
摘要翻译：具有电路的悬挂板包括导电图案，包括布置在具有电路的悬挂板的表面侧上的滑块，并安装有磁头，磁头与导电图案电连接; 以及发光装置，其配置在具有电路的电路的背面侧并与导电图形电连接，其中导电图案包括设置在具有电路的悬挂板的表面上的第一端子，并与磁性电连接头; 以及设置在所述悬挂板的后表面上并具有电路并与所述发光装置电连接的第二端子。

79. 发明申请

US20130009911A1 UNDERLAY-BOARD-EQUIPPED INPUT DEVICE 审中-公开
标题翻译：内装板输入装置
公开(公告)号：US20130009911A1
公开(公告)日：2013-01-10
申请号：US13537188
申请日：2012-06-29
申请人： Naoki Shibata , Emiko Tani , Toshiki Naito , Yusuke Shimizu
发明人： Naoki Shibata , Emiko Tani , Toshiki Naito , Yusuke Shimizu
IPC分类号： G06F3/042
CPC分类号： G06F3/042
摘要： An underlay-board-equipped input device is provided which is capable of preventing positional displacement of a writing paper sheet when a user is writing on the set writing paper sheet and when the writing paper sheet is set again. An underlay board is mounted to the back surface of a rectangular frame-shaped input device having a rectangular hollow input-use interior pivotably about one end edge of the input device. The input device includes a rectangular frame-shaped optical waveguide having the hollow input-use interior. A means for positioning a writing paper sheet (such as protrusions) is provided on the front surface of the underlay board. The front surface of the underlay board and the back surface of the input device are configured to form a holding part for holding the writing paper sheet therebetween.
摘要翻译：提供了一种配备底板的输入装置，其能够防止用户在书写用纸上书写时以及再次设置书写用纸时书写用纸的位置偏移。底板被安装到矩形框状输入装置的后表面，该矩形框状输入装置具有可旋转地绕输入装置的一个端边缘的矩形中空输入用内部。输入装置包括具有中空输入使用内部的矩形框形光波导。用于定位书写纸（例如突出物）的装置设置在底板的前表面上。底板的前表面和输入装置的后表面被构造成形成用于将书写用纸夹持在其间的保持部。

80. 发明授权

US08314338B2 Wired circuit board and connection structure between wired circuit boards 有权
标题翻译：有线电路板和有线电路板之间的连接结构
公开(公告)号：US08314338B2
公开(公告)日：2012-11-20
申请号：US12219343
申请日：2008-07-21
申请人： Jun Ishii , Yasunari Ooyabu , Takeshi Tanaka , Toshiki Naito
发明人： Jun Ishii , Yasunari Ooyabu , Takeshi Tanaka , Toshiki Naito
IPC分类号： H05K1/03 , H05K1/11 , H05K1/14
CPC分类号： H05K3/363 , H05K1/056 , H05K1/117 , H05K1/142 , H05K2201/058 , H05K2201/09145 , H05K2201/09381 , H05K2203/167
摘要： A wired circuit board includes a first wired circuit board and a second wired circuit board disposed to be opposed to the first wired circuit board in the same plane. A first opposed surface of the first wired circuit board facing the second wired circuit board and a second opposed surface of the second wired circuit board facing the first wired circuit board include at least two types of interfitting surfaces extending in different directions so as to mutually interfit the first opposed surface with the second opposed surface.
摘要翻译：布线电路板包括第一布线电路板和布置成与同一平面中的第一布线电路板相对的第二布线电路板。面向第二布线电路板的第一布线电路板的第一相对表面和面对第一布线电路板的第二布线电路板的第二相对表面包括沿不同方向延伸的至少两种类型的配合表面，以便相互配合具有第二相对表面的第一相对表面。

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