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    • 71. 发明申请
    • OXIDE MATERIAL AND SEMICONDUCTOR DEVICE
    • 氧化物材料和半导体器件
    • US20120153364A1
    • 2012-06-21
    • US13325700
    • 2011-12-14
    • Shunpei YAMAZAKIMotoki NAKASHIMATatsuya HONDA
    • Shunpei YAMAZAKIMotoki NAKASHIMATatsuya HONDA
    • H01L29/78H01B1/00C01B13/00
    • H01L29/7869C01G19/006C01P2002/72H01L29/04H01L29/045H01L29/26H01L29/78696
    • An object is to provide a material suitably used for a semiconductor included in a transistor, a diode, or the like. Another object is to provide a semiconductor device including a transistor in which the condition of an electron state at an interface between an oxide semiconductor film and a gate insulating film in contact with the oxide semiconductor film is favorable. Further, another object is to manufacture a highly reliable semiconductor device by giving stable electric characteristics to a transistor in which an oxide semiconductor film is used for a channel. A semiconductor device is formed using an oxide material which includes crystal with c-axis alignment, which has a triangular or hexagonal atomic arrangement when seen from the direction of a surface or an interface and rotates around the c-axis.
    • 目的是提供适用于晶体管,二极管等中所包含的半导体的材料。 另一个目的是提供一种包括晶体管的半导体器件,其中与氧化物半导体膜接触的氧化物半导体膜和栅极绝缘膜之间的界面处的电子态的条件是有利的。 此外,另一个目的是通过给氧化半导体膜用于沟道的晶体管提供稳定的电特性来制造高度可靠的半导体器件。 使用包括具有c轴对准的晶体的氧化物材料形成半导体器件,当从表面或界面的方向观察时,半导体器件具有三角形或六边形的原子排列,并围绕c轴旋转。
    • 72. 发明申请
    • WIRELESS CHIP
    • 无线芯片
    • US20120139017A1
    • 2012-06-07
    • US13371675
    • 2012-02-13
    • Shunpei YAMAZAKIKonami IZUMI
    • Shunpei YAMAZAKIKonami IZUMI
    • H01L29/78H01L23/532
    • G06K19/07775G06K19/04G06K19/07749H01L27/1214H01L27/1266H01Q1/38
    • The invention provides a wireless chip which can secure the safety of consumers while being small in size, favorable in communication property, and inexpensive, and the invention also provides an application thereof. Further, the invention provides a wireless chip which can be recycled after being used for managing the manufacture, circulation, and retail. A wireless chip includes a layer including a semiconductor element, and an antenna. The antenna includes a first conductive layer, a second conductive layer, and a dielectric layer sandwiched between the first conductive layer and the second conductive layer, and has a spherical shape, an ovoid shape, an oval spherical shape like a go stone, an oval spherical shape like a rugby ball, or a disc shape, or has a cylindrical shape or a polygonal prism shape in which an outer edge portion thereof has a curved surface.
    • 本发明提供了一种能够确保消费者安全的无线芯片,同时体积小,通信性好,价格低廉,本发明还提供了一种应用。 此外,本发明提供一种无线芯片,其可以在用于管理制造,流通和零售之后被再循环。 无线芯片包括包括半导体元件的层和天线。 天线包括第一导电层,第二导电层和夹在第一导电层和第二导电层之间的电介质层,并且具有球形,卵形,像石头的椭圆形,椭圆形 球形,如橄榄球,或圆盘状,或具有其外缘部分具有弯曲表面的圆柱形或多棱柱形状。
    • 76. 发明申请
    • SOI SUBSTRATE AND METHOD FOR MANUFACTURING SOI SUBSTRATE
    • SOI衬底和制造SOI衬底的方法
    • US20120098086A1
    • 2012-04-26
    • US13339427
    • 2011-12-29
    • Shunpei YAMAZAKIMaki TOGAWAYasuyuki ARAI
    • Shunpei YAMAZAKIMaki TOGAWAYasuyuki ARAI
    • H01L21/762H01L29/12
    • H01L21/76254H01L21/84H01L2924/0002H01L2924/00
    • An SOI substrate and a manufacturing method of the SOI substrate, by which enlargement of the substrate is possible and its productivity can be increased, are provided. A step (A) of cutting a first single crystal silicon substrate to form a second single crystal silicon substrate which has a chip size; a step (B) of forming an insulating layer on one surface of the second single crystal silicon substrate, and forming an embrittlement layer in the second single crystal substrate; and a step (C) of bonding a substrate having an insulating surface and the second single crystal silicon substrate with the insulating layer therebetween, and conducting heat treatment to separate the second single crystal silicon substrate along the embrittlement layer, and forming a single crystal silicon thin film on the substrate having an insulating surface, are conducted.
    • 提供SOI衬底和SOI衬底的制造方法,通过其可以扩大衬底并提高其生产率。 一种切割第一单晶硅衬底以形成具有芯片尺寸的第二单晶硅衬底的步骤(A); 在所述第二单晶硅衬底的一个表面上形成绝缘层并在所述第二单晶衬底中形成脆化层的步骤(B); 以及将具有绝缘表面的衬底和所述第二单晶硅衬底之间的绝缘层接合在其间的步骤(C),并且进行热处理以沿着所述脆化层分离所述第二单晶硅衬底,并且形成单晶硅 进行具有绝缘面的基板上的薄膜。