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    • 74. 发明授权
    • Semiconductor integrated circuit for generating an internal power source
voltage with reduced potential changes
    • 用于产生具有降低的电位变化的内部电源电压的半导体集成电路
    • US5592421A
    • 1997-01-07
    • US393077
    • 1995-02-23
    • Tetsuya KanekoTakashi Ohsawa
    • Tetsuya KanekoTakashi Ohsawa
    • G11C11/407G11C5/14G11C8/08G11C11/4074G11C11/409H01L21/8242H01L27/10H01L27/108G11C13/00
    • G11C5/147G11C11/4074G11C8/08
    • A semiconductor integrated circuit device is provided that can restrict changes in the internal power source potential when an externally applied power source potential changes. The semiconductor integrated circuit device comprises an integrated circuit section, a voltage regulator for limiting an externally applied potential which causes changes in potential levels to a certain potential level to obtain a regulated potential, and a boost circuit driven by the regulated potential as a power source, for boosting the regulated potential to a boosted potential used as a operating power source for the integrated circuit section. The boost circuit is driven by the regulated potential limited to a certain potential level. Even when the level of the potential VCC changes, operation of the boost circuit does not substantially change. Due to the structure in which the boosted potential is generated from the regulated potential, the constant potential range of the boosted potential is enlarged so that operating margins of the device are enlarged.
    • 提供了一种半导体集成电路器件,其可以在外部施加的电源电位变化时限制内部电源电位的变化。 半导体集成电路器件包括集成电路部分,用于限制外部施加的电位的电压调节器,其将电位电平的变化导致一定的电位以获得调节电位,以及由调节电位驱动的升压电路作为电源 ,用于将调节电位升高到用作集成电路部分的工作电源的升压电位。 升压电路由限制在一定电位电平的调节电位驱动。 即使当电位VCC的电平变化时,升压电路的操作也实质上不会改变。 由于从调节电位产生升压电位的结构,增大了电位的恒定电位范围,从而扩大了器件的工作裕度。
    • 75. 发明授权
    • Semiconductor memory device including a boost potential generation
circuit
    • 包括升压电位产生电路的半导体存储器件
    • US5587958A
    • 1996-12-24
    • US363825
    • 1994-12-27
    • Tetsuya KanekoTakashi Ohsawa
    • Tetsuya KanekoTakashi Ohsawa
    • G11C11/413G11C5/14G11C11/406G11C11/407G11C11/408H01L21/822H01L21/8242H01L27/04H01L27/10H01L27/108G11C8/00
    • G11C11/4085G11C5/145
    • A semiconductor integrated circuit device includes a boost potential generation circuit, word line drive system circuit, refresh cycle select circuit, word line system boost potential generation circuit and boost potential generation system control circuit. The boost potential generation circuit steadily generates a higher boost potential than an externally applied voltage. The word line drive system circuit delivers the boost potential, as a power supply, from the boost potential generation circuit so as to drive the corresponding word line. The word line system boost potential control circuit sets at a substantially constant level a boost potential output from the boost potential generation circuit. The boost potential generation system control circuit receives a designation signal from the refresh cycle select circuit so as to designate a refresh cycle and supplies a control signal, which is generated based on the designation signal, to the boost potential generation circuit, whereby, when more word lines are driven at a time by the word line system drive circuit, a current supply capability of the boost potential generation circuit is increased and, when less word lines are driven at a time, the current supply capability of the boost potential generation circuit is decreased.
    • 半导体集成电路器件包括升压电位产生电路,字线驱动系统电路,刷新周期选择电路,字线系统升压电位产生电路和升压电位发生系统控制电路。 升压电位发生电路稳定地产生比外部施加的电压更高的升压电位。 字线驱动系统电路从升压电位产生电路提供升压电位作为电源,以驱动相应的字线。 字线系统升压电位控制电路将从升压电位产生电路输出的升压电位设定为基本恒定的电平。 升压电位生成系统控制电路从刷新周期选择电路接收指定信号,以指定刷新周期,并将基于指定信号生成的控制信号提供给升压电位产生电路,从而当更多 字线由字线系驱动电路一次驱动,升压电位产生电路的电流供给能力增加,当一次驱动较少的字线时,升压电位产生电路的电流供给能力为 减少。
    • 78. 发明授权
    • Pressure connection type connector
    • 压力连接型连接器
    • US5447449A
    • 1995-09-05
    • US207020
    • 1994-03-07
    • Tetsuya Kaneko
    • Tetsuya Kaneko
    • H01R4/24
    • H01R12/675
    • A pressure connection type connector includes a pressure connection type contact comprising first and second pressure connection type terminals arranged in parallel and spaced apart from one another in an axial direction of a cable conductor in a coated cable, and a third pressure connection type terminal located intermediately between the first and second terminals but displaced therefrom in a direction radially of the cable conductor. The coated cable is pressed against the pressure connection type contact by a pressing member so that the coating of the coated cable is pierced through and broken by tips of the first to third terminals, and the conductor of the coated cable is pressed in between the first and third terminals and between the second and third terminals. The tips of the first to third terminals are then inserted into a receiving hole of the pressing member. The wall of the receiving hole includes first and second inclined surface elements. The first inclined surface element is adapted to press the tips of the first to third terminals radially of the cable conductor to thereby cause contracting and closing of the first to third terminals, and the second inclined surface element is adapted to press the tips of the first and second terminals axially of the cable conductor to thereby cause contract and closing of the first and second terminals.
    • 压力连接型连接器包括:压力连接型接头,包括第一和第二压力连接型端子,第一和第二压力连接型端子在涂覆电缆中的电缆导体的轴向上彼此平行布置并彼此间隔开;以及第三压力连接型端子, 在第一和第二端子之间,但是在电缆导体的径向方向上从第一端子和第二端子之间移位。 涂覆的电缆通过按压构件压靠压力连接型接触,使得涂覆电缆的涂层被第一至第三端子的尖端穿透并断开,并且涂覆的电缆的导体被压在第一 和第三端子之间以及第二和第三端子之间。 然后将第一至第三端子的尖端插入按压构件的接收孔中。 接收孔的壁包括第一和第二倾斜表面元件。 第一倾斜表面元件适于将电缆导体的第一至第三端子的末端压缩,从而导致第一至第三端子的收缩和闭合,并且第二倾斜表面元件适于按​​压第一至第三端子的尖端 和电缆导体轴向的第二端子,从而导致第一和第二端子的收缩。
    • 79. 发明授权
    • Process for making press-in connection type contact
    • 冲压连接式接触的工艺
    • US5423120A
    • 1995-06-13
    • US169988
    • 1993-12-16
    • Tetsuya Kaneko
    • Tetsuya Kaneko
    • H01R4/24H01R43/16
    • H01R43/16Y10T29/49204Y10T29/49218Y10T29/49222
    • A press-in connection type contact, comprising a first press-in connection terminal, a second press-in connection terminal and a third press-in connection terminal, can be made by a process comprising the steps of splitting the first, second and third press-in connection terminals from one another by shear-cutting a plate member; bending the third press-in connection terminal in a first direction along an intermediate line between the first and second terminals; forming press contacting surfaces on corner portions of the first, second and third press-in terminals by swaging; and bending the third press-in terminals in a second opposite direction along the intermediate line between the first and second press-in terminals so that the press contacting surfaces are placed in an opposing relation. The terminals are thus arranged such that a conductor having a conductor cover can be pressed-in between the terminals of the contact, whereby pointed ends of terminals pierce the cover and the terminals create a pressure contact about the conductor.
    • 可以通过包括以下步骤的方法制造包括第一压入式连接端子,第二压入式连接端子和第三压入式连接端子的压入式连接型触头,该方法包括将第一,第二和第三 通过剪切板构件将压入式连接端子彼此连接; 沿着第一和第二端子之间的中间线在第一方向上弯曲第三压入连接端子; 通过锻造在第一,第二和第三压入端的角部上形成压接面; 以及沿着第一和第二压入端子之间的中间线在第二相反方向上弯曲第三压入端子,使得压接面相对放置。 因此,端子被布置成使得具有导体盖的导体可以被压入接触件的端子之间,由此端子的尖端刺穿盖,并且端子围绕导体产生压力接触。