专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

71. 发明授权

US07504719B2 Printed wiring board having a roughened surface formed on a metal layer, and method for producing the same 有权
标题翻译：在金属层上形成有粗糙面的印刷电路板及其制造方法
公开(公告)号：US07504719B2
公开(公告)日：2009-03-17
申请号：US11188886
申请日：2005-07-26
申请人： Honchin En , Masayuki Hayashi , Dongdong Wang , Kenichi Shimada , Motoo Asai , Koji Sekine , Tohru Nakai , Shinichiro Ichikawa , Yukihiko Toyoda
发明人： Honchin En , Masayuki Hayashi , Dongdong Wang , Kenichi Shimada , Motoo Asai , Koji Sekine , Tohru Nakai , Shinichiro Ichikawa , Yukihiko Toyoda
IPC分类号： H01L23/12 , H01L21/4763
CPC分类号： C23G1/10 , H01L2924/0002 , H05K3/0094 , H05K3/062 , H05K3/067 , H05K3/108 , H05K3/384 , H05K3/385 , H05K3/388 , H05K3/4602 , H05K3/4644 , H05K3/4661 , H05K2201/0129 , H05K2201/0158 , H05K2201/0338 , H05K2201/09563 , H05K2201/0959 , H05K2201/096 , H05K2203/0307 , H05K2203/0315 , H05K2203/072 , H05K2203/1105 , Y10T29/49124 , Y10T29/49151 , Y10T29/49155 , Y10T29/49163 , Y10T29/49165 , Y10T428/24917 , H01L2924/00
摘要： The present invention has for its object to provide a multilayer printed circuit board which is very satisfactory in facture toughness, dielectric constant, adhesion and processability, among other characteristics. The present invention is directed to a multilayer printed circuit board comprising a substrate board, a resin insulating layer formed on said board and a conductor circuit constructed on said resin insulating layer, wherein said resin insulating layer comprises a polyolefin resin.
摘要翻译：本发明的目的在于提供一种多层印刷电路板，其特征在于其具有非常好的韧性，介电常数，粘合性和可加工性。本发明涉及一种多层印刷电路板，其包括基板，形成在所述基板上的树脂绝缘层和在所述树脂绝缘层上构成的导体电路，其中所述树脂绝缘层包括聚烯烃树脂。

72. 发明申请

US20080289864A1 PRINTED WIRING BOARD AND METHOD FOR PRODUCING THE SAME 有权
公开(公告)号：US20080289864A1
公开(公告)日：2008-11-27
申请号：US12146105
申请日：2008-06-25
申请人： Honchin EN , Masayuki Hayashi , Dongdong Wang , Kenichi Shimada , Motoo Asai , Koji Sekine , Tohru Nakai , Shinichiro Ichikawa , Yukihiko Toyoda
发明人： Honchin EN , Masayuki Hayashi , Dongdong Wang , Kenichi Shimada , Motoo Asai , Koji Sekine , Tohru Nakai , Shinichiro Ichikawa , Yukihiko Toyoda
IPC分类号： H05K1/09
CPC分类号： C23G1/10 , H01L2924/0002 , H05K3/0094 , H05K3/062 , H05K3/067 , H05K3/108 , H05K3/384 , H05K3/385 , H05K3/388 , H05K3/4602 , H05K3/4644 , H05K3/4661 , H05K2201/0129 , H05K2201/0158 , H05K2201/0338 , H05K2201/09563 , H05K2201/0959 , H05K2201/096 , H05K2203/0307 , H05K2203/0315 , H05K2203/072 , H05K2203/1105 , Y10T29/49124 , Y10T29/49151 , Y10T29/49155 , Y10T29/49163 , Y10T29/49165 , Y10T428/24917 , H01L2924/00
摘要： The present invention has for its object to provide a multilayer printed circuit board which is very satisfactory in facture toughness, dielectric constant, adhesion and processability, among other characteristics. The present invention is directed to a multilayer printed circuit board comprising a substrate board, a resin insulating layer formed on said board and a conductor circuit constructed on said resin insulating layer, wherein said resin insulating layer comprises a polyolefin resin.

73. 发明申请

US20080289176A1 PRINTED WIRING BOARD AND METHOD FOR PRODUCING THE SAME 有权
标题翻译：印刷线路板及其制造方法
公开(公告)号：US20080289176A1
公开(公告)日：2008-11-27
申请号：US12146204
申请日：2008-06-25
申请人： Honchin EN , Masayuki Hayashi , Dongdong Wang , Kenichi Shimada , Motoo Asai , Koji Sekine , Tohru Nakai , Shinichiro Ichikawa , Yukihiko Toyoda
发明人： Honchin EN , Masayuki Hayashi , Dongdong Wang , Kenichi Shimada , Motoo Asai , Koji Sekine , Tohru Nakai , Shinichiro Ichikawa , Yukihiko Toyoda
IPC分类号： H05K3/00
CPC分类号： C23G1/10 , H01L2924/0002 , H05K3/0094 , H05K3/062 , H05K3/067 , H05K3/108 , H05K3/384 , H05K3/385 , H05K3/388 , H05K3/4602 , H05K3/4644 , H05K3/4661 , H05K2201/0129 , H05K2201/0158 , H05K2201/0338 , H05K2201/09563 , H05K2201/0959 , H05K2201/096 , H05K2203/0307 , H05K2203/0315 , H05K2203/072 , H05K2203/1105 , Y10T29/49124 , Y10T29/49151 , Y10T29/49155 , Y10T29/49163 , Y10T29/49165 , Y10T428/24917 , H01L2924/00
摘要： The present invention has for its object to provide a multilayer printed circuit board which is very satisfactory in facture toughness, dielectric constant, adhesion and processability, among other characteristics. The present invention is directed to a multilayer printed circuit board comprising a substrate board, a resin insulating layer formed on said board and a conductor circuit constructed on said resin insulating layer, wherein said resin insulating layer comprises a polyolefin resin.
摘要翻译：本发明的目的在于提供一种多层印刷电路板，其特征在于其具有非常好的韧性，介电常数，粘合性和可加工性。本发明涉及一种多层印刷电路板，其包括基板，形成在所述基板上的树脂绝缘层和在所述树脂绝缘层上构成的导体电路，其中所述树脂绝缘层包括聚烯烃树脂。

74. 发明授权

US07449427B2 Honeycomb structured body 有权
标题翻译：蜂窝结构体
公开(公告)号：US07449427B2
公开(公告)日：2008-11-11
申请号：US11518998
申请日：2006-09-12
申请人： Kazushige Ohno , Hiroki Sato , Masayuki Hayashi , Kazutake Ogyu
发明人： Kazushige Ohno , Hiroki Sato , Masayuki Hayashi , Kazutake Ogyu
IPC分类号： B01J23/02 , B32B3/12 , B28B1/00 , B28B3/00 , B28B5/00 , C04B33/32 , C04B33/36 , C04B35/64
CPC分类号： B01D46/2429 , B01D2046/2433 , B01D2046/2437 , B01D2046/2496 , B01D2279/30 , B01J35/04 , F01N3/0222 , F01N3/2828 , F01N2330/48 , F01N2450/28 , Y02T10/20 , Y10T428/24149
摘要： The honeycomb structured body of the present invention is a honeycomb structured body in which a plurality of porous ceramic members are combined with one another through an adhesive layer, each of the porous ceramic members having a plurality of cells which are allowed to penetrate in a longitudinal direction with a wall portion therebetween and either one end of which is sealed, with a catalyst supporting layer being adhered to the wall portion, wherein an average pore diameter of the porous ceramic member is larger than an average particle diameter of particles constituting the catalyst supporting layer, and when a pore diameter distribution of the porous ceramic member and a particle diameter distribution of particles constituting the catalyst supporting layer are drawn with the pore diameter and the particle diameter being on the same axis, a pore volume in an overlapped area of both the distributions is about 10% or less to the entire pore volume of the porous ceramic member.
摘要翻译：本发明的蜂窝结构体是蜂窝结构体，其中多个多孔陶瓷构件通过粘合剂层彼此结合，每个多孔陶瓷构件具有多个细胞，其允许纵向穿透方向，其间具有壁部，并且其一端被密封，催化剂支撑层粘附到壁部，其中多孔陶瓷构件的平均孔径大于构成催化剂载体的颗粒的平均粒径层，并且当多孔陶瓷构件的孔径分布和构成催化剂负载层的颗粒的粒径分布以孔径和粒径在同一轴线上被拉伸时，两者的重叠区域中的孔体积该分布对于多孔陶瓷构件的整个孔体积为大约10％或更小。

75. 发明申请

US20070154728A1 Honeycomb structure, method for producing the same, and exhaust emission purification apparatus 有权
标题翻译：蜂窝结构体及其制造方法以及排气净化装置
公开(公告)号：US20070154728A1
公开(公告)日：2007-07-05
申请号：US11712410
申请日：2007-03-01
申请人： Kazushige Ohno , Kazutake Ogyu , Masayuki Hayashi , Masafumi Kunieda
发明人： Kazushige Ohno , Kazutake Ogyu , Masayuki Hayashi , Masafumi Kunieda
IPC分类号： B32B3/12 , C04B33/32
CPC分类号： C04B38/0006 , B01J23/02 , B01J35/04 , C04B35/10 , C04B35/565 , C04B38/0022 , C04B2111/00129 , C04B2111/00793 , C04B2111/0081 , C04B2111/2084 , F01N3/2803 , Y10T428/1234 , C04B38/0054 , C04B38/0074 , C04B41/5031
摘要： The present invention provides a method for producing a honeycomb structure which carries a catalyst component containing at least one element selected from the group consisting of alkali metals and alkaline earth metals and purifies exhaust emissions. The method of the invention includes: a starting material mixing step of mixing ceramic particles having a predetermined average particle size, fine particles being composed of the same material as the ceramic particles and having an average particle size smaller than the predetermined average particle size, and an erosion-resistant material or a precursor thereof which inhibits the catalyst component from eroding the ceramic particles more effectively than an oxide of the element contained in the ceramic particles, to prepare a puddle; a molding and firing step of molding the puddle into a molded body and firing the molded body to sinter the molded body and to allow a ceramic particle protection material composed of the erosion-resistant material or the precursor thereof to be present on the surface of the molded body; and a catalyst-carrying step of making the fired molded body to carry the catalyst component.
摘要翻译：本发明提供了一种蜂窝结构体的制造方法，该蜂窝结构体含有含有选自碱金属和碱土金属中的至少一种元素的催化剂成分，并净化废气排放物。本发明的方法包括：将具有预定平均粒度的陶瓷颗粒混合的原料混合步骤，由与陶瓷颗粒相同的材料构成并具有小于预定平均粒度的平均粒径的细颗粒，以及耐腐蚀材料或其前体，其抑制催化剂组分比陶瓷颗粒中所含元素的氧化物更有效地侵蚀陶瓷颗粒，以制备熔池; 模制和煅烧步骤，将熔池模制成型体，并烧制成型体以烧结成型体，并允许由抗侵蚀材料或其前体组成的陶瓷颗粒保护材料存在于成型体; 以及使烧成的成型体携带催化剂成分的催化剂负载工序。

76. 发明申请

US20070044829A1 Photoelectric conversion layer, photoelectric conversion device and imaging device, and method for applying electric field thereto 有权
标题翻译：光电转换层，光电转换装置和成像装置及其电场施加方法
公开(公告)号：US20070044829A1
公开(公告)日：2007-03-01
申请号：US11508276
申请日：2006-08-23
申请人： Itaru Osaka , Masayuki Hayashi
发明人： Itaru Osaka , Masayuki Hayashi
IPC分类号： H02N6/00
CPC分类号： H01L51/424 , H01L27/307 , H01L51/0052 , H01L51/0067 , H01L51/0072 , H01L51/448 , H01L2251/308 , Y02E10/549
摘要： A photoelectric conversion layer comprising a compound represented by the following formula (1): wherein L represents a divalent or polyvalent connecting group; n represents an integer of 2 or more; and A is a chemical structure represented by the following formula (2): wherein X1 to X8 each independently represents a substituted or unsubstituted carbon atom or a nitrogen atom.
摘要翻译：一种光电转换层，其包含由下式（1）表示的化合物：其中L表示二价或多价连接基团; n表示2以上的整数， A是由下式（2）表示的化学结构：其中X 1至X 8各自独立地表示取代或未取代的碳原子或氮原子。

77. 发明申请

US20070028575A1 Honeycomb structured body 有权
标题翻译：蜂窝结构体
公开(公告)号：US20070028575A1
公开(公告)日：2007-02-08
申请号：US11496431
申请日：2006-08-01
申请人： Kazushige Ohno , Hiroki Sato , Masayuki Hayashi , Kazutake Ogyu
发明人： Kazushige Ohno , Hiroki Sato , Masayuki Hayashi , Kazutake Ogyu
IPC分类号： B01D39/20
CPC分类号： B01D46/2429 , B01D2046/2433 , B01D2046/2437 , B01D2046/2496 , B01D2279/30 , B01J35/04 , C04B38/0006 , C04B2111/0081 , F01N3/0222 , F01N3/035 , F01N2330/06 , F01N2330/48 , Y10S55/05 , Y10S55/10 , Y10S55/30 , C04B35/00 , C04B38/0058 , C04B38/008
摘要： A honeycomb structured body of the present invention is a honeycomb structured body in which a plurality of porous ceramic members are combined with one another through an adhesive layer, each of the porous ceramic members having a plurality of cells which are allowed to penetrate in a longitudinal direction with a wall portion therebetween and either one end of which is sealed, with a catalyst supporting layer being adhered to the wall portion, wherein, supposing that the rate of the pore volume of pores having a pore diameter of 10 μm or less to the entire pore volume of the porous ceramic member is X1 (%), the porosity is Y1 (%) and the weight of the catalyst supporting layer is Z1 (g/l), these X1, Y1 and Z1 are allowed to satisfy the following expressions (1) and (2): X1≦20−Z1/10 (1), and Y1≧35+7Z1/40 (2) (where about 20≦Z1≦about 150).
摘要翻译：本发明的蜂窝结构体是蜂窝结构体，其中多个多孔陶瓷构件通过粘合剂层彼此结合，每个多孔陶瓷构件具有多个细胞，其允许纵向穿透方向，其间具有壁部分，并且其一端被密封，催化剂支撑层粘附到壁部分，其中，假设孔径为10μm或更小的孔的孔体积相对于多孔陶瓷构件的整个孔体积为X 1（％），孔隙率为Y 1（％），催化剂负载层的重量为Z < 1（g / l），这些X 1，Y 1和Z 1被允许满足下列表达式（1 ）和（2）：<？in-line-formula description =“In-line Formulas”end =“lead”？> X <1> <= 20 -Z 1 / 10（1）和<？in-line-formula description =“联机表单 ulae“end =”tail“？> <？in-line-formula description =”In-line formula“end =”lead“？> Y <1> = 35 + 7Z < / SUB> / 40（2）<？in-line-formula description =“In-line Formulas”end =“tail”？>（其中约20 <= Z <1> <= 150）。

78. 发明申请

US20060135343A1 Method of manufacturing porous product, porous product and honeycomb structure 审中-公开
标题翻译：制造多孔产品，多孔产品和蜂窝结构的方法
公开(公告)号：US20060135343A1
公开(公告)日：2006-06-22
申请号：US11289611
申请日：2005-11-30
申请人： Kazushige Ohno , Kazutake Ogyu , Masayuki Hayashi
发明人： Kazushige Ohno , Kazutake Ogyu , Masayuki Hayashi
IPC分类号： C04B38/00 , D02G3/00 , C03C3/095
CPC分类号： F01N3/0222 , B01D46/0001 , B01D46/2429 , B01D46/2444 , B01D46/2459 , C04B35/565 , C04B35/6303 , C04B38/0009 , C04B2111/00793 , C04B2201/32 , C04B2235/322 , C04B2235/383 , C04B2235/5436 , C04B2235/5445 , C04B2235/5472 , C04B2235/656 , C04B2235/80 , C04B2235/85 , C04B2235/96 , C04B2235/9607 , F01N2330/30 , Y02T10/20 , Y10T428/24149 , Y10T428/2975 , C04B35/10 , C04B38/0038
摘要： A sintering aid for promoting sintering of ceramic particles and fine particles that are the same materials as ceramic particles and have smaller average particle diameter are mixed to obtain a puddle. The average particle diameter of ceramic particles is preferably about in a range of 5 to 100 μm; the average particle diameter of the fine particles is preferably about in a range of 0.1 to 1.0 μm, and the average particle diameter of the sintering aid is preferably about in a range of 0.1 to 10 μm. As the sintering aid, for example, alumina is used. This puddle is extrusion molded into a honeycomb shape and the molded object is fired at a firing temperature lower than a temperature for sintering without mixing a sintering aid. The thermal conductivity of the obtained honeycomb structure 10 shows about 60% or more of the thermal conductivity of a fired body fired without adding a sintering aid to ceramic particles and shows about 12 W/m·K or more at 20° C.
摘要翻译：混合用于促进与陶瓷颗粒相同的材料和平均粒径较小的陶瓷颗粒和细颗粒的烧结的烧结助剂，以获得熔池。陶瓷粒子的平均粒径优选为5〜100μm左右的范围。微粒的平均粒径优选为0.1〜1.0μm的范围，烧结助剂的平均粒径优选为0.1〜10μm左右。作为烧结助剂，例如使用氧化铝。该熔池挤出成型为蜂窝状，在不混合烧结助剂的烧成温度以下烧成的烧成温度下进行烧成。所获得的蜂窝结构体10的导热率表示在不向陶瓷颗粒添加烧结助剂的情况下烧成的烧制体的导热率的约60％以上，在20℃下为约12W / m·K以上

79. 发明申请

US20050250904A1 Organopolysiloxane-modified polysaccharide and process for producing the same 有权
标题翻译：有机聚硅氧烷改性多糖及其制备方法
公开(公告)号：US20050250904A1
公开(公告)日：2005-11-10
申请号：US10526729
申请日：2003-09-08
申请人： Tadashi Okawa , Masayuki Hayashi
发明人： Tadashi Okawa , Masayuki Hayashi
IPC分类号： C08B15/05 , C08B11/20 , C08G63/48 , C08G63/91 , C08G77/42 , C08G81/00
CPC分类号： C08G81/00 , C08B11/20 , C08B15/05 , C08G77/42
摘要： An organopolysiloxane-modified polysaccharide prepared by esterification reacting (A) an organopolysiloxane having residual carboxylic anhydride groups and (B) a polysaccharide having hydroxyl groups, wherein the organopolysiloxane is bonded to the polysaccharide through half ester groups, and a process for the preparation of organopolysiloxane-modified polysaccharide, in which component (A) and component (B) are subjected to an esterification reaction in the presence of (C) a non-protonic polar solvent. The organopolysiloxane-modified polysaccharide comprising polysaccharide and organopolysiloxane bonded thereto through half ester groups is novel. The process for the preparation of organopolysiloxane-modified polysaccharide permits introduction of organopolysiloxane into polysaccharide at a high introduction ratio.
摘要翻译：通过酯化反应制备的有机聚硅氧烷改性多糖（A）具有残留羧酸酐基团的有机聚硅氧烷和（B）具有羟基的多糖，其中有机聚硅氧烷通过半酯基与多糖键合，以及制备有机聚硅氧烷其中组分（A）和组分（B）在（C）非质子极性溶剂的存在下进行酯化反应。通过半酯基与其结合的多糖和有机聚硅氧烷的有机聚硅氧烷改性多糖是新颖的。制备有机聚硅氧烷改性多糖的方法允许以高引入比将有机聚硅氧烷引入多糖中。

80. 发明授权

US06176840B1 Ultrasonic cosmetic treatment device 失效
标题翻译：超声波美容治疗装置
公开(公告)号：US06176840B1
公开(公告)日：2001-01-23
申请号：US09126807
申请日：1998-07-31
申请人： Shinji Nishimura , Masayuki Hayashi
发明人： Shinji Nishimura , Masayuki Hayashi
IPC分类号： A61H100
CPC分类号： A61H23/0245
摘要： Since the electrical impedance of an ultrasonic vibrator may vary according to the contact or non-contact of an application member with the skin, a detection circuit detects the contact or non-contact of the application member with the skin by converting the current the ultrasonic vibrator current into a voltage, and a comparator compares this voltage with a reference voltage. When contact is detected by the detection circuit, a constant-voltage circuit sets the level of the constant voltage output to the ultrasonic oscillation circuit at a standard voltage, but when non-contact is detected, the constant voltage is switched to a lower-level constant voltage. Thus, when non-contact is detected, the level of the ultrasound emitted from the ultrasonic vibrator via the application member is lowered, so that an unnecessary rise in the temperature of the application member is be prevented.
摘要翻译：由于超声波振动器的电阻抗可以根据施加构件与皮肤的接触或非接触而变化，因此检测电路通过将电流转换成超声波振动器来检测施加构件与皮肤的接触或非接触电流进入电压，比较器将该电压与参考电压进行比较。当由检测电路检测到接触时，恒压电路将输出到超声波振荡电路的恒定电压的电平设置为标准电压，但是当检测到非接触时，将恒定电压切换到较低电平恒压。因此，当检测到非接触时，通过施加构件从超声波振动器发射的超声波的水平降低，从而可以防止施加构件的温度的不必要的上升。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式