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    • 78. 发明授权
    • Jig for peeling a bonded wafer
    • 用于剥离接合晶片的夹具
    • US5897743A
    • 1999-04-27
    • US786767
    • 1997-01-21
    • Kazuaki FujimotoHiroshi FurukawaHirotaka Kato
    • Kazuaki FujimotoHiroshi FurukawaHirotaka Kato
    • C30B35/00B26D3/28B29C63/00B32B43/00C30B33/00C30B33/06H01L21/02H01L21/30H01L21/304H01L21/58H01L27/12B32B35/00
    • B32B43/006B26D3/282B29C63/0013Y10S156/941Y10T156/11Y10T156/1179Y10T156/19Y10T29/49822Y10T29/53683
    • A peeling jig is provided for peeling a bonded wafer having voids formed in bonding surfaces so as to rebond, which does not injure the bonding surfaces or cause the adherence of particles thereto. The peeling jig includes a wedge portion 1a for inserting into the bonding surfaces, and a flat portion provided at the both sides of the base of the wedge portion. The apex angle of the wedge portion, when the chamfered angles at the bonding sides of the supporting substrate and active wafer of the bonded wafer to be separated are respectively .alpha. and .beta., is .theta. and .theta.>.alpha.+.beta.. When the wedge portion is inserted into the bonding surfaces, the right and left inclined surfaces of the wedge portion are in contact with the peripheries of the chamfered portions, and then chamfered portions are flared. Accordingly, the bonded wafer is separated by the wedge portion into the supporting substrate and the active wafer without being contacted with the bonding surfaces until the flat portions are in contact with the periphery of the bonded wafer.
    • 提供一种剥离夹具,用于剥离在接合表面形成的具有空隙的接合晶片,以便重新粘结,这不会损伤接合表面或引起颗粒附着。 剥离夹具包括用于插入接合表面的楔形部分1a和设置在楔形部分的基部两侧的平坦部分。 当待分离的接合晶片的支撑衬底和有源晶片的接合侧的倒角角度分别为α和β时,楔形部分的顶角为θ和θ>α+β。 当楔形部分插入接合表面时,楔形部分的左右倾斜表面与倒角部分的周边接触,然后倒角部分被展开。 因此,接合晶片被楔形部分分离成支撑衬底和活性晶片,而不与接合表面接触,直到平坦部分与接合晶片的周边接触。