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    • 75. 发明授权
    • 2-amino-bicyclo(3.1.0) hexane-2,6-dicarboxylic ester derivative
    • 2-氨基 - 双环(3.1.0)己烷-2,6-二羧酸酯衍生物
    • US08076502B2
    • 2011-12-13
    • US12847392
    • 2010-07-30
    • Akito YasuharaKazunari SakagamiHiroshi OhtaAtsuro Nakazato
    • Akito YasuharaKazunari SakagamiHiroshi OhtaAtsuro Nakazato
    • C07C69/74C07C61/12
    • C07C229/50C07D307/88
    • A drug effective for the treatment and prevention of psychiatric disorders such as schizophrenia, anxiety and related ailments thereof, depression, bipolar disorder and epilepsy. The drug antagonizes the action of group II metabotropic glutamate receptors and shows high activity in oral administrationA 2-amino-bicyclo[3.1.0]hexane-2,6-dicarboxylic ester derivative represented by formula [I] [wherein R1 and R2 are identical or different, and each represents a hydrogen atom, a C1-10alkyl group or the like; X represents a hydrogen atom or a fluorine atom; Y represents —OCHR3R4 or the like (wherein R3 and R4 are identical or different, and each represents a hydrogen atom, a C1-10alkyl group or the like; and n represents integer 1 or 2)], a pharmaceutically acceptable salt thereof or a hydrate thereof.
    • 一种有效治疗和预防精神疾病如精神分裂症,焦虑及其相关疾病,抑郁症,双相情感障碍和癫痫的药物。 该药物拮抗II型代谢型谷氨酸受体的作用,并且在口服给药中表现出高活性。由式[I]表示的2-氨基 - 双环[3.1.0]己烷-2,6-二羧酸酯衍生物[其中R1和R2为 相同或不同,并且各自表示氢原子,C 1-10烷基等; X表示氢原子或氟原子; Y表示-OCHR 3 R 4等(其中R 3和R 4相同或不同,并且各自表示氢原子,C 1-10烷基等; n表示1或2的整数)],其药学上可接受的盐或 水合物。
    • 76. 发明授权
    • Semiconductor device having a junction of P type pillar region and N type pillar region
    • 具有P型支柱区域和N型支柱区域的结的半导体器件
    • US08013360B2
    • 2011-09-06
    • US12764763
    • 2010-04-21
    • Wataru SaitoSyotaro OnoMasakatsu TakashitaYasuto SumiMasaru IzumisawaHiroshi OhtaWataru Sekine
    • Wataru SaitoSyotaro OnoMasakatsu TakashitaYasuto SumiMasaru IzumisawaHiroshi OhtaWataru Sekine
    • H01L29/66
    • H01L29/872H01L29/0619H01L29/0623H01L29/0634H01L29/0696H01L29/0878H01L29/402H01L29/404H01L29/41741H01L29/7395H01L29/7397H01L29/7722H01L29/7806H01L29/7811H01L29/8611
    • A semiconductor device includes: a semiconductor layer of a first conductivity type; a first semiconductor pillar region of the first conductivity type provided on a major surface of the semiconductor layer; a second semiconductor pillar region of a second conductivity type provided adjacent to the first semiconductor pillar region on the major surface of the semiconductor layer, the second semiconductor pillar region forming a periodic arrangement structure substantially parallel to the major surface of the semiconductor layer together with the first semiconductor pillar region; a first main electrode; a first semiconductor region of the second conductivity type; a second semiconductor region of the first conductivity type; a second main electrode; a control electrode; and a high-resistance semiconductor layer provided on the semiconductor layer in an edge termination section surrounding the first semiconductor pillar region and the second semiconductor pillar region. The high-resistance semiconductor layer has a lower dopant concentration than the first semiconductor pillar region. A boundary region is provided between a device central region and the edge termination section. The first semiconductor pillar region and the second semiconductor pillar region adjacent to the high-resistance semiconductor layer in the boundary region have a depth decreasing stepwise toward the edge termination section.
    • 半导体器件包括:第一导电类型的半导体层; 设置在半导体层的主表面上的第一导电类型的第一半导体柱区域; 第二导电类型的第二半导体柱区域,与半导体层的主表面上的第一半导体柱区域相邻设置,第二半导体柱区域形成基本上平行于半导体层的主表面的周期性排列结构以及 第一半导体柱区域; 第一主电极; 第二导电类型的第一半导体区域; 第一导电类型的第二半导体区域; 第二主电极; 控制电极; 以及设置在包围第一半导体柱区域和第二半导体柱区域的边缘终端部分的半导体层上的高电阻半导体层。 高电阻半导体层的掺杂浓度低于第一半导体柱区域。 边界区域设置在设备中心区域和边缘终端部分之间。 边界区域中与高电阻半导体层相邻的第一半导体柱区域和第二半导体柱区域具有沿着边缘终止部分逐步减小的深度。
    • 79. 发明申请
    • Air Compressor of Water Injection Type
    • 注水型空气压缩机
    • US20100233004A1
    • 2010-09-16
    • US12709275
    • 2010-02-19
    • Takehiro MATSUZAKAHiroshi Ohta
    • Takehiro MATSUZAKAHiroshi Ohta
    • F04C29/04
    • F04C29/0014F04B39/06F04B39/062F04C18/16F04C2210/128F04C2280/04
    • In a water injection air compressor including a compressor main body for compressing air, a water-feed line for feeding water to an actuation chamber in the compressor main body, an air release valve for releasing the compressed air from the compressor main body, and a control panel for executing an on-load operation mode in which water is fed into the actuation chamber and an air release valve is closed and a no-load operation mode in which the water is fed into the actuation chamber and the air release valve is opened, wherein the control panel further executes a dry operation mode in which the water is prevented from being fed into the actuation chamber and with the air release valve is opened.
    • 在包括用于压缩空气的压缩机主体的水注射空气压缩机中,将水供给到压缩机主体中的致动室的供水管线,用于从压缩机主体释放压缩空气的排气阀,以及 控制面板,用于执行其中水被供给到致动室中的空载操作模式和空气释放阀关闭,以及空气操作模式,其中水被供给到致动室和排气阀打开 其特征在于,所述控制面板进一步执行干式运转模式,在所述干式运转模式中,防止水进入所述致动室,并且所述排气阀打开。
    • 80. 发明申请
    • SEMICONDUCTOR DEVICE
    • 半导体器件
    • US20100200936A1
    • 2010-08-12
    • US12764763
    • 2010-04-21
    • Wataru SAITOSyotaro OnoMasakatsu TakashitaYasuto SumiMasaru IzumisawaHiroshi OhtaWataru Sekine
    • Wataru SAITOSyotaro OnoMasakatsu TakashitaYasuto SumiMasaru IzumisawaHiroshi OhtaWataru Sekine
    • H01L29/78
    • H01L29/872H01L29/0619H01L29/0623H01L29/0634H01L29/0696H01L29/0878H01L29/402H01L29/404H01L29/41741H01L29/7395H01L29/7397H01L29/7722H01L29/7806H01L29/7811H01L29/8611
    • A semiconductor device includes: a semiconductor layer of a first conductivity type; a first semiconductor pillar region of the first conductivity type provided on a major surface of the semiconductor layer; a second semiconductor pillar region of a second conductivity type provided adjacent to the first semiconductor pillar region on the major surface of the semiconductor layer, the second semiconductor pillar region forming a periodic arrangement structure substantially parallel to the major surface of the semiconductor layer together with the first semiconductor pillar region; a first main electrode; a first semiconductor region of the second conductivity type; a second semiconductor region of the first conductivity type; a second main electrode; a control electrode; and a high-resistance semiconductor layer provided on the semiconductor layer in an edge termination section surrounding the first semiconductor pillar region and the second semiconductor pillar region. The high-resistance semiconductor layer has a lower dopant concentration than the first semiconductor pillar region. A boundary region is provided between a device central region and the edge termination section. The first semiconductor pillar region and the second semiconductor pillar region adjacent to the high-resistance semiconductor layer in the boundary region have a depth decreasing stepwise toward the edge termination section.
    • 半导体器件包括:第一导电类型的半导体层; 设置在半导体层的主表面上的第一导电类型的第一半导体柱区域; 第二导电类型的第二半导体柱区域,与半导体层的主表面上的第一半导体柱区域相邻设置,第二半导体柱区域形成基本上平行于半导体层的主表面的周期性排列结构以及 第一半导体柱区域; 第一主电极; 第二导电类型的第一半导体区域; 第一导电类型的第二半导体区域; 第二主电极; 控制电极; 以及设置在包围第一半导体柱区域和第二半导体柱区域的边缘终端部分的半导体层上的高电阻半导体层。 高电阻半导体层的掺杂浓度低于第一半导体柱区域。 边界区域设置在设备中心区域和边缘终端部分之间。 边界区域中与高电阻半导体层相邻的第一半导体柱区域和第二半导体柱区域具有沿着边缘终止部分逐步减小的深度。