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    • 71. 发明授权
    • Gas detection sensor
    • 气体检测传感器
    • US06622543B1
    • 2003-09-23
    • US09979039
    • 2001-11-15
    • Tadahiro OhmiKouji KawadaNobukazu IkedaAkihiro MorimotoYukio MinamiKatunori KomehanaTeruo Honiden
    • Tadahiro OhmiKouji KawadaNobukazu IkedaAkihiro MorimotoYukio MinamiKatunori KomehanaTeruo Honiden
    • G01N2532
    • G01N33/0013G01N25/32
    • A gas detection sensor permits precise measurement of the concentration of flammable gas in a detection or subject gas and the concentration of oxygen in a detection gas containing flammable gases. In the sensor, the heating of the sensor by contact catalytic reaction of flammable gas gives off a detection signal of the flammable gas. The gas detection sensor has a first detection sensor including a diaphragm having a platinum coat on a side which the flowing detection gas comes in contact with, and a thermocouple having respective ends of two different metals placed close to each other and fixed on the side of the diaphragm not coming in contact with the flowing detection gas and which is heated by the contact catalytic reaction of flammable gas. A second detection sensor similar to the first detection sensor detects the temperature of the flowing detection gas.
    • 气体检测传感器允许精确测量检测或目标气体中的可燃气体的浓度以及含有易燃气体的检测气体中的氧浓度。 在传感器中,通过可燃气体的接触催化反应对传感器的加热产生可燃气体的检测信号。 气体检测传感器具有第一检测传感器,该第一检测传感器包括在流动检测气体接触的一侧上具有铂涂层的膜片,以及将彼此靠近并固定在两侧的两个不同金属的两端固定的热电偶 隔膜不会与流动的检测气体接触,并且被易燃气体的接触催化反应加热。 类似于第一检测传感器的第二检测传感器检测流动检测气体的温度。
    • 72. 发明授权
    • Method for generating water for semiconductor production
    • 生产半导体水的方法
    • US6093662A
    • 2000-07-25
    • US242137
    • 1999-04-14
    • Tadahiro OhmiYukio MinamiKoji KawadaYoshikazu TanabeNobukazu IkedaAkihiro Morimoto
    • Tadahiro OhmiYukio MinamiKoji KawadaYoshikazu TanabeNobukazu IkedaAkihiro Morimoto
    • C01B5/00H01L21/31H01L21/469
    • C01B5/00
    • Process for generating moisture for use in semiconductor manufacturing, the process comprising feeding hydrogen and oxygen into a reactor provided with a platinum-coated catalyst layer on an interior wall, thus enhancing the reactivity between hydrogen and oxygen by catalytic action and instantaneously reacting the reactivity-enhanced hydrogen and oxygen at a temperature below the ignition point to produce moisture without undergoing combustion at a high temperature, wherein the amount of unreacted hydrogen occurring in the generated moisture in starting up or terminating the moisture generating reaction is minimized and wherein undesired reactions such as undesired silicon oxide film coating are avoided. When the generation of moisture is started up by feeding hydrogen and oxygen into the reactor provided with a platinum-coated catalyst layer on the inside wall thereof, oxygen first starts to be fed and, some time after that, the supply of hydrogen is begun. In terminating the moisture generating operation by cutting off the supply of hydrogen and oxygen into the reactor, the feeding of hydrogen is first stopped and, some time after that, the supply of oxygen is shut off.
    • PCT No.PCT / JP98 / 02660 Sec。 371 1999年4月14日第 102(e)1999年4月14日PCT PCT。1998年6月12日PCT公布。 第WO98 / 57884号公报 日期1998年12月23日用于生产用于半导体制造的水分的方法,该方法包括将氢和氧进料到在内壁上设置有铂包覆催化剂层的反应器中,从而通过催化作用增强氢和氧之间的反应性, 在低于点火点的温度下使反应性增强的氢和氧瞬时反应以产生水分而不在高温下经历燃烧,其中在产生水分的反应中启动或终止产生的水分中产生的未反应的氢的量最小化, 其中避免了不期望的反应,例如不需要的氧化硅膜涂层。 当通过在其内壁上提供有铂包覆的催化剂层的反应器中加入氢气和氧气来启动水分的产生时,首先开始供给氧,一段时间后开始供应氢气。 在通过切断氢气和氧气进入反应器来终止湿气生成操作时,首先停止供给氢气,一段时间后,关闭氧气供应。
    • 79. 发明授权
    • Thermoelectric module device
    • 热电模块装置
    • US07893345B2
    • 2011-02-22
    • US11753123
    • 2007-05-24
    • Akihiro MorimotoTakahiro Kimura
    • Akihiro MorimotoTakahiro Kimura
    • H01L35/28
    • H01L35/10H01L35/08H01L35/34
    • A thermoelectric module device includes a first substrate having inner and outer surfaces, a second substrate having inner and outer surfaces, a Peltier-junction module sandwiched between the inner surfaces of the first and second substrates, the Peltier-junction module being made up of a series of Peltier junctions including a pair of outermost Peltier junctions, a pair of power supply electrodes connected to the pair of the outermost Peltier junctions, respectively, and a metallization layer provided on the outer surface of the second substrate for being soldered to a package, the metallization layer being divided into spaced first and second portions which correspond to the Peltier-junction module and the pair of power supply electrodes, respectively.
    • 热电模块装置包括具有内表面和外表面的第一基板,具有内表面和外表面的第二基板,夹在第一和第二基板的内表面之间的珀耳帖结模块,珀耳帖结模块由 一系列包括一对最外层的珀尔帖接头的珀尔帖接头,分别连接到一对最外层的珀尔帖接头的一对电源电极以及设在第二基板的外表面上用于焊接到封装的金属化层, 金属化层分别分别对应于珀耳帖结模块和一对电源电极的间隔开的第一和第二部分。