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71. 发明专利

JPH0579709B2 失效
公开(公告)号：JPH0579709B2
公开(公告)日：1993-11-04
申请号：JP22517584
申请日：1984-10-25
申请人： TOYO BOSEKI
发明人： NAGAHARA SHIGENORI , ABE SHUNZO , MYAKE HIDEO
IPC分类号： B60K6/28 , B60K6/46 , B60L9/18 , B60L11/12 , B60L50/15 , C08F290/00 , C08F299/02 , C09D11/00 , C09D11/10 , G03F7/004 , G03F7/027 , H01M10/44 , H05K3/28 , H05K3/34

72. 发明专利

JPH04359256A COMPOSITION OF TACKY ADHESION PREVENTIVE LAYER FOR PHOTOSENSITIVE RESIN PRINTING PLATE 失效
公开(公告)号：JPH04359256A
公开(公告)日：1992-12-11
申请号：JP16201291
申请日：1991-06-05
申请人： TOYO BOSEKI
发明人： NAGAHARA SHIGENORI , TOMITA AKIRA , NANHEI MASARU
IPC分类号： G03F7/00 , G03F7/11 , G03F7/115
摘要： PURPOSE:To obtain the tacky adhesion preventive layer which is free from coating defects and has excellent peelability and bright image developability relating to the coating of a cover film used for a photosensitive resin laminate having resilience. CONSTITUTION:This compsn. of the tacky adhesion preventive layer for photosensitive resin printing plates is formed by incorporating an alkyl ester sulfone compd. and alkyl phosphate deriv. compd. into a water-soluble polymer and/or water dispersible polymer.

73. 发明专利

JPH03159741A POLYIMIDE FILM LAMINATE 失效
公开(公告)号：JPH03159741A
公开(公告)日：1991-07-09
申请号：JP30009589
申请日：1989-11-17
申请人： TOYO BOSEKI
发明人： OMOTO KOICHI , NAGAHARA SHIGENORI , UNO KEIICHI
IPC分类号： B32B27/34 , H05K1/03
摘要： PURPOSE:To obtain a polyimide film laminate enhanced in insulating properties, heat resistance, flexibility and adhesiveness by laminating an adhesive layer based on a reaction product prepared by reacting a polyester resin, a polyfunctional epoxy compound and a monofunctional epoxy compound in a specific ratio to the single surface of a polyimide film. CONSTITUTION:A laminate is formed by laminating an adhesive layer based on a reaction product of a polyester resin A, a polyfunctional epoxy compound B and a monofunctional epoxy compound C to at least the single surface of a polyimide film and the respective components A, B, C in the adhesive layer are respectively set to 30-70%, 25-65% and 5-25% by wt. of the adhesive layer. The polyester resin A has glass transition temp. of 5 deg.C or lower and a polyester resin increased in the constitutional ratio of aliphatic carboxylic acid among acid components is desirable. As the polyfunctional epoxy compound B, for example, there is bisphenol A type epoxy and, as the monofunctional epoxy compound C, phenylglycidyl ether can be used.

74. 发明专利

JPH03150158A POLYIMIDEFILM-LAMINATE 失效
公开(公告)号：JPH03150158A
公开(公告)日：1991-06-26
申请号：JP28963389
申请日：1989-11-07
申请人： TOYO BOSEKI
发明人： NAGAHARA SHIGENORI , OMOTO KOICHI , UNO KEIICHI
IPC分类号： B32B27/34 , C09J7/02 , C09J175/00 , C09J175/04 , H05K3/38
摘要： PURPOSE:To obtain the polyimide laminate having the adhesive layer with high insulation properties, heat resistance, flexibility and adhesion by specifying each component of the adhesive of the polyimide film-laminate obtained by laminating the adhesive onto the polyimide film. CONSTITUTION:In a polyimide film-laminate, the adhesive containing polyester (a), polyalkylene glycol (b), multifunctional isocyanate compound (c) and multi functional epoxy compound (d) as its components, is laminated on at least one surface of the polyimide film. In each component of the adhesive, (a) is 10 - 30 wt.%, (b) is 10 - 40 wt.%, (c) is 1 - 10 wt.% and (d) is 10 - 30 wt.% to whole adhesive, and then (b), (c) and (d) exist as their mixture, or at least a part of them exist as their reaction product. Further, a metallic layer is laminated on the side of the adhesive layer of the laminate, and the adhesive layer is cured. In the polyimide film-laminate, the adhesive layer is excellent in adhesion with the polyimide film and the metal and is also excellent in insulation properties, heat resistance and flexibility.

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