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    • 72. 发明申请
    • Semiconductor device
    • 半导体器件
    • US20090302420A1
    • 2009-12-10
    • US12453736
    • 2009-05-20
    • Yasutaka Nakashiba
    • Yasutaka Nakashiba
    • H01L29/86
    • H01L27/0617H01L23/5227H01L27/1203H01L2924/0002H01L2924/00
    • A multilayer wiring layer 400, a first inductor 310 and a second inductor 320 are formed on a substrate 10. The multilayer wiring layer is formed by alternately stacking an insulating layer and a wiring layer in this order t or more times (t≧3). The first inductor 310 is provided in the nth wiring layer in the multilayer wiring layer 400. The second inductor 320 is provided in the mth wiring layer in the multilayer wiring layer 400 (t≧m≧n+2) and positioned above the first inductor 310. No inductor is provided in any of the wiring layers positioned between the nth wiring layer and the mth wiring layer to be positioned above the first inductor 310. The first inductor 310 and the second inductor 320 constitute a signal transmitting device 300 which transmits an electrical signal in either of two directions.
    • 多层布线层400,第一电感器310和第二电感器320形成在基板10上。多层布线层通过以下次序交替堆叠绝缘层和布线层来形成(t> = 3 )。 第一电感器310设置在多层布线层400中的第n布线层中。第二电感器320设置在多层布线层400中的第m布线层(t> = m> = n + 2)中并且位于 第一电感器310.位于第n布线层和第m布线层之间的布线层中的任何布线层中都不设置电感器以位于第一电感器310的上方。第一电感器310和第二电感器320构成信号发送装置300, 在两个方向中的任一方向发送电信号。
    • 73. 发明授权
    • Voltage-controlled capacitive element and semiconductor integrated circuit
    • 压控电容元件和半导体集成电路
    • US07211875B2
    • 2007-05-01
    • US10819123
    • 2004-04-07
    • Susumu KurosawaYuki FujimotoYasutaka Nakashiba
    • Susumu KurosawaYuki FujimotoYasutaka Nakashiba
    • H01L29/66
    • H01L29/94
    • An N well is disposed in the upper surface of a P type substrate, a gate insulating film and a gate electrode are disposed thereon, and the gate electrode is connected to a gate terminal. Two p+ diffusion regions are placed in two areas in the surface of the N well sandwiching the gate electrode, and the p+ diffusion regions are connected to a ground potential wiring. Further, an n+ diffusion region is disposed in the surface of the N well, and is connected to a well terminal. Accordingly, capacitance is generated between the gate electrode and the N well of a varactor element. When the potential of the gate terminal is decreased, the two p+ diffusion regions absorb positive holes serving as minority carriers from a channel region.
    • 在P型基板的上表面设置有N阱,栅极绝缘膜和栅电极配置在其上,栅电极与栅极端子连接。 两个p + +扩散区被放置在夹入栅电极的N阱表面的两个区域中,并且p + +扩散区连接到地电位布线。 此外,n阱扩散区域设置在N阱的表面中,并且连接到阱端子。 因此,在变容二极管元件的栅电极和N阱之间产生电容。 当栅极端子的电位降低时,两个p + SUP扩散区域从沟道区域吸收用作少数载流子的正空穴。
    • 78. 发明申请
    • Solid-state image sensing device and method for manufacturing the same
    • 固体摄像装置及其制造方法
    • US20060022230A1
    • 2006-02-02
    • US11155643
    • 2005-06-20
    • Junichi YamamotoYasutaka Nakashiba
    • Junichi YamamotoYasutaka Nakashiba
    • H01L21/00H01L31/062
    • H01L27/14689H01L27/14634H01L27/14806
    • In the solid-state image sensing device, a first N type semiconductor region and an N well of a PMOS region are formed in the same process, thereby making the first N type semiconductor region and the N well in the PMOS region substantially equal in N type impurity concentration-depth profile. By forming the first N type semiconductor region and the N well in the same process, the number of manufacturing process for the solid-state image sensing device can be decreased. It is, therefore, possible to suppress excessive application of heat history to the solid-state image sensing device during ion implantation and diffusion of N type impurity. Accordingly, by suppressing excessive diffusion of impurity and the like resulting from the excessive application of the heat history to the solid-state image sensing device, yield of the solid-state image sensing device can be improved.
    • 在固态摄像装置中,以相同的工序形成PMOS区域的第一N型半导体区域和N阱,由此使PMOS区域中的第一N型半导体区域和N阱在N上基本相等 型杂质浓度 - 深度剖面。 通过在相同的工艺中形成第一N型半导体区域和N阱,可以减少固态图像感测装置的制造工艺的数量。 因此,可以在N型杂质的离子注入和扩散期间抑制对固态摄像装置的过热应用。 因此,通过抑制由于过度地将热历史应用于固体摄像装置而导致的杂质等的过度扩散,能够提高固体摄像装置的产量。
    • 80. 发明授权
    • Solid state image sensor and method for fabricating the same
    • 固态图像传感器及其制造方法
    • US06784015B2
    • 2004-08-31
    • US10214301
    • 2002-08-08
    • Keisuke HatanoYasutaka Nakashiba
    • Keisuke HatanoYasutaka Nakashiba
    • H01L2100
    • H01L27/14689H01L27/14806
    • In a solid state image sensor, tranfer electrodes are formed by selectively etch-removing a single layer of conducting electrode material at a plurality of first regions which divide the single layer of conducting electrode material in a row direction for each one pixel. A patterned mask is formed to cover the first regions and the single layer of conducting electrode material but to expose the single layer of conducting electrode material at a second region above each of the photoelectric conversion sections, and the single layer of conducting electrode material is selectively etch-removed using the patterned mask as a mask. Thereafter, a first conductivity type impurity and a second conductivity type impurity are ion-implanted using the patterned mask and the single layer of conducting electrode material as a mask, to form the photoelectric conversion section at the second region.
    • 在固态图像传感器中,通过在多个第一区域选择性地蚀刻除去单层导电电极材料形成转移电极,该多个第一区域对于每一个像素将行的每一个像素的单层导电电极材料划分。 形成图案化掩模以覆盖第一区域和单层导电电极材料,但是在每个光电转换部分上方的第二区域处暴露单层导电电极材料,并且单层导电电极材料选择性地 使用图案化掩模作为掩模蚀刻去除。 此后,使用图案化掩模和单层导电电极材料作为掩模将第一导电类型杂质和第二导电类型杂质离子注入,以在第二区域形成光电转换部。