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    • 74. 发明授权
    • Image sensor module and method of manufacturing the same
    • 图像传感器模块及其制造方法
    • US08232131B2
    • 2012-07-31
    • US13042684
    • 2011-03-08
    • Sung Min Kim
    • Sung Min Kim
    • H01L21/66H01L31/02H01L31/0224
    • H01L27/14618H01L27/14687H01L2224/13
    • An image sensor module includes a semiconductor chip. Photodiode units are disposed in an active region of the semiconductor chip to convert light into electric signals. Pads are disposed in a peripheral region formed around the active region and the pads are electrically connected to the photodiode units. A connecting region is formed around the peripheral region. Re-distribution layers are electrically connected to respective pads and extend to the connecting region. A transparent substrate covers the photodiode units and the pads and exposes at least a portion of the re-distribution layers. Connecting layers are electrically connected to the respective re-distribution layers and extend to a top surface of the transparent substrate. Connecting members are connected to the respective connecting layers disposed on the top surface of the transparent substrate.
    • 图像传感器模块包括半导体芯片。 光电二极管单元设置在半导体芯片的有源区域中,以将光转换为电信号。 垫片设置在围绕有源区域形成的周边区域中,并且焊盘电连接到光电二极管单元。 围绕周边区域形成连接区域。 再分布层电连接到相应的焊盘并延伸到连接区域。 透明基板覆盖光电二极管单元和焊盘并暴露至少一部分再分布层。 连接层电连接到相应的再分布层并延伸到透明基底的顶表面。 连接构件连接到设置在透明基板的顶表面上的各个连接层。