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    • 72. 发明专利
    • MANUFACTURE OF SEMICONDUCTOR DEVICE
    • JPH10294274A
    • 1998-11-04
    • JP11631797
    • 1997-04-18
    • NIPPON STEEL CORP
    • HAMAMURA HIDEYUKI
    • G03F7/11H01L21/027
    • PROBLEM TO BE SOLVED: To provide the forming method of a resist pattern, which prevents halation and improves dimension controllability, without the occurrence of the film wear of resist and the deterioration of a form even if a reflection preventing film is used at the time of forming a resist pattern. SOLUTION: An etched film 20 being a high reflection film having a step on a semiconductor substrate 40 and the reflection preventing film 50 coats the etched film 20. The reflection preventing film 50 is etched back until the flat part of the etched film 20 is exposed. Since the film thickness of the reflection preventing film 50 of the step part in the etched film 20 is thick compared to the flat part, the reflection preventing film 50 is formed in the step part of the etched film 20. Thus, halation owing to the step can be prevented at the time of forming the resist pattern and it is not necessary to etch the reflection preventing film 50 after the resist pattern is formed. Then, dimension controllability improves since the film wear of the resist and the occurrence form deterioration do not occur.
    • 73. 发明专利
    • FORM MEASURING DEVICE
    • JPH0763527A
    • 1995-03-10
    • JP16249793
    • 1993-06-30
    • NIPPON STEEL CORP
    • MATSUBARA TOSHIROHAMAMURA HIDEYUKI
    • G01B11/24G06T1/00G06T7/00
    • PURPOSE:To calculate the three-dimensional coordinate of a measuring surface from the slippage between respective stripes of stripe pattern images on a standard plane and the measuring surface and the position (x), (y) of the picture element of the measuring surface, and precisely perform a form measurement at high speed. CONSTITUTION:A standard plane is preliminarily set instead of a subject 9 to be measured, and a change-over switch 4 is connected to (a)-side to store 5 a stripe pattern image. The standard plane is vertical to the optical axis of a television camera 2, and the distances to respective lens centers of the camera 2 and a projecting device 1 are equally set. At a measurement, the subject 9 is placed instead of the standard plane, and the switch 4 is connected to (b)-side to photograph 2 the stripe pattern image. The stripe pattern 11a of the subject 9 and the stored 5 stripe pattern 1b of the standard plane show thick stripe images, and the two images are compared to each other by a slippage measuring circuit 6 to measure the x-directional slippage between the strips. The x, y-coordinate of the picture element of the pattern image of the subject 9 is also measured 7. A form arithmetic circuit 8 calculates and outputs the space coordinate of a measuring point by use of the slippage and the x,y-coordinate of the picture element.
    • 74. 发明专利
    • TENSION DISTRIBUTION MEASURING METHOD
    • JPH06249725A
    • 1994-09-09
    • JP3705993
    • 1993-02-25
    • NIPPON STEEL CORP
    • MATSUBARA TOSHIROHAMAMURA HIDEYUKI
    • G01L5/04
    • PURPOSE:To allow accurate measurement of tension distribution by calculating a tension distribution under a desired temperature distribution based on the distribution of uniform tension and the magnitude of thermal expansion or contraction. CONSTITUTION:Value of uniform tension is determined according to a formula representative of relationship between the oscillation frequency of 1-1st order oscillation mode and tension per unit crosssectional area. Tension distribution for a predetermined value of temperature distribution is then determined according to a predetermined calculation formula derived from a uniform tension formula. The calculation formula includes coefficient of linear expansion, Young' s modulus, Poisson ratio, dendity, thickness of a band material 1 and the distance between rolls 2a, 2b. When they are given, tension distribution under desired temperature distribution can be determined by measuring the temperature distribution and oscillation frequency under 1-1st order oscillation mode of heated band material 1. Since the value of uniform tension is determined and thermal expansion or contraction is corrected based on the value thus determined, tension distribution can be determined accurately.