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71. 发明授权

US07532418B2 Lens barrel and image pickup apparatus 失效
标题翻译：镜筒和摄像装置
公开(公告)号：US07532418B2
公开(公告)日：2009-05-12
申请号：US11594078
申请日：2006-11-08
申请人： Tougo Teramoto , Yoshiharu Takahashi
发明人： Tougo Teramoto , Yoshiharu Takahashi
IPC分类号： G02B7/02
CPC分类号： G03B17/17 , G02B7/102 , G03B13/34
摘要： A lens barrel includes: a plurality of lens groups arranged on an optical axis; and at least one reflection surface arranged on the optical axis for bending the optical axis into a plurality of optical axis segments. Among the optical axis segments, at least two lens groups are arranged on different optical axis segments. The lens barrel further includes a lens drive section including a first driving source, for moving the at least two lens groups along the different optical axis segments respectively by using the first driving source.
摘要翻译：镜筒包括：布置在光轴上的多个透镜组; 以及布置在光轴上的用于将光轴弯曲成多个光轴段的至少一个反射表面。在光轴段中，至少两个透镜组布置在不同的光轴段上。透镜筒还包括透镜驱动部分，该透镜驱动部分包括第一驱动源，用于通过使用第一驱动源分别沿不同的光轴段移动至少两个透镜组。

72. 发明申请

US20080226319A1 Image Forming Apparatus 有权
标题翻译：图像形成装置
公开(公告)号：US20080226319A1
公开(公告)日：2008-09-18
申请号：US12048846
申请日：2008-03-14
申请人： Yoshiharu Takahashi , Tadashi Okano
发明人： Yoshiharu Takahashi , Tadashi Okano
IPC分类号： G03G15/08
CPC分类号： G03G21/1633 , G03G21/1647 , G03G2221/163 , G03G2221/1678 , G03G2221/18
摘要： An image forming apparatus including a plurality of developing devices each having a plurality of guide parts on both lateral sides, a frame body having a plurality of guide members configured to receive the guide parts of the developing devices, a front door for receiving and removing the developing devices from the frame body, and a position regulating member having a plurality of regulating parts and a connecting part configured to connect each regulating part, the position regulating member having an L-shape to regulate movement of the plurality of developing devices, each end of the regulating part configured to be placed between the guide part and the guide member, and the connecting part configured to be placed between the developing devices and the front door.
摘要翻译：一种图像形成装置，包括多个显影装置，每个显影装置在两个侧面上具有多个引导部分，框架主体具有构造成容纳显影装置的引导部分的多个引导部件，前门，用于接收和移除显影装置，以及具有多个限制部件的位置限制部件和被构造成连接各调节部件的连接部件，该调节部件具有L形的位置限制部件，以调节多个显影装置的运动，每个端部所述限制部件被构造成被布置在所述引导部分和所述引导部件之间，并且所述连接部件构造成被放置在所述显影装置和所述前门之间。

73. 发明授权

US07219909B2 Front suspension device for automotive vehicle 有权
标题翻译：汽车前悬挂装置
公开(公告)号：US07219909B2
公开(公告)日：2007-05-22
申请号：US10781798
申请日：2004-02-20
申请人： Shigeki Furutani , Atsushi Tsuge , Naoki Ikeda , Yoshiharu Takahashi , Susumu Sano , Yoshitada Toyoshima , Hiromune Ohhashi , Toshiaki Aoki
发明人： Shigeki Furutani , Atsushi Tsuge , Naoki Ikeda , Yoshiharu Takahashi , Susumu Sano , Yoshitada Toyoshima , Hiromune Ohhashi , Toshiaki Aoki
IPC分类号： B60G3/20
CPC分类号： B60G15/067 , B60G3/20 , B60G15/062 , B60G2200/18 , B60G2200/46 , B60G2200/462 , B60G2202/12 , B60G2202/312 , B60G2204/124 , B60G2204/128 , B60G2204/418 , B60G2204/43 , B60G2204/44 , B60G2204/61 , B60G2206/91
摘要： In a front suspension device for an automotive vehicle, in which wheel support members of right and left front wheels are coupled with each other via a steering unit, outer ends of two lower arms are pivotally attached to the wheel support members, and inner ends of two lower arms are pivotally attached to a vehicle body via a resilient member, there are provided a damping device equipped with a coil spring and attached to one of the two lower arms at its lower end and to the vehicle body at its upper end respectively, and a suppression (rotational torque absorption) device for suppressing a toe-change of the front wheels caused by a rotational torque applied according to extension and contraction of the coil spring of the damping device.
摘要翻译：在前车辆的前悬挂装置中，右前轮和左前轮的车轮支撑构件经由转向装置彼此联接，两个下臂的外端可枢转地附接到车轮支撑构件，两个下臂通过弹性构件可枢转地连接到车体上，设置有一个装有螺旋弹簧的阻尼装置，并分别在其下端附着到两个下臂中的一个并在其上端分别连接到车身上，以及用于抑制由根据阻尼装置的螺旋弹簧的伸缩引起的旋转扭矩引起的前轮的趾部变形的抑制（旋转扭矩吸收）装置。

74. 发明授权

US06753911B1 Zooming lens barrel and a camera in use therewith 失效
标题翻译：变焦镜头镜筒和使用的相机
公开(公告)号：US06753911B1
公开(公告)日：2004-06-22
申请号：US09491741
申请日：2000-01-27
申请人： Tomokazu Yamada , Yoshio Shimazaki , Yoshiharu Takahashi
发明人： Tomokazu Yamada , Yoshio Shimazaki , Yoshiharu Takahashi
IPC分类号： H04N5262
CPC分类号： H04N5/2254 , G02B7/10 , G02B7/102
摘要： A camera having a zooming function, including plural lens groups, a fixed frame fixed to a main body of the camera, a cam member engaging with the fixed frame so that the cam member is movable in the optical axis direction of the lens groups, and plural lens group supporting frames each engaging with the cam member and supporting each of the plural lens groups so that the lens group supporting frames may move in the optical axis direction to move the lens groups in the optical axis direction.
摘要翻译：具有变焦功能的摄像机，包括多个透镜组，固定在照相机主体上的固定框架，与固定框架接合的凸轮构件，使得凸轮构件能够在透镜组的光轴方向上移动;以及多个透镜组支撑框架，其各自与凸轮构件接合并支撑多个透镜组中的每一个，使得透镜组支撑框架可以沿光轴方向移动，以沿光轴方向移动透镜组。

75. 发明授权

US06650012B1 Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：US06650012B1
公开(公告)日：2003-11-18
申请号：US09629899
申请日：2000-07-31
申请人： Yoshiharu Takahashi
发明人： Yoshiharu Takahashi
IPC分类号： H01L2304
CPC分类号： H01L23/4334 , H01L21/4832 , H01L21/565 , H01L23/3107 , H01L23/4951 , H01L23/49548 , H01L24/45 , H01L24/48 , H01L2224/16 , H01L2224/16245 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/48095 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014 , H01L2924/01079 , H01L2924/15311 , H01L2924/181 , H01L2924/18165 , H05K3/3426 , H05K3/3436 , Y02P70/613 , H01L2924/00 , H01L2224/05599 , H01L2924/00012
摘要： A semiconductor device using a lead frame as a wiring base member, in which lead electrodes connected to a semiconductor chip through a connecting lead are arranged radially around the semiconductor chip having an upper surface and an under surface. The semiconductor chip, connecting leads, and lead electrodes are integrally sealed in a resin. Each of the lead electrodes includes a thin internal lead portion having a connection part on an upper surface side, and a thick external electrode portion protruding toward an under surface side to form a connection part. The resin has an underside which is substantially co-planar with the under surface of the internal lead portion of the lead electrodes, and the external electrode portion protrudes from the underside of the resin.
摘要翻译：使用引线框架作为布线基底构件的半导体器件，其中通过连接引线连接到半导体芯片的引线电极围绕具有上表面和下表面的半导体芯片径向布置。半导体芯片，连接引线和引线电极被一体地密封在树脂中。每个引线电极包括具有在上表面侧上的连接部分的薄内部引线部分和向下表面侧突出的厚的外部电极部分，以形成连接部分。树脂具有与引线电极的内部引线部分的下表面基本共面的下侧，并且外部电极部分从树脂的下侧突出。

76. 发明授权

US06563209B1 Lead frame for semiconductor device 有权
标题翻译：半导体器件引线框架
公开(公告)号：US06563209B1
公开(公告)日：2003-05-13
申请号：US09629900
申请日：2000-07-31
申请人： Yoshiharu Takahashi
发明人： Yoshiharu Takahashi
IPC分类号： H01L2348
CPC分类号： H01L21/565 , H01L21/4832 , H01L23/3107 , H01L23/49548 , H01L24/45 , H01L24/48 , H01L24/97 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/48095 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014 , H01L2924/01079 , H01L2924/15311 , H01L2924/181 , H01L2924/18165 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： A lead frame for a semiconductor device using the lead frame as a wiring base member includes a plate-like body having a non-planar upper surface and a planar under surface. The plate-like body includes a first thin portion for mounting a semiconductor chip having pad electrodes, first thick portions radially arranged around the first thin portion for forming lead electrodes respectively corresponding to the pad electrodes, a second thin portion located between pairs of the first thick portions, a third thin portion peripherally surrounding the first thick portions, and a second thick portion surrounding the third thin portion. The first, second, and third thin portions have substantially the same thickness. A concave part having a circumferential portion is defined by the thin portions, and a projecting part is defined by the thick portions.
摘要翻译：使用引线框架作为布线基底构件的半导体器件的引线框架包括具有非平面上表面和平面下表面的板状体。板状体包括用于安装具有焊盘电极的半导体芯片的第一薄部分，围绕第一薄部分径向布置的第一厚部分，用于形成分别对应于焊盘电极的引线电极;位于第一部分之间的第二薄部分厚的部分，周边围绕第一厚部分的第三薄部分和围绕第三薄部分的第二厚部分。第一，第二和第三薄部分具有基本上相同的厚度。具有圆周部分的凹部由薄壁部分限定，并且突出部分由厚部分限定。

77. 发明授权

US06454158B1 Wire bonding apparatus and wire bonding method of semiconductor device 失效
标题翻译：半导体器件的接线装置和引线接合方法
公开(公告)号：US06454158B1
公开(公告)日：2002-09-24
申请号：US09617250
申请日：2000-07-14
申请人： Yoshiharu Takahashi
发明人： Yoshiharu Takahashi
IPC分类号： B23K106
CPC分类号： H01L24/85 , H01L23/49503 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/78 , H01L2224/05554 , H01L2224/05624 , H01L2224/29007 , H01L2224/32014 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48095 , H01L2224/48247 , H01L2224/48465 , H01L2224/48624 , H01L2224/48724 , H01L2224/48824 , H01L2224/49171 , H01L2224/73265 , H01L2224/78251 , H01L2224/78703 , H01L2224/78743 , H01L2224/85045 , H01L2224/85205 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/181 , H01L2924/3511 , H01L2224/78 , H01L2924/00 , H01L2924/00015 , H01L2924/00012
摘要： A wire bonding apparatus for connecting a semiconductor device including a semiconductor chip, to a lead frame having a die pad to which the semiconductor chip is joined, through a plurality of inner leads aligned along a periphery of the die pad at intervals. The apparatus includes a heat block having an inner lead mounting portion for mounting the inner leads, a concave portion located inward of the inner lead mounting portion, and at least one supporting pad for mounting the semiconductor chip. Restoration of the lead frame at wire bonding portions is decreased at the time a lead frame forcing mold holding the lead frame to heat block is detached.
摘要翻译：一种用于将包括半导体芯片的半导体器件连接到具有连接有半导体芯片的管芯焊盘的引线框架的引线接合装置，通过沿着管芯焊盘的周边间隔排列的多个内部引线。该装置包括具有用于安装内引线的内引线安装部分，位于内引线安装部分内侧的凹部和用于安装半导体芯片的至少一个支撑焊盘的加热块。在将引线框架保持在加热块上的强制模具的引线框架被分离时，引线接合部分处的引线框架的恢复被减小。

78. 发明授权

US06260195B1 Cable television system and terminal device for cable television system 失效
标题翻译：有线电视系统和有线电视系统的终端设备
公开(公告)号：US06260195B1
公开(公告)日：2001-07-10
申请号：US08841921
申请日：1997-04-08
申请人： Yoshiharu Takahashi
发明人： Yoshiharu Takahashi
IPC分类号： H04N716
CPC分类号： H04N21/435 , H04N7/165 , H04N21/235 , H04N21/241 , H04N21/4383 , H04N21/4432 , H04N21/4786 , H04N21/4788 , H04N21/4882 , H04N21/6543
摘要： Disclosed is a cable television system including a broadcasting center and terminal devices. When a notification data is to be transmitted to each terminal device, the broadcasting center transmits a channel data indicating a channel through which the notification data is transmitted. The terminal device, upon receipt of the channel data, stores the channel data in a memory. When the terminal device is turned OFF, the last viewed channel number is stored in the memory. When, the terminal device is turned ON, if the channel data transmitted from the broadcasting center is stored in the memory, the terminal device is tuned in the channel indicated by the channel data, while if the channel data is not stored in the memory, the terminal device is tuned in the last viewed channel.
摘要翻译：公开了一种包括广播中心和终端设备的有线电视系统。当通知数据要被发送到每个终端设备时，广播中心发送指示通知数据被发送的频道的频道数据。终端设备在接收到通道数据时，将通道数据存储在存储器中。当终端设备关闭时，最后观看的频道号码存储在存储器中。当终端设备接通时，如果从广播中心发送的频道数据存储在存储器中，则终端设备被调谐到由频道数据指示的频道中，而如果频道数据没有被存储在存储器中，终端设备被调谐到最后观看的频道。

79. 发明授权

US06245599B1 Circuit wiring system circuit wiring method semi-conductor package and semi-conductor package substrate 失效
标题翻译：电路布线系统电路布线方法半导体封装和半导体封装衬底
公开(公告)号：US06245599B1
公开(公告)日：2001-06-12
申请号：US09456508
申请日：1999-12-08
申请人： Akihiro Goto , Hirochika Kawaguchi , Yoshiharu Takahashi , Takao Takahashi , Takashi Arita , Satoshi Ookyuu , Hirokazu Taki
发明人： Akihiro Goto , Hirochika Kawaguchi , Yoshiharu Takahashi , Takao Takahashi , Takashi Arita , Satoshi Ookyuu , Hirokazu Taki
IPC分类号： H01L2166
CPC分类号： G06F17/5077 , G06F2217/40 , H01L23/49816 , H01L23/49838 , H01L24/48 , H01L24/49 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/49175 , H01L2924/00014 , H01L2924/01019 , H01L2924/01039 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： The primary objective of the present invention is to select a connecting combination of the plurality of solder ball connection pads and the plurality of wire bond pads, and generate an optimum wiring candidate. For this objective, the wiring pattern generation unit generates a wiring pattern as the information for specifying an in-area wiring route to be wired in each row and an in-area wiring route to be connected to the next row among the solder ball connection pad area closer to the wire bond pad area, based on the design conditions of the wiring route stored in the design condition memory. Then, the wiring plan generation unit generates a wiring plan laying out the plurality of wiring routes by combining the wiring patterns generated for each row, and the wiring rule check unit selects some of the generated wiring plans suited for the wiring rules and generates the plurality of wiring candidates. Furthermore, the quality rating unit rates the generated wiring candidates and selects the best wiring candidate.
摘要翻译：本发明的主要目的是选择多个焊球连接焊盘和多个引线接合焊盘的连接组合，并且生成最佳布线候选。为此目的，布线图案生成单元生成布线图案，作为用于指定要在每行中进行布线的区域内布线路线的信息和要连接到焊球连接垫中的下一行的区域内布线路线基于存储在设计条件存储器中的布线路线的设计条件，更靠近导线焊盘区域的区域。然后，布线计划生成单元通过组合为每行生成的布线图案来生成布置多条布线路线的布线图，并且布线规则检查单元选择适合布线规则的一些生成的布线图，并且生成多个接线候选人。此外，质量评级单元对生成的接线候选进行评估，并选择最佳布线候选。

80. 发明授权

US06181009B2 Electronic component with a lead frame and insulating coating 失效
标题翻译：电子元件带引线框架和绝缘涂层
公开(公告)号：US06181009B2
公开(公告)日：2001-01-30
申请号：US09249089
申请日：1999-02-12
申请人： Yoshiharu Takahashi , Toshiaki Shinohara
发明人： Yoshiharu Takahashi , Toshiaki Shinohara
IPC分类号： H01L2350
CPC分类号： H01L23/4951 , H01L21/563 , H01L23/3107 , H01L23/3121 , H01L23/3128 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/81 , H01L2224/05554 , H01L2224/13144 , H01L2224/16 , H01L2224/32245 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/4826 , H01L2224/48465 , H01L2224/49171 , H01L2224/73203 , H01L2224/81801 , H01L2224/83894 , H01L2224/85181 , H01L2224/85205 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01039 , H01L2924/01047 , H01L2924/01057 , H01L2924/01067 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/10329 , H01L2924/12041 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/20752 , H01L2924/30105 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： An electronic component includes an insulating coating that is electrically conductive when heated disposed on a portion of a surface of a semiconductor chip; electrodes disposed on the surface of the semiconductor chip elsewhere; and inner leads extending from a lead frame and anodically bonded to the insulating coating so that the inner leads are electrically coupled to the electrodes.
摘要翻译：电子部件包括绝缘涂层，其在被加热时设置在半导体芯片的表面的一部分上是导电的; 设置在其他地方的半导体芯片的表面上的电极; 以及从引线框架延伸并阳极结合到绝缘涂层的内部引线，使得内部引线电耦合到电极。

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