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71. 发明申请

US20110315353A1 LIQUID-COOLED ELECTRONICS RACK WITH IMMERSION-COOLED ELECTRONIC SUBSYSTEMS AND VERTICALLY-MOUNTED, VAPOR-CONDENSING UNIT 有权
标题翻译：液体冷却电子机架，具有浸入式冷却电子辅机和垂直安装的蒸汽冷凝器
公开(公告)号：US20110315353A1
公开(公告)日：2011-12-29
申请号：US12825745
申请日：2010-06-29
申请人： Levi A. CAMPBELL , Richard C. CHU , Michael J. ELLSWORTH, JR. , Madhusudan K. IYENGAR , Robert E. SIMONS
发明人： Levi A. CAMPBELL , Richard C. CHU , Michael J. ELLSWORTH, JR. , Madhusudan K. IYENGAR , Robert E. SIMONS
IPC分类号： F28D15/00 , F25B41/00
CPC分类号： H05K7/20809
摘要： Liquid-cooled electronics racks are provided which include: immersion-cooled electronic subsystems; a vertically-oriented, vapor-condensing unit facilitating condensing dielectric fluid vapor egressing from the immersion-cooled subsystems, the vertically-oriented, vapor-condensing unit being sized and configured to reside adjacent to at least one side of the electronics rack; a reservoir for holding dielectric fluid, the reservoir receiving dielectric fluid condensate from the vertically-oriented, vapor-condensing unit; a dielectric fluid supply manifold coupling in fluid communication the reservoir and the dielectric fluid inlets of the immersion-cooled electronic subsystems; and a pump associated with a reservoir for pumping under pressure dielectric fluid from the reservoir to the dielectric fluid supply manifold for maintaining dielectric fluid in a liquid state within the immersion-cooled electronic subsystems.
摘要翻译：提供液冷电子机架，包括：浸入式冷却电子子系统; 垂直取向的蒸气冷凝单元，其有助于冷凝来自浸没冷却子系统的介电流体蒸汽，所述垂直取向的蒸汽冷凝单元的尺寸和构造为邻近电子机架的至少一侧驻留; 用于保持介电流体的储存器，所述储存器从垂直取向的蒸汽冷凝单元接收介质流体冷凝物; 介质流体供应歧管联接以使浸没冷却的电子子系统的储存器和电介质流体入口流体连通; 以及与储存器相关联的泵，用于在压力介质流体下从介质流体供应歧管压力介质流体，用于将浸没冷却的电子子系统内的介质流体保持在液态。

72. 发明申请

US20110315344A1 INTERLEAVED, IMMERSION-COOLING APPARATUS AND METHOD FOR AN ELECTRONIC SUBSYSTEM OF AN ELECTRONICS RACK 有权
标题翻译：用于电子机架的电子子系统的交互式冷却装置和方法
公开(公告)号：US20110315344A1
公开(公告)日：2011-12-29
申请号：US12825761
申请日：2010-06-29
申请人： Levi A. CAMPBELL , Richard C. CHU , Michael J. ELLSWORTH, JR. , Madhusudan K. IYENGAR , Robert E. SIMONS
发明人： Levi A. CAMPBELL , Richard C. CHU , Michael J. ELLSWORTH, JR. , Madhusudan K. IYENGAR , Robert E. SIMONS
IPC分类号： F28F7/00
CPC分类号： F28F3/04 , F28D2021/0031 , F28F3/12 , G06F1/20 , G06F2200/201 , H05K7/20236 , H05K7/20827
摘要： Cooling apparatus and method are provided for immersion-cooling of an electronic subsystem of an electronics rack. The cooling apparatus includes a housing at least partially surrounding and forming a sealed compartment about the electronic subsystem and a dielectric fluid disposed within the sealed compartment so that the electronic subsystem is immersed within the dielectric fluid. A liquid-cooled vapor condenser is provided which includes a plurality of thermally conductive condenser fins extending within the sealed compartment. The condenser fins facilitate cooling and condensing of dielectric fluid vapor generated within the sealed compartment. Within the sealed compartment, multiple thermally conductive condenser fins are interleaved with multiple electronic components immersed within the dielectric fluid to facilitate localized cooling and condensing of dielectric fluid vapor between the multiple electronic components.
摘要翻译：提供冷却装置和方法用于电子机架的电子子系统的浸没冷却。冷却装置包括至少部分围绕电子子系统和形成密封隔室的壳体，以及设置在密封隔间内的电介质流体，使得电子子系统浸没在电介质流体内。提供了液体冷却的蒸汽冷凝器，其包括在密封隔室内延伸的多个导热冷凝器翅片。冷凝器翅片促进在密封隔室内产生的介电流体蒸气的冷却和冷凝。在密封隔室内，多个导热冷凝器翅片与浸没在电介质流体内的多个电子部件交错，以便于多个电子部件之间的介电流体蒸气的局部冷却和冷凝。

73. 发明申请

US20110069454A1 LIQUID-COOLED ELECTRONICS APPARATUS AND METHODS OF FABRICATION 失效
标题翻译：液体冷却电子设备和制造方法
公开(公告)号：US20110069454A1
公开(公告)日：2011-03-24
申请号：US12566081
申请日：2009-09-24
申请人： Levi A. CAMPBELL , Richard C. CHU , Michael J. ELLSWORTH, JR. , Madhusudan K. IYENGAR , Michael RIZZOLO , Robert E. SIMONS
发明人： Levi A. CAMPBELL , Richard C. CHU , Michael J. ELLSWORTH, JR. , Madhusudan K. IYENGAR , Michael RIZZOLO , Robert E. SIMONS
IPC分类号： H05K7/20
CPC分类号： H05K7/2079
摘要： Liquid-cooled electronics apparatuses and methods are provided. The cooled electronics apparatuses include a liquid-cooled cold rail and an electronics subassembly. The liquid-cooled cold rail has a thermally conductive structure and a coolant-carrying channel extending within and cooling the thermally conductive structure. The electronics subassembly includes an electronics card(s) and one or more thermal transfer plates. The electronics card(s) includes electronic devices to be cooled, and the one or more thermal transfer plates are each rigidly affixed to one or more electronic devices of the electronics card(s). Each thermal transfer plate is thermally conductive and couples the electronics subassembly to the liquid-cooled cold rail to thermally interface the one or more electronic devices to the liquid-cooled cold rail to facilitate cooling of the electronic devices. In one embodiment, the electronics subassembly includes multiple interleaved electronics cards and thermal transfer plates.
摘要翻译：提供液冷电子设备和方法。冷却的电子设备包括液冷冷轨和电子组件。液冷冷轨具有导热结构和在导热结构内延伸并冷却导热结构的冷却剂承载通道。电子组件包括电子卡和一个或多个热传递板。电子卡片包括要冷却的电子设备，并且一个或多个热转印板每个刚性地固定到电子卡的一个或多个电子设备。每个热传递板是导热的并且将电子组件耦合到液冷冷轨，以将一个或多个电子设备热连接到液冷冷轨，以便电子设备的冷却。在一个实施例中，电子组件包括多个交错电子卡和热转印板。

74. 发明申请

US20100328890A1 CONDENSER STRUCTURES WITH FIN CAVITIES FACILITATING VAPOR CONDENSATION COOLING OF COOLANT 失效
标题翻译：冷凝器冷凝器结构使冷凝器的蒸气冷凝冷却
公开(公告)号：US20100328890A1
公开(公告)日：2010-12-30
申请号：US12491287
申请日：2009-06-25
申请人： Levi A. CAMPBELL , Richard C. CHU , Michael J. ELLSWORTH, JR. , Madhusudan K. IYENGAR , Robert E. SIMONS
发明人： Levi A. CAMPBELL , Richard C. CHU , Michael J. ELLSWORTH, JR. , Madhusudan K. IYENGAR , Robert E. SIMONS
IPC分类号： H05K7/20 , F25B23/00 , B23P17/00
CPC分类号： F28D15/0266 , F28F3/02 , F28F3/022 , H05K7/203 , H05K7/20318 , H05K7/20809 , Y10S165/908 , Y10T29/49002
摘要： Vapor condensers and cooling apparatuses are provided which facilitate vapor condensation cooling of a coolant employed in cooling an electronic device. The vapor condenser includes a thermally conductive base structure with a plurality of condenser fins extending from the base structure. The condenser fins have a proximal end coupled to the base structure and a remote end remote from the base structure. At least one exposed cavity is provided within each condenser fin extending from the remote end towards the proximal end. The exposed cavities are sized to provide greater condenser fin surface area for facilitating vapor condensate formation, and thereby facilitate cooling of an electronic device using a two-phase coolant.
摘要翻译：提供蒸汽冷凝器和冷却装置，其有助于冷却电子装置中所用的冷却剂的蒸气冷凝冷却。蒸汽冷凝器包括具有从基部结构延伸的多个冷凝器翅片的导热基底结构。冷凝器翅片具有连接到基部结构的近端和远离基部结构的远端。在从远端朝向近端延伸的每个冷凝器翅片内设置至少一个暴露的空腔。暴露的空腔的尺寸设置成提供更大的冷凝器翅片表面积，以便于蒸气冷凝物的形成，从而便于使用两相冷却剂冷却电子装置。

75. 发明申请

US20100328888A1 COOLING APPARATUS WITH THERMALLY CONDUCTIVE POROUS MATERIAL AND JET IMPINGEMENT NOZZLE(S) EXTENDING THEREIN 有权
标题翻译：具有导热多孔材料的冷却装置和喷射喷嘴（S）延伸
公开(公告)号：US20100328888A1
公开(公告)日：2010-12-30
申请号：US12491325
申请日：2009-06-25
申请人： Levi A. CAMPBELL , Richard C. CHU , Michael J. ELLSWORTH, JR. , Madhusudan K. IYENGAR , Robert E. SIMONS
发明人： Levi A. CAMPBELL , Richard C. CHU , Michael J. ELLSWORTH, JR. , Madhusudan K. IYENGAR , Robert E. SIMONS
IPC分类号： H05K7/20 , F28D15/00 , B21D53/02
CPC分类号： H01L23/4735 , F28D15/0266 , F28F13/187 , H01L2924/0002 , Y10T29/4935 , H01L2924/00
摘要： A cooling apparatus and method of fabrication are provided for facilitating cooling of an electronic device. The cooling apparatus includes a thermally conductive porous material and a liquid coolant supply. The thermally conductive porous material (such as metal foam material) is coupled to a surface of the electronic device to be cooled, or a structure coupled to the electronic device. The liquid coolant supply includes a jet impingement structure, which includes one or more jet nozzles for directing liquid coolant onto the surface to be cooled. The jet nozzle(s) extends into the thermally conductive porous material, and facilitates delivery of liquid coolant onto the surface to be cooled. The thermally conductive porous material is in thermal contact with the surface to be cooled and facilitates cooling of the electronic device by boiling of the liquid coolant passing through the porous material.
摘要翻译：提供冷却装置和制造方法以便于电子装置的冷却。冷却装置包括导热多孔材料和液体冷却剂供应。导热多孔材料（例如金属泡沫材料）被耦合到要冷却的电子设备的表面，或耦合到电子设备的结构。液体冷却剂供应包括喷射冲击结构，其包括用于将液体冷却剂引导到要冷却的表面上的一个或多个喷嘴。喷射喷嘴延伸到导热多孔材料中，并且有助于将液体冷却剂输送到待冷却的表面上。导热多孔材料与要冷却的表面热接触，并且通过沸腾通过多孔材料的液体冷却剂来促进电子器件的冷却。

76. 发明申请

US20090072967A1 AUTO-LOCATING SYSTEM AND METHOD FOR DATA CENTER MAPPING AND MONITORING 失效
标题翻译：自动定位系统和数据中心映射和监控方法
公开(公告)号：US20090072967A1
公开(公告)日：2009-03-19
申请号：US11855185
申请日：2007-09-14
申请人： Levi A. CAMPBELL , Richard C. CHU , Michael J. ELLSWORTH, JR. , Madhusudan K. IYENGAR , Robert E. SIMONS
发明人： Levi A. CAMPBELL , Richard C. CHU , Michael J. ELLSWORTH, JR. , Madhusudan K. IYENGAR , Robert E. SIMONS
IPC分类号： H04Q7/00
CPC分类号： G01S13/876
摘要： Automated locating of electronics racks within a data center room is provided. The automated approach employs n wireless identification units associated with respective electronics racks of the data center, and first and second transceiver units positioned within the data center along a common plane at known X,Y locations. A monitor unit is in communication with the transceiver units, and automatically determines X,Y location within the data center room of each respective electronics rack employing, in part, first time differentials between transmission of a first broadcast signal by the first transceiver unit and receipt of response signals from the wireless identification units, second time differentials between transmission of a second broadcast signal from the second transceiver unit and receipt of response signals thereto from the wireless identification units, and the known X,Y locations within the data center of the transceiver units.
摘要翻译：提供数据中心室内电子机架的自动定位。自动化方法采用与数据中心的相应电子机架相关联的n个无线识别单元，以及沿着已知X，Y位置处的公共平面定位在数据中心内的第一和第二收发器单元。监视器单元与收发器单元通信，并且自动地确定每个相应电子机架的数据中心室内的X，Y位置，其部分地采用第一收发器单元发送第一广播信号和接收之间的第一时差来自无线识别单元的响应信号，来自第二收发器单元的第二广播信号的传输和从无线识别单元接收的响应信号之间的第二时间差以及收发器的数据中心内的已知X，Y位置单位。

77. 发明申请

US20120210731A1 THERMOELECTRIC-ENHANCED, VAPOR-COMPRESSION REFRIGERATION METHOD FACILITATING COOLING OF AN ELECTRONIC COMPONENT 有权
标题翻译：热电增强型蒸汽压缩制冷方法，使电子元件冷却
公开(公告)号：US20120210731A1
公开(公告)日：2012-08-23
申请号：US13451668
申请日：2012-04-20
申请人： Levi A. CAMPBELL , Richard C. CHU , Michael J. ELLSWORTH, JR. , Madhusudan K. IYENGAR , Robert E. SIMONS
发明人： Levi A. CAMPBELL , Richard C. CHU , Michael J. ELLSWORTH, JR. , Madhusudan K. IYENGAR , Robert E. SIMONS
IPC分类号： F25B21/02
CPC分类号： F25B21/02 , F25B40/00 , H05K7/20836
摘要： A method is provided for facilitating cooling of an electronic component. The method includes: providing a refrigerant loop configured for refrigerant to flow through the loop; coupling a compressor in fluid communication with the loop, wherein a first portion of the loop resides upstream of a refrigerant inlet of the compressor, and a second portion resides downstream; and disposing a controllable thermoelectric array in thermal communication with the refrigerant loop. The thermoelectric array is disposed with the first portion of the refrigerant loop at least partially in thermal contact with the first side of the array, and the second portion of the loop at least partially in thermal contact with a second side of the array. The array is controlled to ensure that refrigerant in the refrigerant loop entering the compressor is in a superheated thermodynamic state.
摘要翻译：提供了一种便于冷却电子部件的方法。该方法包括：提供构造成制冷剂流过环路的制冷剂回路; 联接压缩机与环路流体连通，其中环路的第一部分位于压缩机的制冷剂入口的上游，第二部分位于下游; 并配置可控热电阵列与制冷剂回路热连通。热电阵列设置成与制冷剂回路的第一部分至少部分地与阵列的第一侧热接触，并且环的第二部分至少部分地与阵列的第二侧热接触。控制阵列以确保进入压缩机的制冷剂回路中的制冷剂处于过热的热力学状态。

78. 发明申请

US20120199311A1 APPARATUS AND METHOD FOR FACILITATING SERVICING OF A LIQUID-COOLED ELECTRONICS RACK 有权
标题翻译：一种液体冷却电子机架的设备和方法
公开(公告)号：US20120199311A1
公开(公告)日：2012-08-09
申请号：US13447421
申请日：2012-04-16
申请人： Levi A. CAMPBELL , Richard C. CHU , Michael J. ELLSWORTH, JR. , Madhusudan K. IYENGAR , Robert E. SIMONS , Prabjit SINGH
发明人： Levi A. CAMPBELL , Richard C. CHU , Michael J. ELLSWORTH, JR. , Madhusudan K. IYENGAR , Robert E. SIMONS , Prabjit SINGH
IPC分类号： F28F27/00
CPC分类号： H05K7/20781 , Y10T29/49002 , Y10T29/4935 , Y10T29/49352 , Y10T29/49826
摘要： An apparatus for facilitating servicing of a liquid-cooled electronics rack is provided. The apparatus includes a coolant tank, a coolant pump in fluid communication with the coolant tank, multiple parallel-connected coolant supply lines coupling the coolant pump to a coolant supply port of the apparatus, and a coolant return port and a coolant return line coupled between the coolant return port and the coolant tank. Each coolant supply line includes a coolant control valve for selectively controlling flow of coolant therethrough pumped by the coolant pump from the coolant tank. At least one coolant supply line includes at least one filter, and one coolant supply line is a bypass line with no filter. When operational, the apparatus facilitates filling of coolant into a cooling system of a liquid-cooled electronics rack by allowing for selective filtering of coolant inserted into the cooling system.
摘要翻译：提供一种用于便利液体冷却电子机架的维修的装置。该设备包括冷却剂箱，与冷却剂箱流体连通的冷却剂泵，将冷却剂泵连接到设备的冷却剂供应端口的多个并联连接的冷却剂供应管线，以及冷却剂返回端口和冷却剂返回管线，冷却液返回口和冷却液箱。每个冷却剂供应管线包括冷却剂控制阀，用于选择性地控制由冷却剂泵从冷却剂箱泵送的冷却剂流。至少一个冷却剂供应管线包括至少一个过滤器，一个冷却剂供应管线是没有过滤器的旁路管路。当操作时，该装置通过允许选择性地过滤插入到冷却系统中的冷却剂，便于将冷却剂填充到液冷电子机架的冷却系统中。

79. 发明申请

US20120111035A1 COOLANT-BUFFERED, VAPOR-COMPRESSION REFRIGERATION APPARATUS AND METHOD WITH CONTROLED COOLANT HEAT LOAD 有权
标题翻译：冷却剂缓冲，蒸汽压缩制冷装置和方法与控制冷却热负荷
公开(公告)号：US20120111035A1
公开(公告)日：2012-05-10
申请号：US12939546
申请日：2010-11-04
申请人： Levi A. CAMPBELL , Richard C. CHU , Michael J. ELLSWORTH, JR. , Madhusudan K. IYENGAR , Robert E. SIMONS
发明人： Levi A. CAMPBELL , Richard C. CHU , Michael J. ELLSWORTH, JR. , Madhusudan K. IYENGAR , Robert E. SIMONS
IPC分类号： F25B41/00 , F25D31/00 , F25D17/06 , F25B1/00 , F25B43/00
CPC分类号： F25B49/02 , F25B25/005 , F25B2400/01 , F25B2400/06 , F25B2500/28 , F25B2600/13 , F25B2700/21171 , H05K7/20809 , H05K7/20836 , Y02B30/745
摘要： Apparatus and method are provided for cooling an electronic component. The apparatus includes a coolant-cooled structure in thermal communication with the component(s) to be cooled, and a coolant-to-refrigerant heat exchanger coupled in fluid communication with the coolant-cooled structure via a coolant loop to receive coolant from and supply coolant to the coolant-cooled structure. The apparatus further includes a refrigerant loop coupled in fluid communication with the coolant-to-refrigerant heat exchanger, and the heat exchanger cools coolant passing therethrough by dissipating heat from the coolant in the coolant loop to refrigerant in the refrigerant loop. A controllable coolant heater is associated with the coolant loop for providing an adjustable heat load on the coolant in the coolant loop to ensure at least a minimum heat load is dissipated from the coolant to the refrigerant passing through the heat exchanger.
摘要翻译：提供了用于冷却电子部件的装置和方法。该装置包括与要冷却的部件热连通的冷却剂冷却结构，以及通过冷却剂回路与冷却剂冷却结构流体连通地连接以冷却和供应的冷却剂与制冷剂热交换器冷却剂冷却剂冷却结构。该装置还包括与冷却剂 - 制冷剂热交换器流体连通的制冷剂回路，并且热交换器通过从冷却剂回路中的冷却剂向制冷剂回路中的制冷剂散热而冷却通过其中的冷却剂。可控制的冷却剂加热器与冷却剂回路相关联，以在冷却剂回路中的冷却剂上提供可调整的热负荷，以确保至少最小的热负荷从冷却剂消耗到通过热交换器的制冷剂。

80. 发明申请

US20120111027A1 THERMOELECTRIC-ENHANCED, VAPOR-COMPRESSION REFRIGERATION APPARATUS FACILITATING COOLING OF AN ELECTRONIC COMPONENT 有权
标题翻译：热电增压蒸汽压缩制冷装置电子元件的冷却
公开(公告)号：US20120111027A1
公开(公告)日：2012-05-10
申请号：US12939574
申请日：2010-11-04
申请人： Levi A. CAMPBELL , Richard C. CHU , Michael J. ELLSWORTH, JR. , Madhusudan K. IYENGAR , Robert E. SIMONS
发明人： Levi A. CAMPBELL , Richard C. CHU , Michael J. ELLSWORTH, JR. , Madhusudan K. IYENGAR , Robert E. SIMONS
IPC分类号： F25B21/04 , F25D31/00
CPC分类号： F25B21/02 , F25B40/00 , H05K7/20836
摘要： Apparatus and method are provided for facilitating cooling of an electronic component. The apparatus includes a refrigerant loop, a compressor coupled to the refrigerant loop, and a controllable thermoelectric array disposed in thermal communication with the refrigerant loop. Refrigerant flowing through the refrigerant loop facilitates dissipation of heat from the electronic component, and the thermoelectric array is disposed with a first portion of the refrigerant loop, residing upstream of the compressor, in thermal contact with a first side of the array, and a second portion of the refrigerant loop, residing downstream of the compressor, in thermal contact with a second side of the array. The thermoelectric array ensures that refrigerant in the refrigerant loop entering the compressor is in a superheated thermodynamic state by transferring heat from refrigerant passing through the second portion to refrigerant passing through the first portion of the refrigerant loop.
摘要翻译：提供了用于促进电子部件的冷却的装置和方法。该装置包括制冷剂回路，耦合到制冷剂回路的压缩机以及与制冷剂回路热连通地设置的可控热电阵列。流过制冷剂回路的制冷剂有助于从电子部件散发热量，并且热电阵列设置有位于压缩机上游的制冷剂回路的第一部分与阵列的第一侧热接触，第二部分位于压缩机下游的制冷剂回路的一部分与阵列的第二侧热接触。热电阵列确保进入压缩机的制冷剂回路中的制冷剂通过将通过第二部分的制冷剂的热量传递通过制冷剂回路的第一部分的制冷剂而处于过热的热力学状态。

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