会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 74. 发明授权
    • Pedal output conversion apparatus and method
    • 踏板输出转换装置及方法
    • US08242347B2
    • 2012-08-14
    • US12684432
    • 2010-01-08
    • Tadahiko IkeyaDaisuke SuzukiTakeshi Komano
    • Tadahiko IkeyaDaisuke SuzukiTakeshi Komano
    • G10H1/32G10H5/00
    • G10H1/0091G10H1/348
    • Detection outputs value based on outputs of a sensor for detecting a depressed position of a pedal are input via the input section; meanwhile, a detection output value corresponding to a non-depressed state of the pedal is set as an offset value. The detection output value, input via the input section, is adjusted with the offset value, so as to provide an adjusted detection output value corresponding to an actual depressed amount of the pedal. The adjusted detection output value is converted into a control value corresponding to the depressed amount of the pedal. Thus, the offset value is variably set in accordance with an individual difference, aging, etc. of the pedal, so that the detection output value adjusted with such an offset value can be a value having unevenness in the sensor outputs, which may have occurred due to an individual difference, aging, etc. of the pedal, automatically compensated.
    • 经由输入部输入基于用于检测踏板的按压位置的传感器的输出的检测输出值; 同时,将与踏板的非压下状态对应的检测输出值设定为偏移值。 通过输入部输入的检测输出值用偏移值进行调整,以提供与踏板的实际踩踏量对应的调整后的检测输出值。 调整后的检测输出值被转换成与踏板的下压量对应的控制值。 因此,根据踏板的个体差异,老化等可变地设定偏移值,使得以这种偏移值调整的检测输出值可以是可能已经发生的传感器输出中具有不均匀的值 由于个人差异,踏板老化等因素自动补偿。
    • 77. 发明申请
    • DC POWER SUPPLY APPARATUS
    • 直流电源设备
    • US20110194321A1
    • 2011-08-11
    • US13021219
    • 2011-02-04
    • Katsuyuki AMANODaisuke SuzukiKatsuhiko Saito
    • Katsuyuki AMANODaisuke SuzukiKatsuhiko Saito
    • H02M7/06
    • H02M7/219Y02B70/1483
    • A DC power supply apparatus comprising: a rectifying circuit including, a first rectifying portion, a second rectifying portion, a third rectifying portion and a fourth rectifying portion; a current detection portion; a first switching portion; and a second switching portion; wherein each of the first rectifying portion cooperatively operating with the first switching portion and the second rectifying portion cooperatively operating with the second switching portion is a semiconductor element which is formed by using a Schottky junction formed between silicon carbide or gallium nitride and metal and has a withstanding voltage property with respect to a voltage of an AC power supply.
    • 一种直流电源装置,包括:整流电路,包括第一整流部分,第二整流部分,第三整流部分和第四整流部分; 电流检测部分; 第一切换部; 和第二切换部分; 其中与第一开关部分和第二整流部分协同工作的第一整流部分与第二开关部分协作地操作的是通过使用在碳化硅或氮化镓和金属之间形成的肖特基结而形成的半导体元件,并且具有 相对于交流电源的电压具有耐受电压特性。
    • 80. 发明申请
    • RESINOUS HOLLOW PACKAGE AND PRODUCING METHOD THEREOF
    • 环保中空包装及其生产方法
    • US20090061554A1
    • 2009-03-05
    • US12162504
    • 2007-01-30
    • Daisuke SuzukiMasayuki Kondo
    • Daisuke SuzukiMasayuki Kondo
    • H01L21/00
    • H01L31/0203H01L23/49861H01L27/14618H01L2924/0002H04N5/2253H01L2924/00
    • The present invention provides a resinous hollow package that includes a moisture-proof island that is a planar structure disposed below a semiconductor element mounting surface of the resinous hollow package, the semiconductor element mounting surface having an area of 200 mm2 or more and the maximum wave height of a wave curve of 35 μm or less. The resinous hollow package of the invention has an excellent moisture resistance due to the moisture-proof island included therein. Further, since the flatness of the semiconductor element mounting surface is excellent, decrease in the amount of light in a peripheral portion of an image can be suppressed in a digital single-lens reflex camera or the like with a large solid-state image sensor, even when a wide angle lens is used. According to the method of producing the resinous hollow package of the invention, by carrying out insert-molding while fixing the moisture-proof island with projection(s) disposed to the mold to prevent displacement thereof, the resinous hollow package having the maximum wave height of the semiconductor element mounting surface of 35 μm or less can be provided.
    • 本发明提供了一种树脂中空包装,其包括防水岛,其是设置在树脂中空包装的半导体元件安装表面下方的平面结构,半导体元件安装表面具有200mm 2以上的面积和最大波 35米或更小的波形曲线的高度。 本发明的树脂中空包装由于其中包含防潮岛而具有优异的耐湿性。 此外,由于半导体元件安装面的平坦度优异,因此在具有大型固态图像传感器的数字单镜头反光照相机等中,可以抑制图像周边部分的光量的减少, 即使使用广角镜头也是如此。 根据本发明的树脂中空包装体的制造方法,通过在将防湿岛固定在配置于模具上的突起部进行插入成型的同时进行嵌入成型,以防止其移位,具有最大波高的树脂中空包装 的半导体元件安装面为35μm以下。