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    • 71. 发明授权
    • Image attribute altering device and electronic watermark embedding device
    • 图像属性改变装置和电子水印嵌入装置
    • US06668068B2
    • 2003-12-23
    • US09313543
    • 1999-05-14
    • Masahiro Hashimoto
    • Masahiro Hashimoto
    • G06K900
    • G06T1/0021H04N5/913H04N2005/91335
    • Image attribute detection means for detecting the attribute of an input image (attribute “A”) and image attribute altering means for altering the image attribute in the input image on the basis of the attribute detection result of the input image are provided to output an output image having a new attribute (attribute “B”). The image attribute detection means includes first DCT means for subjecting the input image to discrete cosine transform to obtain frequency components, second DCT means for subjecting the original image to discrete cosine transform to obtain original frequency components, and means of subtracting the original frequency components from the image frequency components and dividing the subtraction result by the image frequency components to detect the electronic watermark data.
    • 提供用于检测输入图像的属性(属性“A”)的图像属性检测装置和用于基于输入图像的属性检测结果改变输入图像中的图像属性的图像属性改变装置,以输出输出 具有新属性(属性“B”)的图像。 图像属性检测装置包括:第一DCT装置,用于对输入图像进行离散余弦变换以获得频率分量;第二DCT装置,用于对原始图像进行离散余弦变换以获得原始频率分量,以及从原始频率分量中减去原始频率分量的装置 图像频率分量,并将减法结果除以图像频率分量,以检测电子水印数据。
    • 76. 发明授权
    • Mask blank and transfer mask
    • 面罩空白和转印面膜
    • US09075319B2
    • 2015-07-07
    • US13260295
    • 2010-03-30
    • Masahiro HashimotoHiroyuki IwashitaYasushi OkuboOsamu Nozawa
    • Masahiro HashimotoHiroyuki IwashitaYasushi OkuboOsamu Nozawa
    • G03F1/46G03F1/50G03F1/58
    • G03F1/46G03F1/50G03F1/58
    • A mask blank and transfer mask that overcomes problems caused by an electromagnetic field (EMF) effect when a DRAM half pitch (hp) is 32 nm or less specified in semiconductor device design specifications. The mask blank is used in manufacturing a transfer mask to which ArF exposure light is applied, and includes a light shielding film 10 having a multilayer structure. The multilayer structure includes a light shielding layer 11 and a surface anti-reflection layer 12 formed on a transparent substrate 1. An auxiliary light shielding film 20 is formed on the light shielding film 10. The light shielding film 10 has a thickness of 40 nm or less and an optical density of 2.0 or more to 2.7 or less for exposure light. The optical density is 2.8 or more for exposure light in the multilayer structure of the light shielding film 10 and the auxiliary light shielding film 20.
    • 当半导体器件设计规范规定的DRAM半间距(hp)为32nm以下时,可以克服电磁场(EMF)效应引起的问题的掩模空白和传送掩模。 掩模坯料用于制造施加ArF曝光光的转印掩模,并且包括具有多层结构的遮光膜10。 多层结构包括形成在透明基板1上的遮光层11和表面防反射层12.在遮光膜10上形成辅助遮光膜20.遮光膜10的厚度为40nm 曝光光的光密度为2.0以上且2.7以下。 对于遮光膜10和辅助遮光膜20的多层结构中的曝光,光密度为2.8以上。
    • 77. 发明授权
    • Photomask blank, photomask, method of manufacturing the same, and method of manufacturing a semiconductor device
    • 光掩模坯料,光掩模,其制造方法以及半导体装置的制造方法
    • US08940462B2
    • 2015-01-27
    • US13121851
    • 2009-09-30
    • Masahiro HashimotoAtsushi Kominato
    • Masahiro HashimotoAtsushi Kominato
    • G03F1/80G03F1/00G03F1/54
    • G03F1/80G03F1/14G03F1/54G03F1/68
    • [Object] A photomask blank for use in producing a photomask for exposure with an ArF excimer laser. The photomask blank is intended to be applied to the 32-nm DRAM half-pitch (hp) and succeeding generations in the semiconductor design rule.[Solution] The photomask blank is for use in producing a photomask to which an exposure light having a wavelength not longer than 200 nm is applied. The photomask blank is characterized by comprising a transparent substrate, a light-shielding film formed on the transparent substrate and containing molybdenum and silicon, and an etching mask film formed directly on the light-shielding film and containing chromium. The photomask blank is further characterized in that the light-shielding film comprises a light-shielding layer and an antireflection layer which have been disposed in this order from the transparent substrate side, the light-shielding layer having a molybdenum content of 9-40 at %, and that the etching mask film has a chromium content of 45 at % or lower.
    • [目的]一种用于制造用ArF准分子激光曝光的光掩模的光掩模坯料。 光掩模坯料旨在应用于半导体设计规则中的32nm DRAM半间距(hp)和后代。 [解决方案]光掩模坯料用于制造其中施加具有不超过200nm的波长的曝光光的光掩模。 光掩模坯料的特征在于包括透明基板,形成在透明基板上并含有钼和硅的遮光膜,以及直接形成在遮光膜上并含有铬的蚀刻掩模膜。 光掩模坯料的特征还在于,所述遮光膜包括从透明基板侧依次设置的遮光层和防反射层,所述遮光层的钼含量为9〜40个 %,蚀刻掩模膜的铬含量为45原子%以下。
    • 80. 发明授权
    • Mask blank and transfer mask
    • 面罩空白和转印面膜
    • US08637213B2
    • 2014-01-28
    • US13384168
    • 2010-07-14
    • Masahiro HashimotoAtsushi KominatoHiroyuki IwashitaOsamu Nozawa
    • Masahiro HashimotoAtsushi KominatoHiroyuki IwashitaOsamu Nozawa
    • G03F1/80G03F1/50
    • G03F1/74G03F1/50G03F1/54G03F1/80
    • Provided is a mask blank which enables EB defect correction to be suitably applied and which further enables a reduction in the thickness of a light-shielding film. A mask blank 10 is used for producing a transfer mask adapted to be applied with ArF exposure light and has a light-shielding film 2 on a transparent substrate 1. The light-shielding film 2 is composed mainly of a material containing a transition metal, silicon, and at least one or more elements selected from oxygen and nitrogen. An etching rate of the light-shielding film by a fluorine-containing substance in a state of not being irradiated with charged particles is low enough to at least ensure etching selectivity with respect to an etching rate of the light-shielding film by the fluorine-containing substance in a state of being irradiated with the charged particles.
    • 提供了能够适当地应用EB缺陷校正的掩模坯料,并且还能够减少遮光膜的厚度。 掩模坯料10用于制造适于施加ArF曝光光的转印掩模,并且在透明基板1上具有遮光膜2.遮光膜2主要由含有过渡金属的材料构成, 硅和选自氧和氮的至少一种或多种元素。 在不被带电粒子照射的状态下,通过含氟物质的遮光膜的蚀刻速度低到至少确保相对于由氟系物形成的遮光膜的蚀刻速度的蚀刻选择性, 在被照射带电粒子的状态下含有物质。