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71. 发明申请

US20080093422A1 Low viscosity precursor compositions and methods for the deposition of conductive electronic features 审中-公开
标题翻译：低粘度前体组合物和沉积导电电子特征的方法
公开(公告)号：US20080093422A1
公开(公告)日：2008-04-24
申请号：US11642750
申请日：2006-12-21
申请人： Toivo Kodas , Mark Hampden-Smith , Karel Vanheusden , Hugh Denham , Aaron Stump , Allen Schult , Paolina Atanassova , Klaus Kunze
发明人： Toivo Kodas , Mark Hampden-Smith , Karel Vanheusden , Hugh Denham , Aaron Stump , Allen Schult , Paolina Atanassova , Klaus Kunze
IPC分类号： B23K31/02 , H01L21/00
CPC分类号： H05K3/105 , C23C18/06 , C23C18/08 , H01B1/026 , H01L24/03 , H01L24/05 , H01L2224/05294 , H01L2224/053 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H05K1/097 , H05K2201/0154 , H05K2203/1131 , H01L2924/00
摘要： A precursor composition for the deposition and formation of an electrical feature such as a conductive feature. The precursor composition advantageously has a low viscosity enabling deposition using direct-write tools. The precursor composition also has a low conversion temperature, enabling the deposition and conversion to an electrical feature on low temperature substrates. A particularly preferred precursor composition includes silver metal for the formation of highly conductive silver features.
摘要翻译：用于沉积和形成诸如导电特征的电特征的前体组合物。前体组合物有利地具有低粘度，使得能够使用直接写入工具进行沉积。前体组合物还具有低的转化温度，使得能够沉积并转化成低温基底上的电特征。特别优选的前体组合物包括用于形成高导电性银特征的银金属。

72. 发明申请

US20070279182A1 Printed resistors and processes for forming same 审中-公开
标题翻译：印刷电阻和其形成方法
公开(公告)号：US20070279182A1
公开(公告)日：2007-12-06
申请号：US11443131
申请日：2006-05-31
申请人： Toivo T. Kodas , Chuck Edwards , Klaus Kunze , Hyungrak Kim , Ned Jay Hardman
发明人： Toivo T. Kodas , Chuck Edwards , Klaus Kunze , Hyungrak Kim , Ned Jay Hardman
IPC分类号： H01C7/13
CPC分类号： H01C17/06506 , H01C17/065
摘要： The invention is to printed resistors and processes for forming same. The resistors comprise a conductive phase, preferably comprising conductive nanoparticles, and a resistive phase. In the processes of the invention, a resistor may be formed from a single ink or a plurality of inks. In the single ink embodiment, an ink is deposited which comprises a conductive phase precursor, a resistive phase precursor and a vehicle. The vehicle in removed and the conductive and resistive phase precursors are converted to a conductive phase and a resistive phase, respectively. In the multiple ink embodiment, a first ink comprising the conductive phase precursor and a first vehicle and a second ink comprising the resistive phase precursor and a second vehicle are deposited on the substrate. The vehicles are removed and the conductive and resistive phase precursors are converted to a conductive phase and a resistive phase, respectively.
摘要翻译：本发明是印刷电阻器及其制造方法。电阻器包括导电相，优选地包括导电纳米颗粒和电阻相。在本发明的方法中，电阻器可以由单一油墨或多种油墨形成。在单一油墨实施例中，沉积包含导电相前体，电阻相前体和载体的油墨。去除的载体和导电和电阻相前体分别被转换成导电相和电阻相。在多墨水实施例中，包含导电相前体和第一载体的第一墨水和包含电阻相前体和第二载体的第二墨水沉积在基底上。车辆被去除，并且导电和电阻相前体分别被转换成导电相和电阻相。

73. 发明申请

US20070181844A1 LOW VISCOSITY PRECURSOR COMPOSITIONS AND METHODS FOR THE DEPOSITION OF CONDUCTIVE ELECTRONIC FEATURES 审中-公开
标题翻译：低粘度前驱体组合物和导电电子特征沉积的方法
公开(公告)号：US20070181844A1
公开(公告)日：2007-08-09
申请号：US11736896
申请日：2007-04-18
申请人： Toivo Kodas , Mark Hampden-Smith , Karel Vanheusden , Hugh Denham , Aaron Stump , Allen Schult , Paolina Atanassova , Klaus Kunze
发明人： Toivo Kodas , Mark Hampden-Smith , Karel Vanheusden , Hugh Denham , Aaron Stump , Allen Schult , Paolina Atanassova , Klaus Kunze
IPC分类号： C99Z99/00
CPC分类号： H05K3/105 , C23C18/06 , C23C18/08 , H01B1/026 , H01L24/03 , H01L24/05 , H01L2224/05294 , H01L2224/053 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H05K1/097 , H05K2201/0154 , H05K2203/1131 , H01L2924/00
摘要： A precursor composition for the deposition and formation of an electrical feature such as a conductive feature. The precursor composition advantageously has a low viscosity enabling deposition using direct-write tools. The precursor composition also has a low conversion temperature, enabling the deposition and conversion to an electrical feature on low temperature substrates. A particularly preferred precursor composition includes silver metal for the formation of highly conductive silver features.
摘要翻译：用于沉积和形成诸如导电特征的电特征的前体组合物。前体组合物有利地具有低粘度，使得能够使用直接写入工具进行沉积。前体组合物还具有低的转化温度，使得能够沉积并转化成低温基底上的电特征。特别优选的前体组合物包括用于形成高导电性银特征的银金属。

74. 发明授权

US07229572B2 Photoluminescent phosphor powders, methods for making phosphor powders and devices incorporating same 有权
标题翻译：荧光发光粉末，荧光体粉末的制造方法及其结合的装置
公开(公告)号：US07229572B2
公开(公告)日：2007-06-12
申请号：US10730756
申请日：2003-12-08
申请人： Mark J. Hampden-Smith , Toivo T. Kodas , James Caruso , Daniel J. Skamser , Quint H. Powell , Klaus Kunze
发明人： Mark J. Hampden-Smith , Toivo T. Kodas , James Caruso , Daniel J. Skamser , Quint H. Powell , Klaus Kunze
IPC分类号： H01J61/62 , H01J15/00 , H01J61/00
CPC分类号： B01J2/003 , B01J2/006 , B01J2/02 , B01J2/04 , B01J13/02 , B01J19/10 , B01J19/2405 , B01J2219/00112 , B01J2219/00155 , B01J2219/00159 , B01J2219/00162 , B01J2219/00166 , B01J2219/00171 , B01J2219/00186 , B24B37/044 , B41M3/144 , B82Y30/00 , C01B13/18 , C01B13/185 , C01B17/20 , C01B33/20 , C01G15/006 , C01G23/003 , C01G23/006 , C01G25/00 , C01P2002/60 , C01P2002/70 , C01P2004/03 , C01P2004/32 , C01P2004/34 , C01P2004/50 , C01P2004/52 , C01P2004/61 , C01P2004/62 , C01P2004/80 , C01P2006/10 , C01P2006/22 , C01P2006/60 , C01P2006/80 , C04B35/44 , C04B35/6263 , C04B35/6265 , C04B35/62655 , C04B35/62675 , C04B35/6268 , C04B2235/3206 , C04B2235/3215 , C04B2235/3224 , C04B2235/443 , C04B2235/5445 , C04B2235/5481 , C04B2235/79 , C04B2235/80 , C04B2235/81 , C04B2235/9661 , C09G1/02 , C09K3/1436 , C09K3/1463 , C09K11/025 , C09K11/0805 , C09K11/0877 , C09K11/562 , C09K11/565 , C09K11/567 , C09K11/584 , C09K11/595 , C09K11/612 , C09K11/623 , C09K11/625 , C09K11/642 , C09K11/643 , C09K11/644 , C09K11/662 , C09K11/666 , C09K11/671 , C09K11/672 , C09K11/7701 , C09K11/7708 , C09K11/7718 , C09K11/7729 , C09K11/7731 , C09K11/7734 , C09K11/7746 , C09K11/7769 , C09K11/7771 , C09K11/7774 , C09K11/7776 , C09K11/7784 , C09K11/7786 , C09K11/7787 , C09K11/7789 , C09K11/7797 , G21K4/00 , G21K2004/06 , H01G4/0085 , H01J29/085 , H01J29/20 , H01J2211/42 , H01L21/3212 , H01L23/49883 , H01L2924/0002 , H01L2924/3011 , H05B33/14 , H05B33/20 , Y10S283/901 , H01L2924/00
摘要： Photoluminescent phosphor powders and a method for making phosphor powders. The phosphor powders have a small particle size, narrow particle size distribution and are substantially spherical. The method of the invention advantageously permits the economic production of such powders. The invention also relates to improved devices, such as display devices and lighting elements, incorporating the phosphor powders.
摘要翻译：光致发光荧光体粉末和制造荧光体粉末的方法。荧光体粉末具有小的粒度，窄的粒度分布并且基本上是球形的。本发明的方法有利地允许这种粉末的经济生产。本发明还涉及包含荧光体粉末的改进的装置，例如显示装置和照明元件。

75. 发明申请

US20070120098A1 Low viscosity precursor compositions and methods for the deposition of conductive electronic features 审中-公开
公开(公告)号：US20070120098A1
公开(公告)日：2007-05-31
申请号：US11642719
申请日：2006-12-21
申请人： Toivo Kodas , Mark Hampden-Smith , Karel Vanheusden , Hugh Denham , Aaron Stump , Allen Schult , Paolina Atanassova , Klaus Kunze
发明人： Toivo Kodas , Mark Hampden-Smith , Karel Vanheusden , Hugh Denham , Aaron Stump , Allen Schult , Paolina Atanassova , Klaus Kunze
IPC分类号： H01B1/12
CPC分类号： H05K3/105 , C23C18/06 , C23C18/08 , H01B1/026 , H01L24/03 , H01L24/05 , H01L2224/05294 , H01L2224/053 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H05K1/097 , H05K2201/0154 , H05K2203/1131 , H01L2924/00
摘要： A precursor composition for the deposition and formation of an electrical feature such as a conductive feature. The precursor composition advantageously has a low viscosity enabling deposition using direct-write tools. The precursor composition also has a low conversion temperature, enabling the deposition and conversion to an electrical feature on low temperature substrates. A particularly preferred precursor composition includes silver metal for the formation of highly conductive silver features.

76. 发明申请

US20070120097A1 Low viscosity precursor compositions and methods for the deposition of conductive electronic features 审中-公开
公开(公告)号：US20070120097A1
公开(公告)日：2007-05-31
申请号：US11642693
申请日：2006-12-21
申请人： Toivo Kodas , Mark Hampden-Smith , Karel Vanheusden , Hugh Denham , Aaron Stump , Allen Schult , Paolina Atanassova , Klaus Kunze
发明人： Toivo Kodas , Mark Hampden-Smith , Karel Vanheusden , Hugh Denham , Aaron Stump , Allen Schult , Paolina Atanassova , Klaus Kunze
IPC分类号： H01B1/12
CPC分类号： H05K3/105 , C23C18/06 , C23C18/08 , H01B1/026 , H01L24/03 , H01L24/05 , H01L2224/05294 , H01L2224/053 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H05K1/097 , H05K2201/0154 , H05K2203/1131 , H01L2924/00
摘要： A precursor composition for the deposition and formation of an electrical feature such as a conductive feature. The precursor composition advantageously has a low viscosity enabling deposition using direct-write tools. The precursor composition also has a low conversion temperature, enabling the deposition and conversion to an electrical feature on low temperature substrates. A particularly preferred precursor composition includes silver metal for the formation of highly conductive silver features.

77. 发明申请

US20070120096A1 Low viscosity precursor compositions and methods for the deposition of conductive electronic features 审中-公开
公开(公告)号：US20070120096A1
公开(公告)日：2007-05-31
申请号：US11642685
申请日：2006-12-21
申请人： Toivo Kodas , Mark Hampden-Smith , Karel Vanheusden , Hugh Denham , Aaron Stump , Allen Schult , Paolina Atanassova , Klaus Kunze
发明人： Toivo Kodas , Mark Hampden-Smith , Karel Vanheusden , Hugh Denham , Aaron Stump , Allen Schult , Paolina Atanassova , Klaus Kunze
IPC分类号： H01B1/12
CPC分类号： H05K3/105 , C23C18/06 , C23C18/08 , H01B1/026 , H01L24/03 , H01L24/05 , H01L2224/05294 , H01L2224/053 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H05K1/097 , H05K2201/0154 , H05K2203/1131 , H01L2924/00
摘要： A precursor composition for the deposition and formation of an electrical feature such as a conductive feature. The precursor composition advantageously has a low viscosity enabling deposition using direct-write tools. The precursor composition also has a low conversion temperature, enabling the deposition and conversion to an electrical feature on low temperature substrates. A particularly preferred precursor composition includes silver metal for the formation of highly conductive silver features.

78. 发明申请

US20070117271A1 Methods and compositions for the formation of recessed electrical features on a substrate 审中-公开
公开(公告)号：US20070117271A1
公开(公告)日：2007-05-24
申请号：US11642687
申请日：2006-12-21
申请人： Toivo Kodas , Mark Hampden-Smith , Karel Vanheusden , Hugh Denham , Aaron Stump , Allen Schult , Paolina Atanassova , Klaus Kunze
发明人： Toivo Kodas , Mark Hampden-Smith , Karel Vanheusden , Hugh Denham , Aaron Stump , Allen Schult , Paolina Atanassova , Klaus Kunze
IPC分类号： H01L21/00
CPC分类号： C09D11/30 , C23C18/08 , H01B1/026 , H01C17/06506 , H01C17/06533 , H01C17/06573 , H01L21/02205 , H01L21/288 , H01L21/31691 , H05K1/0346 , H05K1/097 , H05K1/162 , H05K3/105 , H05K3/107 , H05K3/125 , H05K3/1258 , H05K3/4061 , H05K3/4069 , H05K2201/09036 , H05K2203/013 , H05K2203/1142 , H05K2203/121 , H05K2203/125
摘要： Precursor compositions having a low conversion temperature and methods for the fabrication of recessed electrical features from the precursor compositions. The electrical features can be conductors, resistors and dielectric features. The precursor compositions are deposited into recessed features, such as trenches, formed in a substrate and are reacted at a low temperature to form electrical features having good electrical and mechanical properties. The substrate can be a low temperature substrate, such as an organic substrate.

79. 发明申请

US20070104882A1 Low viscosity precursor compositions and methods for the deposition of conductive electronics features 审中-公开
标题翻译：低粘度前体组合物和用于沉积导电电子学特征的方法
公开(公告)号：US20070104882A1
公开(公告)日：2007-05-10
申请号：US11642724
申请日：2006-12-21
申请人： Toivo Kodas , Mark Hampden-Smith , Karel Vanheusden , Hugh Denham , Aaron Stump , Allen Schult , Paolina Atanassova , Klaus Kunze
发明人： Toivo Kodas , Mark Hampden-Smith , Karel Vanheusden , Hugh Denham , Aaron Stump , Allen Schult , Paolina Atanassova , Klaus Kunze
IPC分类号： B05D3/02
CPC分类号： H05K3/105 , C23C18/06 , C23C18/08 , H01B1/026 , H01L24/03 , H01L24/05 , H01L2224/05294 , H01L2224/053 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H05K1/097 , H05K2201/0154 , H05K2203/1131 , H01L2924/00
摘要： A precursor composition for the deposition and formation of an electrical feature such as a conductive feature. The precursor composition advantageously has a low viscosity enabling deposition using direct-write tools. The precursor composition also has a low conversion temperature, enabling the deposition and conversion to an electrical feature on low temperature substrates. A particularly preferred precursor composition includes silver metal for the formation of highly conductive silver features.
摘要翻译：用于沉积和形成诸如导电特征的电特征的前体组合物。前体组合物有利地具有低粘度，使得能够使用直接写入工具进行沉积。前体组合物还具有低的转化温度，使得能够沉积并转化成低温基底上的电特征。特别优选的前体组合物包括用于形成高导电性银特征的银金属。

80. 发明申请

US20070104870A1 Low viscosity precursor compositions and methods for the deposition of conductive electronic features 审中-公开
公开(公告)号：US20070104870A1
公开(公告)日：2007-05-10
申请号：US11642754
申请日：2006-12-21
申请人： Toivo Kodas , Mark Hampden-Smith , Karel Vanheusden , Hugh Denham , Aaron Stump , Allen Schult , Paolina Atanassova , Klaus Kunze
发明人： Toivo Kodas , Mark Hampden-Smith , Karel Vanheusden , Hugh Denham , Aaron Stump , Allen Schult , Paolina Atanassova , Klaus Kunze
IPC分类号： B05D5/00 , B05D3/02
CPC分类号： H05K3/105 , C23C18/06 , C23C18/08 , H01B1/026 , H01L24/03 , H01L24/05 , H01L2224/05294 , H01L2224/053 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H05K1/097 , H05K2201/0154 , H05K2203/1131 , H01L2924/00
摘要： A precursor composition for the deposition and formation of an electrical feature such as a conductive feature. The precursor composition advantageously has a low viscosity enabling deposition using direct-write tools. The precursor composition also has a low conversion temperature, enabling the deposition and conversion to an electrical feature on low temperature substrates. A particularly preferred precursor composition includes silver metal for the formation of highly conductive silver features.

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