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71. 发明授权

US6017424A Laser assisted surface reformation method of high polymer material 失效
标题翻译：高分子材料激光辅助表面改性方法
公开(公告)号：US6017424A
公开(公告)日：2000-01-25
申请号：US028095
申请日：1998-02-23
申请人： Tsutomu Shibuya , Kaoru Katayama , Mitugu Shirai , Shinichi Kazui , Hideaki Sasaki , Yasuhiro Iwata
发明人： Tsutomu Shibuya , Kaoru Katayama , Mitugu Shirai , Shinichi Kazui , Hideaki Sasaki , Yasuhiro Iwata
IPC分类号： C08J7/00 , H01L21/56 , H01L21/60 , H01L21/68 , H05K3/22 , H05K3/30 , H05K3/34 , C07C1/00 , C07C2/00 , C07C4/00 , C07C5/00 , C07C6/00
CPC分类号： H01L21/6835 , H01L21/563 , H01L24/81 , H05K3/305 , H01L2224/16 , H01L2224/73203 , H01L2224/81191 , H01L2224/81801 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/014 , H01L2924/09701 , H01L2924/12042 , H01L2924/14 , H01L2924/15787 , H05K2201/0154 , H05K2201/10674 , H05K2201/10734 , H05K2203/0783 , H05K2203/107 , H05K3/22 , H05K3/303 , H05K3/3436 , H05K3/3452 , Y02P70/613 , Y10T29/49144 , Y10T428/24917 , Y10T428/2809
摘要： A surface reformation method of a high polymer material irradiates an excimer-laser beam to only a predetermined area in which electronic parts and the like are temporarily immobilized by a liquid on a substrate which has a high polymer layer on the surface. The wettability of the liquid for temporary immobilization only with respect to the predetermined area is improved. After the electronic parts are temporarily immobilized on the substrate by using the method, the electronic parts can be durably soldered by fluxless reflow soldering.
摘要翻译：高分子材料的表面改性方法仅将准分子激光束照射到表面上具有高聚合物层的基板上的液体暂时固定电子部件等的预定区域。仅用于临时固定的液体相对于预定面积的润湿性提高。通过使用该方法将电子部件临时固定在基板上之后，可以通过无流动回流焊接耐久地焊接电子部件。

72. 发明授权

US5861879A Video signal processing device for writing and reading a video signal with respect to a memory according to different clocks, while preventing a write/read address pass-by in the memory 失效
标题翻译：视频信号处理装置，用于根据不同的时钟相对于存储器写入和读取视频信号，同时防止存储器中的写入/读取地址通过
公开(公告)号：US5861879A
公开(公告)日：1999-01-19
申请号：US722341
申请日：1996-09-27
申请人： Yutaka Shimizu , Hideaki Sasaki , Shigeru Sawada , Teruo Hotta
发明人： Yutaka Shimizu , Hideaki Sasaki , Shigeru Sawada , Teruo Hotta
IPC分类号： G09G5/00 , G09G5/12 , G09G5/397 , G09G5/399 , H04N7/50 , H04L7/00
CPC分类号： G09G5/399 , H04N19/423 , H04N19/61 , G09G2340/0407 , G09G5/12
摘要： An input video signal is written into alternate field memories M1 and M2, according to a timing clock from an input video clock generator. A display video signal is alternately read from those field memories, according to a timing clock from a display video clock generator. In switching a read memory, an address observation circuit judges whether or not a read/write address passes by a write/read address, referring to the condition of reading and writing operations. In this event, the circuit makes a judgement, based on the lag between a vertical synchronizing signals of an input video signal and of a display video signal, and a change of the lag with time. If it is judged that one address will pass by the other, the same read/write memory is again accessed for reading/writing. With this arrangement, there is provided a circuit having a relatively simple structure for preventing a match of read and write addresses.
摘要翻译：根据来自输入视频时钟发生器的定时时钟，将输入视频信号写入交替场存储器M1和M2。根据来自显示视频时钟发生器的定时时钟，从这些场存储器交替地读取显示视频信号。在切换读取存储器时，参考读写操作的条件，地址观察电路判断读/写地址是否通过写/读地址。在这种情况下，电路基于输入视频信号的垂直同步信号和显示视频信号之间的滞后与滞后随时间的变化而进行判断。如果判断一个地址将被另一个地址通过，则再次访问相同的读/写存储器以进行读/写。利用这种布置，提供了一种具有相对简单结构的电路，用于防止读和写地址的匹配。

73. 发明授权

US5551148A Method for forming conductive bumps 失效
标题翻译：形成导电凸块的方法
公开(公告)号：US5551148A
公开(公告)日：1996-09-03
申请号：US330569
申请日：1994-10-28
申请人： Shinichi Kazui , Makoto Matsuoka , Hideyuki Fukasawa , Mitsunori Tamura , Mitsugu Shirai , Hideaki Sasaki
发明人： Shinichi Kazui , Makoto Matsuoka , Hideyuki Fukasawa , Mitsunori Tamura , Mitsugu Shirai , Hideaki Sasaki
IPC分类号： H01L21/60 , H01L21/48 , H05K3/34 , H05K3/00
CPC分类号： H05K3/3478 , H01L21/4853 , H01L2224/11003 , H01L2224/11334 , H01L2924/01068 , H05K2201/10424 , H05K2203/0113 , H05K2203/0338 , H05K2203/041 , H05K2203/0769 , Y10T29/49149 , Y10T29/4981
摘要： A flexible film-like member having conductive metals filled in tapered holes extending through the thickness is positioned such that the holes of the member face to respective pad patterns on a circuit board on which bumps are to be formed, the conductive metals are then heated and fused so that they are joined and transferred to the pad patterns on the circuit board, and the film-like member is then removed by heating or cleaning liquid.
摘要翻译：具有填充在贯穿厚度的锥形孔中的导电金属的柔性膜状构件被定位成使得构件的孔面对要在其上形成凸块的电路板上的相应焊盘图案，然后导电金属被加热，并且熔融，使其接合并转移到电路板上的焊盘图案，然后通过加热或清洗液体除去膜状部件。

74. 发明授权

US5276289A Electronic circuit device and method of producing the same 失效
标题翻译：电子电路装置及其制造方法
公开(公告)号：US5276289A
公开(公告)日：1994-01-04
申请号：US674599
申请日：1991-03-25
申请人： Ryohei Satoh , Fumiyuki Kobayashi , Yutaka Watanabe , Tositada Netsu , Mitugu Shirai , Kenji Takeda , Masahide Harada , Kiyoshi Matsui , Hideaki Sasaki
发明人： Ryohei Satoh , Fumiyuki Kobayashi , Yutaka Watanabe , Tositada Netsu , Mitugu Shirai , Kenji Takeda , Masahide Harada , Kiyoshi Matsui , Hideaki Sasaki
IPC分类号： H01L23/02 , B23K35/30 , H01L21/60 , H01L23/10 , H01L23/16 , H01L23/538 , H01L25/065 , H05K3/34 , H05K1/00
CPC分类号： H01L24/81 , B23K35/30 , H01L23/10 , H01L23/16 , H01L23/5385 , H01L25/0655 , H05K3/3463 , H01L2224/16 , H01L2224/73253 , H01L2224/81801 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/15311 , H01L2924/15312 , H01L2924/15787 , H01L2924/16152 , H01L2924/1616 , H01L2924/16195 , H01L2924/30107 , H05K2201/094 , H05K2201/10704 , H05K2201/10734
摘要： The present invention provides a multistep electronic circuit device comprising a plurality of parts and elements mechanically or electrically bonded in sequence to each other and to a substrate with a plurality of solders, which comprises as the parts and elements the substrate, input and output pins and LSI chips, and optionally packages and a cooler bonded through multistep bonding, the bondings of the parts and elements including at least one CCB bonding and at least one sealing, the solders each having a lower melting point than the heatproof temperature of the part or element to be bonded with the solder, and one of the solders having a melting point of at least 10.degree. C. lower than that of the other solder used at the bonding step immediately before. The solders used are selected from Au10-15wt%Ge alloy (melting point: 356.degree.-450.degree. C.), Pb1-5wt%Sn alloy (melting point: 314.degree.-325.degree. C.), Pb10-13wt%Sn alloy (melting point: 270.degree.-300.degree. C.), Au20wt%Sn alloy (melting point: 280.degree. C.), Sn3-6wt%Sb alloy (melting point: 232.degree.-243.degree. C.), Sn2-8wt%Ag alloy (melting point: 221.degree.-235.degree. C.), Sn35-55wt%Pb alloy (melting point: 183.degree. -200.degree. C.) and Sn45wt%Pb18wt%Bi (melting point: 135.degree.-160.degree. C.).
摘要翻译：本发明提供一种多步电子电路装置，其包括多个部件和元件，它们依次机械地或电连接地连接到具有多个焊料的基板上，该多个焊料包括作为部件和元件的基板，输入和输出销和 LSI芯片，以及任选的封装和通过多步接合结合的冷却器，包括至少一个CCB结合和至少一个密封的部件和元件的结合，每个具有比部件或元件的耐热温度低的熔点与焊料接合，并且其中一个焊料的熔点比紧接在之前的接合步骤中使用的其它焊料的熔点低至少10摄氏度。使用的焊料选自Au10-15wt％Ge合金（熔点：356〜450℃），Pb1-5wt％Sn合金（熔点：314〜325℃），Pb10-13wt％Sn合金（熔点：270〜300℃），Au20重量％Sn合金（熔点：280℃），Sn3-6重量％Sb合金（熔点：232度-243℃），Sn2-8重量％ Ag合金（熔点221〜235℃），Sn35-55wt％Pb合金（熔点：183〜200℃），Sn45wt％Pb18wt％Bi（熔点：135〜160℃））。

75. 发明授权

US5136360A Electronic circuit device, method of connecting with solder and solder for connecting gold-plated terminals 失效
标题翻译：电子电路器件，连接焊料和焊料的方法，用于连接镀金端子
公开(公告)号：US5136360A
公开(公告)日：1992-08-04
申请号：US563281
申请日：1990-08-06
申请人： Masahide Harada , Ryohei Satoh , Fumiyuki Kobayashi , Takaji Takenaka , Toshitada Netsu , Hideaki Sasaki , Mitugu Shirai
发明人： Masahide Harada , Ryohei Satoh , Fumiyuki Kobayashi , Takaji Takenaka , Toshitada Netsu , Hideaki Sasaki , Mitugu Shirai
IPC分类号： B23K35/22 , B23K35/26 , C22C13/00 , H01L21/60 , H01L23/488 , H05K3/34
CPC分类号： H05K3/3463 , B23K35/262 , H01L23/488 , H01L2224/16225
摘要： An electronic circuit device comprising an electronic part having a gold-plated connecting terminal arranged thereon connected through a solder to a circuit substrate on the predetermined connecting element thereof, in which the connecting terminal of the electronic part and the solder-connected portion of the circuit substrate are constituted by an alloy composition consisting of 1.0 to 8.0 wt. % of Ag, 0.1 to 6.0 wt % of Au and the balance of Sn, is provided. The device is made by using a solder for use in connecting a gold-plated connecting terminal which consists of 1.0 to 8.0 wt % of Ag and the balance of Sn and a method of connecting an electronic part having a gold-plated connecting terminal arranged thereon to a circuit substrate, which comprises the steps of placing the electronic part and the gold-plated connected terminal so as to face each other via a solder and then melting the solder to connect and fix the connecting terminal to the circuit substrate onto the predetermined element thereof, the composition of said solder consisting of 1.0 to 8.0 wt % Ag and the balance of Sn.
摘要翻译：一种电子电路装置，包括电子部件，该电子部件具有通过焊料连接到其预定连接元件上的电路基板上的镀金连接端子，其中电子部件的连接端子和电路的焊接部分基材由1.0〜8.0重量份的合金组成构成。提供Ag的％，0.1〜6.0重量％的Au和余量的Sn。该装置通过使用焊料制成，用于连接由1.0至8.0重量％的Ag组成的镀金连接端子和余量的Sn，以及连接其上布置有镀金连接端子的电子部件的方法电路基板，其包括以下步骤：通过焊料将电子部件和镀金连接的端子放置成彼此面对，然后熔化焊料以将连接端子连接并固定到电路基板到预定元件所述焊料的组成由1.0至8.0重量％的Ag和余量的Sn组成。

76. 发明授权

US4620663A Parts-connecting apparatus using solder 失效
标题翻译：使用焊料的零件连接装置
公开(公告)号：US4620663A
公开(公告)日：1986-11-04
申请号：US702740
申请日：1985-02-19
申请人： Hitoshi Odashima , Hideaki Sasaki , Shinichi Kazui , Shigeo Shiono , Osamu Isshiki , Takeshi Kawana
发明人： Hitoshi Odashima , Hideaki Sasaki , Shinichi Kazui , Shigeo Shiono , Osamu Isshiki , Takeshi Kawana
IPC分类号： B23K1/005 , B23K26/08 , H05K3/30 , H05K3/34 , H05K13/00 , H05K13/04 , B23K37/04 , B23K31/02
CPC分类号： H05K13/0061 , B23K1/0056 , B23K26/0838 , H05K13/0465 , H05K3/303 , H05K3/3421 , B23K2201/42 , H05K2201/10689 , H05K2203/104 , H05K2203/107 , H05K3/3494 , Y02P70/613
摘要： An apparatus for connecting wiring patterns on a wiring board and leads of a parts to be mounted on the wiring board, via the solder provided between the leads and the patterns. The parts-connecting apparatus enables, especially, circuit elements of a high degree of, to be connected automatically with high reliability and accuracy by using solder through the steps of setting the wiring board in a predetermined position while pressing a surface thereof so as to remove the warp from the wiring board, fastening the leads of the part to the wiring patterns by a magnet provided on the lower surface of the wiring board, and heating the solder provided on the portions of the leads which are fastened to the wiring patterns.
摘要翻译：一种用于通过设置在引线和图案之间的焊料，将布线板上的布线图案和要安装在布线板上的部件的引线相连接的装置。部件连接装置尤其能够通过使用焊料，通过将电路板设置在预定位置的同时按压其表面从而自动地以高可靠性和精度自动连接，从而能够高效地连接电路元件，来自布线板的翘曲，通过设置在布线板的下表面上的磁体将部件的引线紧固到布线图案，以及加热设置在紧固到布线图案的引线部分上的焊料。

77. 发明授权

US4437603A Automatic wiring machine for printed circuit boards 失效
标题翻译：印刷电路板自动接线机
公开(公告)号：US4437603A
公开(公告)日：1984-03-20
申请号：US221458
申请日：1980-12-30
申请人： Mamoru Kobayashi , Kanji Ishige , Hideaki Sasaki , Mitsukiyo Tani , Yashuhiko Kawakami
发明人： Mamoru Kobayashi , Kanji Ishige , Hideaki Sasaki , Mitsukiyo Tani , Yashuhiko Kawakami
IPC分类号： G05B19/40 , G05B19/414 , H05K3/10 , H05K13/06
CPC分类号： H05K13/06 , G05B19/40 , G05B19/4142 , G05B2219/34239 , Y10T29/49162
摘要： A machine for automatically wiring an insulated fine wire as thin as a hair on the printed circuit board of wiring patterns are set up between adjacent conductor printed circuit board to be applied with wirings is carried by an X-Y table which is movable in X and Y directions, and the X-Y table is moved in accordance with wiring sites. A wire guide unit, a bonding unit and a wire cutter unit mounted, above the X-Y table, to a head rotatably supported about an axis perpendicular to the X-Y table surface are rotated along with the head so as to be oriented in various directions an optical device is supported for optical monitoring of the operations from above along the rotational axis of the bonding head. The wire guide unit sequentially pays out the insulated fine wire onto the printed circuit board carried by the X-Y table, the bonding unit exposes the core of the payed-out insulated wire and fuses the wire for connection thereof to the conductor pad of the printed circuit board by heating and depressing the payed-out wire, and the wire cutter unit cuts away the wire after completion of wiring.
摘要翻译：在布线图案的印刷电路板上自动布线作为布线图案的印刷电路板上的毛发的绝缘细线的机器被设置在相邻的要布线的导体印刷电路板之间，该XY台可在X和Y方向上移动，并且XY台根据配线位置移动。安装在XY工作台上方的线引导单元，接合单元和线切割器单元围绕垂直于XY工作台表面的轴可旋转地支撑的头部被旋转，以便在各个方向上被定向成光学支撑装置用于沿着键合头的旋转轴从上方对操作进行光学监视。导线单元顺序地将绝缘细线支撑到由XY工作台承载的印刷电路板上，接合单元暴露所付出的绝缘电线的芯并将导线熔接到印刷电路板的导体焊盘上通过加热和压下付出的电线，线切割器单元在接线完成之后切断电线。

78. 发明授权

US4303756A Process for producing expandable thermoplastic resin beads 失效
标题翻译：用于生产可膨胀热塑性树脂珠粒的方法
公开(公告)号：US4303756A
公开(公告)日：1981-12-01
申请号：US207422
申请日：1980-11-17
申请人： Mutsuhiko Kajimura , Hideaki Sasaki
发明人： Mutsuhiko Kajimura , Hideaki Sasaki
IPC分类号： C08F255/04 , C08J9/18 , C08J9/16
CPC分类号： C08J9/18 , C08F255/04 , C08J2351/06
摘要： A process for producing expandable thermoplastic resin beads which comprises suspending in an aqueous medium 20 to 70% by weight of a random copolymer of propylene and ethylene containing 1 to 10% by weight of ethylene and 99 to 90% by weight of propylene and 30 to 80% by weight of a vinyl aromatic monomer such as styrene, polymerizing the vinyl aromatic monomer in the presence of a polymerization catalyst to graft the vinyl aromatic monomer onto the backbone of the random copolymer and, optionally, adding a cross-linking agent, to form graft-copolymerized thermoplastic resin beads, and introducing a blowing agent into the thermoplastic resin beads. The resulting resin beads have excellent foamability and molding fusability, and a foamed shaped article having superior thermal stability can be prepared from these beads.
摘要翻译：一种制造可膨胀热塑性树脂珠粒的方法，其包括在水性介质中悬浮20至70重量％的丙烯和乙烯的无规共聚物，其含有1至10重量％的乙烯和99至90重量％的丙烯，30至30重量％ 80重量％的乙烯基芳族单体如苯乙烯，在聚合催化剂的存在下聚合乙烯基芳族单体，将乙烯基芳族单体接枝到无规共聚物的主链上，并任选加入交联剂至形成接枝共聚的热塑性树脂珠，并将发泡剂引入到热塑性树脂珠中。所得到的树脂珠具有优异的发泡性和成型熔融性，并且可以从这些珠制备具有优异的热稳定性的发泡成型制品。

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