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71. 发明申请

US20130293066A1 ULTRASOUND TRANSDUCER, ULTRASOUND PROBE AND MANUFACTURING METHOD OF ULTRASOUND TRANSDUCER 有权
标题翻译：超声波传感器，超声波探头和超声波传感器的制造方法
公开(公告)号：US20130293066A1
公开(公告)日：2013-11-07
申请号：US13823629
申请日：2012-01-27
申请人： Kentaro Tsuzuki , Takashi Kubota , Yutaka Oonuki , Yasuhisa Makita
发明人： Kentaro Tsuzuki , Takashi Kubota , Yutaka Oonuki , Yasuhisa Makita
IPC分类号： B06B1/06 , B32B38/00
CPC分类号： B06B1/0629 , B06B1/067 , B32B38/0004 , Y10T156/1082
摘要： The purpose is to provide an ultrasound transducer and ultrasound probe without the complexity of the manufacturing process of the non-conductive acoustic matching layer while ensuring the electric conductive path. Pluralities of two-dimensionally arranged piezoelectrics are comprised in the ultrasound transducer. Electrodes are provided for each piezoelectric. Furthermore, the non-conductive acoustic matching layer with the first surface on the electrode side and the second surface on the opposite side of the first surface is comprised in the ultrasound transducer, and moreover, the electric conductive acoustic matching layer arranged on the second surface side of the non-conductive acoustic matching layer is comprised in the ultrasound transducer. Moreover, the substrate arranged on the opposite side of the non-conductive acoustic matching layer is arranged with respect to the electric conductive acoustic matching layer. The plurality of grooves penetrating the non-conductive acoustic matching layer, leading up to mid-way of the piezoelectrics of the first surface side or mid-way of the electric conductive acoustic matching layer of the second surface side is formed between the first surface and the second surface of the non-conductive acoustic matching layer. Moreover, the electrode and the substrate are electrically conducted via the groove.
摘要翻译：其目的是提供超声波换能器和超声波探头，而不会导致非导电声匹配层的制造过程的复杂性，同时确保导电路径。二维排列压电体的多个包含在超声波换能器中。为每个压电设置电极。此外，具有第一表面的第一表面和第一表面的相对侧上的第二表面的非导电声匹配层包括在超声波换能器中，而且，布置在第二表面上的导电声匹配层非导电声匹配层的一侧包括在超声换能器中。此外，布置在非导电声匹配层的相对侧的基板相对于导电声匹配层布置。穿过非导电声匹配层的多个沟槽形成在第一表面和第二表面侧的导电声匹配层的第一表面侧或中间的压电体的中间非导电声匹配层的第二表面。此外，电极和衬底经由沟槽导电。

72. 发明授权

US08547651B2 Image-forming lens, and camera device and portable information terminal device with the image-forming lens 有权
标题翻译：图像形成透镜，以及具有图像形成透镜的相机装置和便携式信息终端装置
公开(公告)号：US08547651B2
公开(公告)日：2013-10-01
申请号：US13803262
申请日：2013-03-14
申请人： Takashi Kubota , Kazuyasu Ohashi
发明人： Takashi Kubota , Kazuyasu Ohashi
IPC分类号： G02B9/08
CPC分类号： G02B13/0015 , G02B9/64 , G02B13/0045 , G02B13/009 , G02B13/04
摘要： An image forming lens consists of from an object side to an image side in the following order: a first group with a positive refractive power; an aperture stop; and a second group with a positive refractive power, wherein the second group includes, from the object side to the image side in the following order, a biconvex lens, a biconcave lens, a negative meniscus lens a convex surface of which faces the image side, a biconvex lens, and a positive meniscus lens a convex surface of which faces the image side.
摘要翻译：图像形成透镜按照以下顺序从物体侧到像侧构成：具有正屈光力的第一组; 孔径光阑; 和具有正屈光力的第二组，其中所述第二组按照以下顺序包括从所述物体侧到所述像侧的双凸透镜，双凹透镜，其凸面面向所述像侧的负弯月形透镜，双凸透镜，以及其凸表面面向图像侧的正弯月透镜。

73. 发明申请

US20130194488A1 IMAGE-FORMING LENS, AND CAMERA DEVICE AND PORTABLE INFORMATION TERMINAL DEVICE WITH THE IMAGE-FORMING LENS 有权
标题翻译：图像形成镜头，以及具有图像形成镜头的相机设备和便携式信息终端设备
公开(公告)号：US20130194488A1
公开(公告)日：2013-08-01
申请号：US13803262
申请日：2013-03-14
申请人： Takashi Kubota , Kazuyasu Ohashi
发明人： Takashi Kubota , Kazuyasu Ohashi
IPC分类号： G02B13/00
CPC分类号： G02B13/0015 , G02B9/64 , G02B13/0045 , G02B13/009 , G02B13/04
摘要： An image forming lens consists of from an object side to an image side in the following order: a first group with a positive refractive power; an aperture stop; and a second group with a positive refractive power, wherein the second group includes, from the object side to the image side in the following order, a biconvex lens, a biconcave lens, a negative meniscus lens a convex surface of which faces the image side, a biconvex lens, and a positive meniscus lens a convex surface of which faces the image side.
摘要翻译：图像形成透镜按照以下顺序从物体侧到像侧构成：具有正屈光力的第一组; 孔径光阑; 和具有正屈光力的第二组，其中所述第二组按照以下顺序包括从所述物体侧到所述像侧的双凸透镜，双凹透镜，其凸面面向所述像侧的负弯月形透镜，双凸透镜，以及其凸表面面向图像侧的正弯月透镜。

74. 发明授权

US08305625B2 Image forming apparatus, log control method, and program product 有权
标题翻译：图像形成装置，对数控制方法和程序产品
公开(公告)号：US08305625B2
公开(公告)日：2012-11-06
申请号：US12486108
申请日：2009-06-17
申请人： Takashi Kubota , Ryosuke Mizunashi
发明人： Takashi Kubota , Ryosuke Mizunashi
IPC分类号： G06K15/00 , G06F3/12
CPC分类号： H04N1/00344 , H04N1/00832 , H04N2201/0094 , H04N2201/3202
摘要： An image forming apparatus for performing functions, includes a storage region configured to store logs of network services that execute the functions, wherein the storage region is divided into plural function segments each corresponding to one of the functions; a managing unit configured to manage the logs in groups formed by grouping together the network services in terms of the corresponding functions; a recording unit configured to record the logs of the network services into each of the function segments in the storage region according to the corresponding functions; and a stopping unit configured to stop the network services in terms of the groups managed by the managing unit, based on storage state information indicating an available space in each of the function segments in the storage region.
摘要翻译：一种用于执行功能的图像形成装置，包括：存储区域，被配置为存储执行所述功能的网络服务的日志，其中，所述存储区域被分成多个功能段，每个功能段各自对应于所述功能之一; 管理单元，被配置为通过根据相应功能将网络服务分组在一起形成的组中管理日志; 记录单元，被配置为根据相应的功能将网络服务的日志记录在存储区域中的每个功能段中; 以及停止单元，其被配置为基于表示存储区域中的每个功能段中的可用空间的存储状态信息来停止由管理单元管理的组的网络服务。

75. 发明授权

US08128240B2 Optical unit and projector apparatus 失效
标题翻译：光学单元和投影仪设备
公开(公告)号：US08128240B2
公开(公告)日：2012-03-06
申请号：US12628253
申请日：2009-12-01
申请人： Takashi Kubota , Katumi Muramatu
发明人： Takashi Kubota , Katumi Muramatu
IPC分类号： G03B21/14
CPC分类号： G03B21/14 , G02B7/006 , G02B27/1006 , G03B21/2066 , G03B21/2073 , G03B33/12
摘要： An optical unit includes a frame; an optical member having a rectangular plate-shape; and a pair of mount portions formed in the frame, each holding a side of the optical member. Each of the mount portions includes an insertion slot into which an end of the optical member in the width direction is inserted. The insertion slot is formed between first and second walls of the frame. The first wall includes a thickness direction positioning surface that is in contact with one of the surfaces of the optical member in a thickness direction. The second wall includes an inclined surface. The optical member is fixed to the frame using an adhesive in a state in which the one of the surfaces of the optical member is pressed against the thickness direction positioning surface and an end of the optical member in the height direction is pressed against the inclined surface.
摘要翻译：光学单元包括框架; 具有矩形板状的光学构件; 以及形成在框架中的一对安装部分，每个安装部分保持光学构件的一侧。每个安装部分包括一个插入槽，光学构件在宽度方向上的一端插入其中。插入槽形成在框架的第一和第二壁之间。第一壁包括在厚度方向上与光学构件的一个表面接触的厚度方向定位表面。第二壁包括倾斜表面。光学构件在光学构件的一个表面压靠厚度方向定位表面的状态下使用粘合剂固定到框架，并且光学构件的在高度方向上的端部被压靠在倾斜表面上。

76. 发明授权

US07902983B2 RFID tag 失效
标题翻译： RFID标签
公开(公告)号：US07902983B2
公开(公告)日：2011-03-08
申请号：US12193364
申请日：2008-08-18
申请人： Hiroshi Kobayashi , Kenji Kobae , Takashi Kubota , Hidehiko Kira
发明人： Hiroshi Kobayashi , Kenji Kobae , Takashi Kubota , Hidehiko Kira
IPC分类号： G08B13/00
CPC分类号： G06K19/07749 , G06K19/07728 , G06K19/0775 , H01L2224/16225 , H01L2224/16227 , H01L2224/81191
摘要： An RFID tag includes: a sheet-like base; an antenna provided on the base and extending along the base; a circuit chip mounted on the base and connected to the antenna for performing radio communication through the antenna; a protection body wider than the circuit chip and narrower than the antenna, which is located at least either above the circuit chip or on a backside of the circuit chip with the base interposed therebetween for protecting the circuit chip; and a connection section provided as a portion of the antenna at a location where an edge of the protection body and the antenna intersect with each other as viewed from a direction intersecting with a surface of the base, which includes one or more conductor patterns narrower than other portion of the antenna, and which connects inner and outer antenna portions of the edge with each other.
摘要翻译： RFID标签包括：片状基底; 设置在基座上并沿基座延伸的天线; 安装在基座上并连接到天线的电路芯片，用于通过天线进行无线电通信; 比电路芯片更宽的保护体，并且比天线窄，其位于电路芯片的上方或电路芯片的背面上，其中插入基板，用于保护电路芯片; 以及连接部，其在从与所述基部的表面相交的方向观察时，在所述保护体和所述天线的边缘彼此相交的位置处设置为所述天线的一部分，所述方向包括一个或多个导体图案，所述导体图案比天线的其他部分，并且将边缘的内天线部分和外天线部分彼此连接。

77. 发明授权

US07855841B2 Reflex, magnifying optical system 失效
标题翻译：反射，放大光学系统
公开(公告)号：US07855841B2
公开(公告)日：2010-12-21
申请号：US12397586
申请日：2009-03-04
申请人： Takashi Kubota
发明人： Takashi Kubota
IPC分类号： G02B15/14
CPC分类号： G02B15/177 , G02B17/0896
摘要： A first lens group in a reflex, magnifying optical system includes sequentially from the side of an object, a first lens that has a negative refractive power and is a meniscus lens having a concave aspect facing toward an image, an optical element (prism) that refracts an optical path, a second lens having a negative refractive power and a concave aspect facing toward the object, and a third lens having a positive refractive power. A portion of an image-side aspect of the first lens abuts a plane of incidence of the optical element. A portion of an object-side aspect of the second lens abuts a plane of transmission of the optical element.
摘要翻译：反射放大光学系统中的第一透镜组从物体侧依次包括具有负屈光力的第一透镜，并且是具有朝向图像的凹面的弯月形透镜;光学元件（棱镜），其折射光路，具有负折射力的第二透镜和朝向物体的凹面，以及具有正折光力的第三透镜。第一透镜的图像侧部分的一部分抵接光学元件的入射平面。第二透镜的物体侧部分的一部分抵靠光学元件的透射平面。

78. 发明授权

US07670873B2 Method of flip-chip mounting 有权
标题翻译：倒装芯片安装方法
公开(公告)号：US07670873B2
公开(公告)日：2010-03-02
申请号：US11435851
申请日：2006-05-18
申请人： Kimio Nakamura , Kenji Kobae , Takashi Kubota
发明人： Kimio Nakamura , Kenji Kobae , Takashi Kubota
IPC分类号： H01L21/00 , H01L21/44
CPC分类号： H01L24/75 , H01L24/83 , H01L24/90 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/75 , H01L2224/75304 , H01L2224/75744 , H01L2224/83139 , H01L2224/8314 , H01L2224/83192 , H01L2224/838 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/014 , H01L2924/3511 , H01L2924/00
摘要： A method of flip-chip mounting can reliably and stably mount a semiconductor chip to a mounting substrate while avoiding problems such as damage to the semiconductor chip due to a difference in thermal expansion coefficients between the semiconductor chip and the mounting substrate. The method of flip-chip mounting a semiconductor chip supports a mounting substrate on a stage in a state where a resin material has been supplied onto a chip mounting surface of the mounting substrate and presses the semiconductor chip toward the mounting substrate using a pressure/heat applying head to bond the semiconductor chip to the mounting substrate and thermally harden the resin material. A concave part is provided in a support surface of the stage that supports the semiconductor chip, and the semiconductor chip is bonded to the mounting substrate by pressing the semiconductor chip toward the mounting substrate using the pressure/heat applying head in a state where the mounting substrate is bent toward the concave part.
摘要翻译：一种倒装芯片安装方法可以可靠且稳定地将半导体芯片安装到安装基板，同时避免由于半导体芯片和安装基板之间的热膨胀系数的差异而导致对半导体芯片的损坏等问题。半导体芯片的倒装芯片的安装方法在将树脂材料供给到安装基板的芯片安装面上的状态下，将载置基板支撑在载台上，并使用压力/热量将半导体芯片朝向安装基板施加头部以将半导体芯片粘合到安装基板上并使树脂材料热硬化。在支撑半导体芯片的载物台的支撑面上设置有凹部，半导体芯片通过使用压力/加热头将半导体芯片压向安装基板而与安装基板接合，基板向凹部弯曲。

79. 发明申请

US20090183902A1 MULTILAYER FILM FOR WIRING AND WIRING CIRCUIT 审中-公开
标题翻译：用于接线和接线电路的多层膜
公开(公告)号：US20090183902A1
公开(公告)日：2009-07-23
申请号：US12374859
申请日：2007-10-11
申请人： Takashi Kubota , Yoshinori Matsuura
发明人： Takashi Kubota , Yoshinori Matsuura
IPC分类号： H05K1/09 , H01B5/00 , B44C1/22
CPC分类号： H01L29/4908 , C23C14/185 , C23C14/35 , H01L21/28008 , H01L23/53219 , H01L27/124 , H01L29/458 , H01L2924/0002 , H01L2924/00
摘要： The provided is a technology for forming a circuit for wiring, which can show a lower resistance, and particularly proposes a laminated film for wiring, which can surely decrease wiring resistance even in a large-sized liquid crystal display.The laminated film for wiring according to the present invention is characterized in that the laminated film for wiring comprises a metal layer with low resistance and an Al—Ni-based alloy layer containing 0.5 at % to 10.0 at % Ni laminated thereon. The metal layer with low resistance contains at least one or more elements among Au, Ag, Cu and Al, and has a specific resistance of 3 μΩ·cm or less.
摘要翻译：所提供的是用于形成布线电路的技术，其可以显示较低的电阻，并且特别提出一种即使在大尺寸液晶显示器中也可以确实降低布线电阻的布线用层叠膜。根据本发明的布线用层叠膜的特征在于，用于布线的层叠膜包括具有低电阻的金属层和层压有0.5原子％至10.0原子％的Ni的Al-Ni基合金层。具有低电阻的金属层包含Au，Ag，Cu和Al中的至少一种或多种元素，并且具有3μΩa.cm以下的电阻率。

80. 发明申请

US20080160309A1 Electrically Conductive Fine Particles, Anisotropic Electrically Conductive Material, and Electrically Conductive Connection Method 审中-公开
标题翻译：导电性微粒，各向异性导电材料和导电连接方法
公开(公告)号：US20080160309A1
公开(公告)日：2008-07-03
申请号：US11883852
申请日：2006-02-03
申请人： Takashi Kubota
发明人： Takashi Kubota
IPC分类号： B32B5/16
CPC分类号： C09C1/62 , C01P2006/40 , C09C1/627 , C23C18/1635 , C23C18/1651 , C23C18/1692 , Y10T428/2991
摘要： This invention provides electrically conductive fine particles, which, even when used particularly in plasma display panels, have low connection resistance and is large in current capacity at the time of connection, further can prevent migration upon heating, and can realize high connection reliability, and anisotropic electrically conductive materials using the electrically conductive fine particles and an electrically conductive connection method. The electrically conductive fine particles (1) comprise particles (2) and films formed by electroless plating on the surface of the particles, that is, a nickel plating film (3), a tin plating film (4), and a bismuth plating film (5) provided in that order, and a silver plating film (6) provided on the outermost surface. The anisotropic electrically conductive material comprises the above electrically conductive fine particles dispersed in a resin binder. The electrically conductive connection method comprises heating the above electrically conductive fine particles on the surface of an electrode to cause metal heat diffusion to form a silver-bismuth-tin film and to allow a part of the softened alloy film to flow on the surface of the electrode, thereby increasing the contact area.
摘要翻译：本发明提供导电性细颗粒，即使特别用于等离子体显示面板中也具有低连接电阻，并且在连接时电流容量大的情况下，还能够防止加热时的迁移，能够实现高连接可靠性，使用导电细颗粒的各向异性导电材料和导电连接方法。导电性细颗粒（1）包括颗粒（2）和通过在颗粒表面上的无电镀形成的膜，即镀镍膜（3），镀锡膜（4）和铋镀膜（5）和设置在最外表面上的镀银膜（6）。各向异性导电材料包括分散在树脂粘合剂中的上述导电细颗粒。导电连接方法包括加热电极表面上的上述导电细颗粒以引起金属热扩散以形成银 - 铋 - 锡膜，并使软化的合金膜的一部分在电极，从而增加接触面积。

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