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71. 发明授权

US09296084B2 Polishing control using weighting with default sequence 有权
标题翻译：使用默认序列加权抛光控制
公开(公告)号：US09296084B2
公开(公告)日：2016-03-29
申请号：US13553038
申请日：2012-07-19
申请人： Jimin Zhang , Zhihong Wang , Harry Q. Lee , Wen-Chiang Tu
发明人： Jimin Zhang , Zhihong Wang , Harry Q. Lee , Wen-Chiang Tu
IPC分类号： B24B37/013 , B24B37/10 , B24B49/12
CPC分类号： B24B37/013 , B24B37/105 , B24B49/12
摘要： A method of controlling polishing includes storing a sequence of default values, polishing a substrate, monitoring the substrate during polishing with an in-situ monitoring system, generating a sequence of measured values from measurements from the in-situ monitoring system, combining the sequence of measured values with the sequence of default values to generate a sequence of modified values, fitting a function to the sequence of modified values, and determining at least one of a polishing endpoint or an adjustment for a polishing rate based on the function.
摘要翻译：控制抛光的方法包括存储默认值序列，抛光衬底，用原位监测系统在抛光期间监测衬底，从原位监测系统的测量产生测量值序列，将序列测量值与默认值序列以生成修改值序列，将功能拟合到修改值序列，以及基于该函数确定抛光终点或抛光速率调整中的至少一个。

72. 发明授权

US09248544B2 Endpoint detection during polishing using integrated differential intensity 有权
标题翻译：使用积分差分强度的抛光期间的端点检测
公开(公告)号：US09248544B2
公开(公告)日：2016-02-02
申请号：US13552317
申请日：2012-07-18
申请人： Jimin Zhang , Harry Q. Lee , Zhihong Wang , Wen-Chiang Tu
发明人： Jimin Zhang , Harry Q. Lee , Zhihong Wang , Wen-Chiang Tu
IPC分类号： B24B37/013 , B24B37/04 , H01L21/66 , B24B49/12 , B24B37/10
CPC分类号： B24B37/013 , B24B37/042 , B24B37/105 , B24B49/12 , H01L22/12 , H01L22/26
摘要： A method of controlling a polishing operation includes polishing a substrate, during polishing obtaining a sequence over time of measured spectra from the substrate with an in-situ optical monitoring system, for each measured spectrum from the sequence of measured spectra determining a difference between the measured spectrum and an immediate previous spectrum from the sequence, accumulating the difference for each measured spectrum to generate a total difference, comparing the total difference to a threshold, and detecting a polishing endpoint based on the comparison of the total difference to the threshold.
摘要翻译：一种控制抛光操作的方法包括：在抛光过程中，利用原位光学监测系统从基板测量的光谱中获得随时间变化的序列，从测量光谱序列测得的每个测量光谱，从而确定基板的测量值频谱和来自序列的立即上一个频谱，累积每个测量频谱的差以产生总差，将总差与阈值进行比较，以及基于总差与阈值的比较来检测抛光端点。

73. 发明申请

US20140024292A1 Polishing Control Using Weighting With Default Sequence 有权
标题翻译：抛光控制使用加权默认序列
公开(公告)号：US20140024292A1
公开(公告)日：2014-01-23
申请号：US13553038
申请日：2012-07-19
申请人： Jimin Zhang , Zhihong Wang , Harry Q. Lee , Wen-Chiang Tu
发明人： Jimin Zhang , Zhihong Wang , Harry Q. Lee , Wen-Chiang Tu
IPC分类号： B24B37/005
CPC分类号： B24B37/013 , B24B37/105 , B24B49/12
摘要： A method of controlling polishing includes storing a sequence of default values, polishing a substrate, monitoring the substrate during polishing with an in-situ monitoring system, generating a sequence of measured values from measurements from the in-situ monitoring system, combining the sequence of measured values with the sequence of default values to generate a sequence of modified values, fitting a function to the sequence of modified values, and determining at least one of a polishing endpoint or an adjustment for a polishing rate based on the function.
摘要翻译：控制抛光的方法包括存储默认值序列，抛光衬底，用原位监测系统在抛光期间监测衬底，从原位监测系统的测量产生测量值序列，将序列测量值与默认值序列以生成修改值序列，将功能拟合到修改值序列，以及基于该函数确定抛光终点或抛光速率调整中的至少一个。

74. 发明申请

US20120100781A1 MULTIPLE MATCHING REFERENCE SPECTRA FOR IN-SITU OPTICAL MONITORING 审中-公开
标题翻译：用于现场光学监测的多重匹配参考光谱
公开(公告)号：US20120100781A1
公开(公告)日：2012-04-26
申请号：US13271023
申请日：2011-10-11
申请人： Jimin Zhang , Zhihong Wang , Harry Q. Lee , Wen-Chiang Tu
发明人： Jimin Zhang , Zhihong Wang , Harry Q. Lee , Wen-Chiang Tu
IPC分类号： B24B49/12
CPC分类号： B24B37/013 , B24B49/12
摘要： A method of controlling polishing includes storing a plurality libraries, each library including a plurality of reference spectra, polishing a substrate, measuring a sequence of spectra of light from the substrate during polishing, and for each measured spectrum of the sequence of spectra, finding a best matching first reference spectrum from a first library from the plurality of libraries and finding a best matching second reference spectrum from a different second library from the plurality of libraries, determining a first value associated with the best matching first reference spectrum and determining a second value from the best matching second reference spectrum, and calculating a third value from the first value and the second value to generate a sequence of calculated third values. At least one of a polishing endpoint or an adjustment for a polishing rate can be determined based on the sequence of calculated third values.
摘要翻译：控制抛光的方法包括存储多个库，每个库包括多个参考光谱，抛光衬底，在抛光期间测量来自衬底的光的光谱序列，以及对于光谱序列的每个测量光谱，找到从来自多个库的第一库中最佳匹配第一参考频谱，并从多个库中找到来自不同第二库的最佳匹配的第二参考频谱，确定与最佳匹配的第一参考频谱相关联的第一值并确定第二值并且从第一值和第二值计算第三值以生成计算出的第三值的序列。可以基于计算的第三值的顺序来确定抛光终点或抛光速率的调整中的至少一个。

75. 发明申请

US20190084119A1 Chattering Correction for Accurate Sensor Position Determination on Wafer 审中-公开
公开(公告)号：US20190084119A1
公开(公告)日：2019-03-21
申请号：US16122682
申请日：2018-09-05
申请人： Harry Q. Lee , Kun Xu , Jimin Zhang
发明人： Harry Q. Lee , Kun Xu , Jimin Zhang
IPC分类号： B24B37/013 , B24B37/20 , B24B49/10 , B24B49/12
摘要： A method of controlling polishing includes sweeping a sensor of an in-situ monitoring system across a substrate as a layer of the substrate undergoes polishing, generating from the in-situ monitoring system a sequence of signal values that depend on a thickness of the layer, detecting from the sequence of signal values, a time that the sensor traverses a leading edge of the substrate or a retaining ring and a time that the sensor traverses a trailing edge of the substrate or retaining ring; and for each signal value of at least some of the sequence of signal values, determining a position on the substrate for the signal value based on the time that the sensor traverses the leading edge and the time that the sensor traverses a trailing edge.

76. 发明申请

US20190389028A1 COMPENSATION FOR SUBSTRATE DOPING FOR IN-SITU ELECTROMAGNETIC INDUCTIVE MONITORING 审中-公开
公开(公告)号：US20190389028A1
公开(公告)日：2019-12-26
申请号：US16440785
申请日：2019-06-13
申请人： Wei Lu , David Maxwell Gage , Harry Q. Lee , Kun Xu , Jimin Zhang
发明人： Wei Lu , David Maxwell Gage , Harry Q. Lee , Kun Xu , Jimin Zhang
IPC分类号： B24B37/005 , B24B37/27 , B24B49/10 , G01B7/06
摘要： A method of chemical mechanical polishing includes bringing a substrate having a conductive layer disposed over a semiconductor wafer into contact with a polishing pad, generating relative motion between the substrate and the polishing pad, monitoring the substrate with an in-situ electromagnetic induction monitoring system as the conductive layer is polished to generate a sequence of signal values that depend on a thickness of the conductive layer, determining a sequence of thickness values for the conductive layer based on the sequence of signal values, and at least partially compensating for a contribution of conductivity of the semiconductor wafer to the signal values.

77. 发明申请

US20120034844A1 SPECTROGRAPHIC MONITORING USING INDEX TRACKING AFTER DETECTION OF LAYER CLEARING 审中-公开
标题翻译：检测层清除后使用索引跟踪进行光谱监测
公开(公告)号：US20120034844A1
公开(公告)日：2012-02-09
申请号：US12851467
申请日：2010-08-05
申请人： Jimin Zhang , Zhihong Wang , Harry Q. Lee , Wen-Chiang Tu
发明人： Jimin Zhang , Zhihong Wang , Harry Q. Lee , Wen-Chiang Tu
IPC分类号： B24B49/12
CPC分类号： B24B37/042 , B24B37/013 , B24B49/12
摘要： A method of controlling polishing includes storing a library having a plurality of reference spectra, each reference spectrum of the plurality of reference spectra having a stored associated index value, polishing a substrate having a second layer overlying a first layer, measuring a sequence of spectra of light from the substrate during polishing, for each measured spectrum of the sequence of spectra, finding a best matching reference spectrum to generate a sequence of best matching reference spectra, determining the associated index value for each best matching spectrum from the sequence of best matching reference spectra to generate a sequence of index values, detecting exposure of the first layer, fitting a function to a portion of the sequence of index values corresponding to spectra measured after detection of exposure of the first layer, and determining at least one of a polishing endpoint or an adjustment for a polishing rate based on the function.
摘要翻译：控制抛光的方法包括存储具有多个参考光谱的库，多个参考光谱的每个参考光谱具有存储的相关索引值，抛光具有覆盖第一层的第二层的衬底，测量第对于光谱序列的每个测量光谱，找到最佳匹配参考光谱以产生最佳匹配参考光谱序列，从最佳匹配参考序列确定每个最佳匹配光谱的相关索引值光谱以产生索引值序列，检测第一层的曝光，将功能拟合到对应于在检测到第一层的曝光之后测量的光谱的索引值序列的一部分，以及确定抛光终点中的至少一个或基于该功能的抛光速率的调整。

78. 发明授权

US08860932B2 Detection of layer clearing using spectral monitoring 有权
标题翻译：使用光谱监测检测层清除
公开(公告)号：US08860932B2
公开(公告)日：2014-10-14
申请号：US13189277
申请日：2011-07-22
申请人： Jimin Zhang , Zhihong Wang , Harry Q. Lee , Wen-Chiang Tu
发明人： Jimin Zhang , Zhihong Wang , Harry Q. Lee , Wen-Chiang Tu
IPC分类号： G01N21/00 , G01J3/00 , B24B37/04 , H01L21/66 , B24B37/013 , G01B11/06 , H01L21/321
CPC分类号： B24B37/013 , B24B37/042 , G01B11/0633 , G01B11/0683 , H01L21/3212 , H01L22/12 , H01L22/26
摘要： A method of polishing includes polishing a substrate having a second layer overlying a first layer, measuring a sequence of groups of spectra of light from the substrate while the substrate is being polished, each group of the groups of spectra including spectra from different locations on the substrate, for each group, calculating a value for a dispersion parameter of the spectra in the group to generate a sequence of dispersion values, and detecting exposure of the first layer based on the sequence of dispersion values.
摘要翻译：抛光方法包括抛光具有覆盖在第一层上的第二层的衬底，在衬底被抛光时测量来自衬底的光的光谱组序列，每组光谱组包括来自不同位置的光谱基板，对于每个组，计算组中的光谱的色散参数的值以产生色散值序列，并且基于色散值序列来检测第一层的曝光。

79. 发明申请

US20140024291A1 Endpoint Detection During Polishing Using Integrated Differential Intensity 有权
标题翻译：使用积分微分强度进行抛光时的端点检测
公开(公告)号：US20140024291A1
公开(公告)日：2014-01-23
申请号：US13552317
申请日：2012-07-18
申请人： Jimin Zhang , Harry Q. Lee , Zhihong Wang , Wen-Chiang Tu
发明人： Jimin Zhang , Harry Q. Lee , Zhihong Wang , Wen-Chiang Tu
IPC分类号： B24B49/12 , B24B7/00
CPC分类号： B24B37/013 , B24B37/042 , B24B37/105 , B24B49/12 , H01L22/12 , H01L22/26
摘要： A method of controlling a polishing operation includes polishing a substrate, during polishing obtaining a sequence over time of measured spectra from the substrate with an in-situ optical monitoring system, for each measured spectrum from the sequence of measured spectra determining a difference between the measured spectrum and an immediate previous spectrum from the sequence, accumulating the difference for each measured spectrum to generate a total difference, comparing the total difference to a threshold, and detecting a polishing endpoint based on the comparison of the total difference to the threshold.
摘要翻译：一种控制抛光操作的方法包括：在抛光过程中，利用原位光学监测系统从基板测量的光谱中获得随时间变化的序列，从测量光谱序列测得的每个测量光谱，从而确定基板的测量值频谱和来自序列的立即上一个频谱，累积每个测量频谱的差以产生总差，将总差与阈值进行比较，以及基于总差与阈值的比较来检测抛光端点。

80. 发明申请

US20120026492A1 DETECTION OF LAYER CLEARING USING SPECTRAL MONITORING 有权
标题翻译：使用光谱监测检测层清除
公开(公告)号：US20120026492A1
公开(公告)日：2012-02-02
申请号：US13189277
申请日：2011-07-22
申请人： Jimin Zhang , Zhihong Wang , Harry Q. Lee , Wen-Chiang Tu
发明人： Jimin Zhang , Zhihong Wang , Harry Q. Lee , Wen-Chiang Tu
IPC分类号： G01J3/00
CPC分类号： B24B37/013 , B24B37/042 , G01B11/0633 , G01B11/0683 , H01L21/3212 , H01L22/12 , H01L22/26
摘要： A method of polishing includes polishing a substrate having a second layer overlying a first layer, measuring a sequence of groups of spectra of light from the substrate while the substrate is being polished, each group of the groups of spectra including spectra from different locations on the substrate, for each group, calculating a value for a dispersion parameter of the spectra in the group to generate a sequence of dispersion values, and detecting exposure of the first layer based on the sequence of dispersion values.
摘要翻译：抛光方法包括抛光具有覆盖在第一层上的第二层的衬底，在衬底被抛光时测量来自衬底的光的光谱组序列，每组光谱组包括来自不同位置的光谱基板，对于每个组，计算组中的光谱的色散参数的值以产生色散值序列，并且基于色散值序列来检测第一层的曝光。

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