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    • 74. 发明授权
    • Method and system for providing contact to a first polysilicon layer in a flash memory device
    • 用于提供与闪存器件中的第一多晶硅层的接触的方法和系统
    • US08329530B1
    • 2012-12-11
    • US13566741
    • 2012-08-03
    • Mark S. ChangHao FangKing Wai Kelwin Ko
    • Mark S. ChangHao FangKing Wai Kelwin Ko
    • H01L31/0328H01L31/0336H01L31/072H01L31/109
    • H01L27/11521H01L21/76816H01L27/115
    • A method and system for providing at least one contact in a flash memory device is disclosed. The flash memory device includes a plurality of gate stacks and at lease one component including a polysilicon layer as a top surface. The method and system further include forming a silicide on the top surface of the polysilicon layer and providing an insulating layer covering the plurality of gate stacks, the at least one component and the silicide. The method and system also include etching the insulating layer to provide at least one contact hole. The insulating layer etching step uses the silicide as an etch stop layer to ensure that the insulating etching step does not etch through the polysilicon layer. The method and system also include filling the at least one contact hole with a conductor.
    • 公开了一种用于在闪速存储器件中提供至少一个触点的方法和系统。 闪速存储器件包括多个栅极堆叠,并且至少包括一个包括多晶硅层作为顶表面的部件。 该方法和系统还包括在多晶硅层的顶表面上形成硅化物,并提供覆盖多个栅叠层,至少一个元件和硅化物的绝缘层。 该方法和系统还包括蚀刻绝缘层以提供至少一个接触孔。 绝缘层蚀刻步骤使用硅化物作为蚀刻停止层,以确保绝缘蚀刻步骤​​不会蚀刻通过多晶硅层。 该方法和系统还包括用导体填充至少一个接触孔。