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    • 71. 发明授权
    • Liquid crystal display device
    • 液晶显示装置
    • US4346963A
    • 1982-08-31
    • US10260
    • 1979-02-06
    • Manfred KobaleHans Krueger
    • Manfred KobaleHans Krueger
    • G09F9/30G02F1/1339G02F1/137G02F1/133
    • G02F1/13394G02F1/13737
    • A liquid crystal display device has a pair of carrier plates having a liquid crystal layer therebetween. Electrically conductive coatings are on each plate with at least one of the coatings being subdivided into separate operable segments. Spacing members are in regions of the layer which are not adjacent to the operable segments. Support surfaces are on a facing surface of one of the plates. Spacing elements are on the other plate and project from the facing surface toward and engage the support surfaces so that the thickness of the liquid crystal layer in the region of the support surfaces is less than the thickness of the layer in the area of the operable segments. The support surfaces may be a layer on the surface of one of the carrier plates or may be a surface of the carrier plate defined by recesses etched into the plate, which recesses contain surfaces supporting the operable segments. To ensure contact between the spacing elements and support surfaces, one of the carrier plates can be provided with a layer which has a different coefficient of thermal expansion so that after being applied at an elevated temperature and cooled, the layer will cause the plate to deflect toward the other plate. The support surfaces may be formed by applying different types of layers of material on the surface of the carrier member either in the desired shape or as a continuous layer with the undesired portions being subsequently removed.
    • 液晶显示装置具有一对在其间具有液晶层的载板。 导电涂层在每个板上,其中至少一个涂层被细分为单独的可操作的部分。 间隔构件位于不与可操作段相邻的层的区域中。 支撑表面位于其中一个板的面对表面上。 间隔元件位于另一个板上并且从相对表面突出并支撑支撑表面,使得支撑表面区域中的液晶层的厚度小于可操作段的区域中的层的厚度 。 支撑表面可以是一个承载板的表面上的层,或者可以是由蚀刻到板中的凹部限定的承载板的表面,这些凹部包含支撑可操作段的表面。 为了确保间隔元件和支撑表面之间的接触,其中一个承载板可以设置有具有不同热膨胀系数的层,使得在被升高的温度下被施加并被冷却之后,该层将导致板偏转 朝向另一块板。 支撑表面可以通过在载体构件的表面上以期望的形状或作为连续层施加不同类型的材料层而形成,其中不期望的部分随后被去除。
    • 73. 发明授权
    • Liquid crystal display device
    • 液晶显示装置
    • US4150877A
    • 1979-04-24
    • US717709
    • 1976-08-25
    • Manfred KobaleHans KruegerHans-Peter Lorenz
    • Manfred KobaleHans KruegerHans-Peter Lorenz
    • G02F1/1337G02F1/13
    • G02F1/1337
    • A liquid crystal display device having two carrier plates each having a first surface supporting electrically conducting electrode layers, the plates being hermetically sealed together with the first surfaces in facing relationship to form a chamber receiving a liquid crystal layer characterized by a covering layer disposed on each of the first surfaces. In the preferred embodiment, each of the first surfaces is provided with an obliquely vapor deposited aligning layer inbetween the conducting layer and the covering layer which covering layer has a thickness no greater than 0.05 microns and preferably less than 0.02 microns. The covering layer may be a silane derivative bonded by chemosorption on the aligning layer, a nitride such as silicon nitride, or an oxide. In producing the display device, a method which includes vapor depositing aligning layer on the first surface of each carrier plate subsequent to applying the electrical conducting electrode layers and prior to sealing the plates includes the improvement of applying the covering layer. The covering layer may be applied by sputtering-on process, by pyrolytic process, by a resinate technique, by immersion of a material and by reacting with a material applied to the surface to be coated.
    • 一种具有两个承载板的液晶显示装置,每个支撑板具有支撑导电电极层的第一表面,该板与第一表面以面对关系的方式密封在一起形成容纳液晶层的室,其特征在于每个 的第一个表面。 在优选实施例中,每个第一表面在导电层和覆盖层之间设置倾斜气相沉积的对准层,该覆盖层的厚度不大于0.05微米,优选小于0.02微米。 覆盖层可以是通过化学吸附在取向层上接合的硅烷衍生物,氮化物如氮化硅或氧化物。 在制造显示装置时,在施加导电电极层之后并且在密封板之前,在每个载体板的第一表面上包括气相沉积取向层的方法包括涂覆覆盖层的改进。 覆盖层可以通过溅射工艺,热解法,树脂酸盐技术,浸渍材料和与施加到待涂覆表面上的材料反应来施加。
    • 76. 发明授权
    • Method and apparatus for producing chip devices, and chip device produced by means of the method
    • 用于制造芯片器件的方法和设备,以及通过该方法制造的芯片器件
    • US09114979B2
    • 2015-08-25
    • US13228971
    • 2011-09-09
    • Michael GernerHans KruegerAlois Stelzl
    • Michael GernerHans KruegerAlois Stelzl
    • H01L21/00B81C1/00
    • B81C1/00333
    • A chip device is produced providing at least one wafer having a plurality of chip components. The wafer or wafers are separated into the individual chip components and/or into groups of chip components. The individual chip components and/or the groups of chip components are applied to a carrier element, in such a way that interspaces having a predetermined width are formed between the individual chip components and/or the groups of chip components. A polymer is introduced into the interspaces in order to form a composite element composed of the chip components and a polymer matrix. The composite element is separated in such a way that chip devices composed of in each case one of the chip components and at least one section of the polymer matrix are formed. The invention furthermore relates to a chip device produced by means of the method.
    • 制造提供具有多个芯片部件的至少一个晶片的芯片器件。 将晶片或晶片分离成各个芯片组件和/或分组成芯片组件。 单个芯片组件和/或芯片组件组被施加到载体元件,使得在各个芯片组件和/或芯片组件组之间形成具有预定宽度的间隙。 将聚合物引入到间隙中以形成由芯片部件和聚合物基体组成的复合元件。 复合元件以这样的方式分离,即在每种情况下由芯片部件和聚合物基体的至少一个部分组成的芯片器件形成。 本发明还涉及通过该方法制造的芯片器件。