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71. 发明授权

US08668794B2 Mixing bonding adhesive at die bonder before dispense 有权
标题翻译：在分配前在管芯粘合机上混合粘合剂
公开(公告)号：US08668794B2
公开(公告)日：2014-03-11
申请号：US13020311
申请日：2011-02-03
申请人： Frank Yu , Eric Hsieh , Kevin Jin
发明人： Frank Yu , Eric Hsieh , Kevin Jin
IPC分类号： B32B41/00
CPC分类号： B05C11/10 , B29C47/0009 , B29C47/026
摘要： A method for die bonding includes positioning a dispenser in a die bonding apparatus, wherein the dispenser includes a reservoir having bonding adhesive therein including particles and a liquid carrier. The dispenser is moved to provide mechanical agitation to the dispenser for mixing the bonding adhesive into a homogeneous mixture of particles and the liquid carrier, wherein the bonding adhesive is not dispensed during moving. After the moving, the bonding adhesive is dispensed onto a bonding location on the workpiece without removing the dispenser from the die attach apparatus. An integrated circuit (IC) die is attached onto the bonding adhesive over the bonding location. The method can also include determining an amount of time elapsed after the last mixing of the bonding adhesive or the positioning of the dispenser in the die bonding apparatus, and automatically initiating movement for mixing only if the elapsed time exceeds a predetermined time.
摘要翻译：一种用于芯片接合的方法包括将分配器定位在芯片接合装置中，其中分配器包括其中具有粘合剂的储存器，其中包括颗粒和液体载体。移动分配器以向分配器提供机械搅拌，用于将粘合粘合剂混合成粒子和液体载体的均匀混合物，其中粘合粘合剂在移动期间不分配。在移动之后，将粘合粘合剂分配到工件上的粘合位置上，而不从管芯附接装置移除分配器。集成电路（IC）管芯在接合位置附着在粘结粘合剂上。该方法还可以包括确定在粘合粘合剂的最后混合之后经过的时间量或分散器在芯片粘合装置中的定位，以及仅在经过时间超过预定时间时才自动启动混合运动。

72. 发明授权

US08058706B2 Delamination resistant packaged die having support and shaped die having protruding lip on support 有权
标题翻译：具有支撑和成形模具的耐层压包装模具在支撑件上具有突出的唇缘
公开(公告)号：US08058706B2
公开(公告)日：2011-11-15
申请号：US12555646
申请日：2009-09-08
申请人： Chien-Te Feng , Kazuaki Ano , Frank Yu , Trevor Liu
发明人： Chien-Te Feng , Kazuaki Ano , Frank Yu , Trevor Liu
IPC分类号： H01L29/06
CPC分类号： H01L29/0657 , H01L23/13 , H01L23/3107 , H01L23/3128 , H01L23/49503 , H01L23/49513 , H01L23/49816 , H01L24/05 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/83 , H01L2224/29035 , H01L2224/29101 , H01L2224/2919 , H01L2224/32014 , H01L2224/32105 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48475 , H01L2224/4848 , H01L2224/73265 , H01L2224/83192 , H01L2224/83194 , H01L2224/8385 , H01L2224/85051 , H01L2224/92247 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/10156 , H01L2924/10158 , H01L2924/10253 , H01L2924/14 , H01L2924/1461 , H01L2924/15151 , H01L2924/15153 , H01L2924/15311 , H01L2924/181 , H01L2924/18165 , H01L2924/19041 , H01L2924/35121 , Y10T29/49128 , H01L2924/00012 , H01L2924/00 , H01L2924/3512 , H01L2224/45099 , H01L2224/85399 , H01L2224/05599
摘要： A packaged electronic device includes a thickness shaped IC die including a top portion, top surface, active circuitry, bottom portion and bottom surface. A cross sectional area of the bottom surface is ≧5% less than a cross sectional area of the top surface to provide a protruding lip having a bottom lip surface. A package substrate includes a top substrate surface including substrate bonding sites, a bottom substrate surface, and a die support structure on the top substrate surface having a gap region. The bottom lip surface of the IC die is secured to the die support structure and the bottom surface of the IC die extends below the die support structure into the gap region. Coupling connectors couple the bonding features on the IC die to the substrate bonding sites.
摘要翻译：封装的电子器件包括厚度形状的IC管芯，其包括顶部，顶面，有源电路，底部和底面。底面的横截面积比顶面的截面积小5％以提供具有底唇表面的突出唇缘。封装衬底包括顶部衬底表面，其包括衬底结合部位，底部衬底表面以及具有间隙区域的顶部衬底表面上的管芯支撑结构。 IC芯片的底部唇表面固定到模具支撑结构，并且IC芯片的底表面在模具支撑结构的下方延伸到间隙区域中。耦合连接器将IC芯片上的结合特征耦合到基板结合位置。

73. 发明申请

US20090236715A1 SEMICONDUCTOR PACKAGE STRUCTURE WITH LAMINATED INTERPOSING LAYER 审中-公开
标题翻译：半导体封装结构与层压插层
公开(公告)号：US20090236715A1
公开(公告)日：2009-09-24
申请号：US12050722
申请日：2008-03-18
申请人： Kazuaki Ano , Frank Yu , Wei Lung Hsu
发明人： Kazuaki Ano , Frank Yu , Wei Lung Hsu
IPC分类号： H01L23/00 , H01L21/50
CPC分类号： H01L24/83 , H01L24/32 , H01L25/0657 , H01L25/50 , H01L2224/32057 , H01L2224/83051 , H01L2224/83191 , H01L2224/83194 , H01L2224/83365 , H01L2224/83385 , H01L2224/83855 , H01L2225/06568 , H01L2924/01029 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/14 , H01L2924/30105 , H01L2924/3025
摘要： The invention relates to microelectronic semiconductor chip assemblies having vertically stacked layers. In a disclosed example of a preferred embodiment, a vertically stacked semiconductor chip assembly includes a first semiconductor chip affixed to the surface of a substrate. A laminated interposing layer therebetween includes a first adhesive material and a second adhesive material, at least one of the adhesive materials adapted to capturing debris. Methods are disclosed for making a vertically stacked semiconductor chip assemblies by joining first and second adhesive materials to form a laminated interposing layer between a first chip and second chip or substrate. In preferred embodiments of the invention, the interposing layer includes polyimide film and one adhesive material of relatively low elasticity, and another adhesive material having relatively high elasticity.
摘要翻译：本发明涉及具有垂直堆叠层的微电子半导体芯片组件。在优选实施例的公开示例中，垂直堆叠的半导体芯片组件包括固定到基板表面的第一半导体芯片。其间的层叠中介层包括第一粘合材料和第二粘合材料，至少一种粘合剂材料适于捕获碎片。公开了通过接合第一和第二粘合剂材料来形成垂直堆叠的半导体芯片组件以在第一芯片和第二芯片或衬底之间形成层叠的中介层的方法。在本发明的优选实施例中，插入层包括聚酰亚胺膜和一种弹性相对较低的粘合材料，另一种粘合材料具有较高的弹性。

74. 发明授权

US08039955B2 Mold lock on heat spreader 有权
标题翻译：模具锁上散热器
公开(公告)号：US08039955B2
公开(公告)日：2011-10-18
申请号：US12463729
申请日：2009-05-11
申请人： Chien-Te Feng , Frank Yu
发明人： Chien-Te Feng , Frank Yu
IPC分类号： H01L23/48
CPC分类号： H01L23/3107 , H01L21/4878 , H01L23/3142 , H01L23/4334 , H01L23/562 , H01L24/48 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014 , H01L2924/14 , H01L2924/181 , H01L2924/1815 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A mold lock and a method of forming the mold lock are provided. The mold lock is used in an encapsulated semiconductor device and includes a neck and a shaped head integral with the neck. The mold lock can be formed to project above a support component, such as a heat spreader, of the semiconductor device and the neck is formed from the support component. The shaped head is of a greater dimension than the neck and can present a “T” shape in side view or a “Y” shape in side view. A base portion of the neck is seated within the support component. A method is provided for forming the described mold lock.
摘要翻译：提供了模具锁和形成模具锁的方法。模具锁用于封装的半导体器件中，并且包括与颈部成一体的颈部和形状的头部。模具锁可以形成为突出在半导体器件的支撑部件（例如散热器）上方，并且颈部由支撑部件形成。成形头部的尺寸比颈部大，并且可以在侧视图中呈现“T”形或侧视图中呈“Y”形。颈部的基部位于支撑部件内。提供了一种用于形成所述模具锁的方法。

75. 发明申请

US20080073028A1 Methods and apparatus to dispense adhesive for semiconductor packaging 审中-公开
标题翻译：分配用于半导体封装的粘合剂的方法和设备
公开(公告)号：US20080073028A1
公开(公告)日：2008-03-27
申请号：US11513962
申请日：2006-08-31
申请人： Frank Yu , Kevin Jin , Muhammad F. Khan , Mario A. Magana
发明人： Frank Yu , Kevin Jin , Muhammad F. Khan , Mario A. Magana
IPC分类号： B32B37/12 , B32B37/00
CPC分类号： B05C5/0212 , B05C5/0225 , B05C5/027 , H01L24/27 , H01L24/29 , H01L24/743 , H01L24/83 , H01L2224/2919 , H01L2224/32245 , H01L2224/32257 , H01L2224/743 , H01L2224/83192 , H01L2224/83194 , H01L2224/838 , H01L2924/01005 , H01L2924/01033 , H01L2924/01082 , H01L2924/0665 , H01L2924/14 , Y10T156/1798 , H01L2924/00
摘要： Methods and apparatus are disclosed to dispense adhesive for semiconductor packaging. A disclosed example shower head dispenser includes a body to receive adhesive from the dispenser, and a shower head tip having a dispensing cavity in communication with the body to dispense the adhesive in a pattern. The example shower head dispenser also includes a layer of non-stick material coating a contact surface of the dispensing cavity to reduce tailing of the adhesive.
摘要翻译：公开了分配用于半导体封装的粘合剂的方法和装置。所公开的示例性淋浴喷头分配器包括从分配器接收粘合剂的主体以及具有与主体连通的分配腔的喷头头部，以分配图案中的粘合剂。示例性喷头分配器还包括涂覆分配腔的接触表面的不粘材料层，以减少粘合剂的拖尾。

76. 发明申请

US20070255891A1 High-Speed Controller for Phase-Change Memory Peripheral Device 失效
标题翻译：用于相变存储器外围设备的高速控制器
公开(公告)号：US20070255891A1
公开(公告)日：2007-11-01
申请号：US11770642
申请日：2007-06-28
申请人： David Chow , Charles Lee , Frank Yu
发明人： David Chow , Charles Lee , Frank Yu
IPC分类号： G06F12/00
CPC分类号： G06F12/0804 , G06F12/0238 , G06F13/16 , G06F13/161 , G06F2212/1016 , G06F2212/2022 , G11C7/10 , G11C7/1015 , G11C8/08 , G11C8/12 , G11C13/0004 , G11C13/0023 , G11C13/0028 , G11C13/0061 , G11C13/0069 , G11C2013/0071 , G11C2211/5641 , G11C2213/79
摘要： Peripheral devices store data in non-volatile phase-change memory (PCM). PCM cells have alloy resistors with high-resistance amorphous states and low-resistance crystalline states. The peripheral device can be a Multi-Media Card/Secure Digital (MMC/SD) card. A PCM controller accesses PCM memory devices. Various routines that execute on a CPU in the PCM controller are activated in response to commands in the host-bus transactions. The PCM system increases the throughput of one or more phase-change memory devices by performing one or more of a read-ahead memory operation, a write-ahead memory write operation, a larger page memory write operation, a wider data bus memory write operation, a multi-channel concurrent multi-bank interleaving memory read or write operation, a write-cache memory write operation, and any combination thereof.
摘要翻译：外围设备将数据存储在非易失性相变存储器（PCM）中。 PCM单元具有具有高电阻非晶态和低电阻晶体态的合金电阻。外围设备可以是多媒体卡/安全数字（MMC / SD）卡。 PCM控制器访问PCM存储器设备。响应于主机总线事务中的命令，激活在PCM控制器中的CPU上执行的各种例程。 PCM系统通过执行预读存储器操作，预写存储器写操作，较大页存储器写操作，更宽数据总线存储器写操作中的一个或多个来增加一个或多个相变存储器件的吞吐量多通道同时多存储体交错存储器读或写操作，写高速缓存存储器写操作及其任意组合。

77. 发明申请

US20060031126A1 Method and for facilitating network communication between a wireless device and a service system via an interface 审中-公开
标题翻译：方法并且用于通过接口促进无线设备和服务系统之间的网络通信
公开(公告)号：US20060031126A1
公开(公告)日：2006-02-09
申请号：US11177178
申请日：2005-07-07
申请人： David Ma , Frank Yu
发明人： David Ma , Frank Yu
IPC分类号： G03G15/00
CPC分类号： H04L69/04 , G06Q30/0601 , H04N1/001 , H04N1/00106 , H04N1/00307 , H04N1/00312 , H04N2201/0024 , H04N2201/0039 , H04N2201/0086 , H04W4/00 , H04W4/18 , H04W8/24 , H04W12/06 , H04W28/06 , H04W76/10 , H04W80/00 , H04W84/042 , H04W88/02
摘要： A wireless communication system is provided to enable a wireless communication interface configured to communicate with a wireless device, then to further communicate with a network interface configured to facilitate communication between the communication interface and a network, where the network is configured to facilitate communication among devices that communicate with the network. The system is able to establish communication link with the application server retrieving wireless user related information and content from the wireless device; and communicate with the application server to transmit user information received from the wireless device and related content.
摘要翻译：提供无线通信系统以使能配置成与无线设备进行通信的无线通信接口，然后进一步与被配置为促进通信接口和网络之间的通信的网络接口进行通信，其中网络被配置为促进设备之间的通信与网络通信。该系统能够与应用服务器建立与无线设备的无线用户相关信息和内容的通信链路; 并与应用服务器通信以发送从无线设备接收的用户信息和相关内容。

78. 发明授权

US4927018A Disposable covered needle safety assembly 失效
标题翻译：一次性覆盖针安全组件
公开(公告)号：US4927018A
公开(公告)日：1990-05-22
申请号：US280322
申请日：1988-12-06
申请人： Herbert Yang , Patrick Han , Frank Yu
发明人： Herbert Yang , Patrick Han , Frank Yu
IPC分类号： A61M5/32
CPC分类号： A61M5/3243 , A61M5/3205
摘要： A needle assembly and cylindrical cover housing which are usable with a conventional hypodermic syringe. The needle assembly has a circular mount on it with catch slots and slanted surfaces. The cover housing has inward projections which are flexible so that the hypodermic syringe can be received in the cover housing and also for frictionally engaging in the catch slots so as to secure the needle assembly completely in the cover housing after usage.
摘要翻译：针组件和圆柱形盖壳体，其可与常规皮下注射器一起使用。针组件在其上具有带有卡槽和倾斜表面的圆形安装件。盖壳体具有柔性的向内突起，使得皮下注射器可以容纳在盖壳体中并且还用于摩擦地接合在卡槽中，以便在使用后将针组件完全固定在盖壳体中。

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