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71. 发明申请

US20060285559A1 METHOD FOR CONTROLLING HOST FROM DEVICE COUPLED THERETO USING UNIVERSAL SERIAL BUS AND SYSTEM THEREOF 审中-公开
标题翻译：使用通用串行总线及其系统控制与设备耦合的设备的方法
公开(公告)号：US20060285559A1
公开(公告)日：2006-12-21
申请号：US11160261
申请日：2005-06-16
申请人： Chih-Hung Cheng
发明人： Chih-Hung Cheng
IPC分类号： H04J3/12 , H04L12/56 , H04L12/28 , G06F15/16 , G06F13/38 , G06F13/12
CPC分类号： H04N21/42646 , G06F13/426 , H04N7/163 , H04N21/4122 , H04N21/43615 , H04N21/43632 , H04N21/643
摘要： A universal serial bus (USB) system includes a host comprising a pattern detector for detecting a predetermined pattern in a USB packet; and an external device being coupled to the host using a USB. When the pattern detector detects the predetermined pattern, the external device is operative to control the host by issuing a USB response packet comprising an external device command from the external device to the host in response to a USB command packet issued from the host.
摘要翻译：通用串行总线（USB）系统包括：主机，其包括用于检测USB分组中的预定模式的模式检测器; 以及使用USB耦合到主机的外部设备。当图案检测器检测到预定图案时，响应于从主机发出的USB命令包，外部设备可操作以通过从外部设备向主机发出包括外部设备命令的USB响应包来控制主机。

72. 发明申请

US20060175109A1 Motorcycle with front side wheels 审中-公开
标题翻译：摩托车前轮
公开(公告)号：US20060175109A1
公开(公告)日：2006-08-10
申请号：US11047584
申请日：2005-02-02
申请人： Chih-Hung Cheng
发明人： Chih-Hung Cheng
IPC分类号： B62K11/00
CPC分类号： B62K5/01 , B62H1/12
摘要： A pair of side wheels mounted to the front wheel of a motorcycle includes front base frame, steering unit comprised of linkage and steering rod set being pivoted to the center of the base frame, two side suspensions, and two side wheels; a pair of connection rods of the linkage unit each respectively pivoted to the base of the side wheel unit; a regulator from the suspension unit being connected to where between the base and the base frame, and further to head tube of the frame through an absorber; and the base being pivoted to the side wheel to improve riding safety and stability.
摘要翻译：安装在摩托车的前轮上的一对侧轮包括前基座，由连杆和转向杆组构成的转向单元，该转向杆组件枢转到基架的中心，两个侧悬架和两个侧轮; 所述联动单元的一对连接杆各自分别枢转到所述侧轮单元的基部; 来自悬挂单元的调节器连接到基座和底座之间的位置，并且通过吸收器进一步到框架的头管; 并且基座枢转到侧轮以改善骑行安全性和稳定性。

73. 发明授权

US06171976B2 Method of chemical-mechanical polishing 有权
标题翻译：化学机械抛光方法
公开(公告)号：US06171976B2
公开(公告)日：2001-01-09
申请号：US09261098
申请日：1999-03-02
申请人： Chih-Hung Cheng
发明人： Chih-Hung Cheng
IPC分类号： H01L21302
CPC分类号： H01L21/31053
摘要： A method of chemical-mechanical polishing. A die region and a scribe line region are defined on a wafer. A dummy pattern is formed in the scribe line region. A dielectric layer is formed to cover the dummy pattern and the wafer. The dielectric layer is planarized by chemical-mechanical polishing.
摘要翻译：化学机械抛光方法。芯片区域和划线区域被限定在晶片上。在划线区域中形成虚拟图案。形成介电层以覆盖虚设图案和晶片。介电层通过化学机械抛光进行平面化。

74. 发明授权

US08786504B2 Circuit capable of automatically calibrating a resonance frequency of an antenna and method thereof 有权
标题翻译：能够自动校准天线的共振频率的电路及其方法
公开(公告)号：US08786504B2
公开(公告)日：2014-07-22
申请号：US13110896
申请日：2011-05-18
申请人： Hsin-Chin Hsu , Fang-Lih Lin , Chih-Hung Cheng
发明人： Hsin-Chin Hsu , Fang-Lih Lin , Chih-Hung Cheng
IPC分类号： H01Q9/00 , H04B5/00 , H04B17/00
CPC分类号： H04B5/0068 , H04B5/0081 , H04B17/21
摘要： A circuit capable of automatically calibrating a resonant frequency of an antenna includes the antenna, a switch, a conversion unit, a count comparator, and a capacitor array. The switch is coupled to the antenna for being turned on and turned off according to a pulse. The antenna is used for generating the resonant frequency according to on and off of the switch. The conversion unit is coupled to the antenna for generating a clock according to a signal with the resonant frequency. The count comparator is coupled to the conversion unit for counting a number generated by a reference clock during a period of the clock, and comparing the pulse number with a predetermined value to generate an adjustment signal. The capacitor array is used for adjusting capacitance of the capacitor array according to the adjustment signal.
摘要翻译：能够自动校准天线的谐振频率的电路包括天线，开关，转换单元，计数比较器和电容器阵列。开关被耦合到天线，以根据脉冲被导通和关断。该天线用于根据开关的导通和关断产生谐振频率。转换单元耦合到天线，用于根据具有谐振频率的信号产生时钟。计数比较器耦合到转换单元，用于在时钟周期期间对由参考时钟生成的数字进行计数，并将脉冲数与预定值进行比较以产生调整信号。电容器阵列用于根据调整信号调整电容器阵列的电容。

75. 发明授权

US08684563B2 Heat dissipating structure of LED lamp cup made of porous material 有权
标题翻译： LED灯杯散热结构由多孔材料制成
公开(公告)号：US08684563B2
公开(公告)日：2014-04-01
申请号：US12345976
申请日：2008-12-30
申请人： Kuo-Len Lin , Chen-Hsiang Lin , Hwai-Ming Wang , Chiao-Li Huang , Ken Hsu , Chih-Hung Cheng
发明人： Kuo-Len Lin , Chen-Hsiang Lin , Hwai-Ming Wang , Chiao-Li Huang , Ken Hsu , Chih-Hung Cheng
IPC分类号： F21V29/00 , F21V5/00 , F21V3/00 , B60Q1/06
CPC分类号： F21V29/89 , F21K9/233 , F21V29/507 , F21V29/773 , F21V29/83 , F21V29/86 , F21Y2103/10 , F21Y2115/10
摘要： A heat dissipating structure of a lightweight lamp cup 10 made of a porous material includes a containing cavity 11 at an end of the lamp cup 10, a lamp holder 30 at another end of the containing cavity 11, a metal hood 60 sheathed with the lamp holder 30 and covered onto an external side of the lamp cup 10, a heat conduction medium 50 between the lamp cup 10 and the metal hood 60, and a light emitting unit 20 contained in the containing cavity 11 of the lamp cup 10, such that the heat produced by the light emitting unit 20 can be conducted form the lamp cup 10 to the metal hood 60 and dissipated from the metal hood 60 to the outside.
摘要翻译：由多孔材料制成的轻型灯杯10的散热结构包括在灯杯10的一端的容纳腔11，在容纳腔11的另一端的灯座30，与灯罩相配的金属罩60 保持器30并且覆盖在灯杯10的外侧，灯杯10和金属罩60之间的导热介质50以及容纳在灯杯10的容纳腔11中的发光单元20，使得由发光单元20产生的热量可以从灯杯10传导到金属罩60并从金属罩60散发到外部。

76. 发明授权

US08528627B2 Heat-dissipating device having air-guiding cover 失效
标题翻译：具有导气盖的散热装置
公开(公告)号：US08528627B2
公开(公告)日：2013-09-10
申请号：US11954734
申请日：2007-12-12
申请人： Ken Hsu , Chih-Hung Cheng , Kuo-Len Lin
发明人： Ken Hsu , Chih-Hung Cheng , Kuo-Len Lin
IPC分类号： H01L23/467
CPC分类号： H01L23/427 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A wind guider of integrated circuit heat dissipation structure includes a first connecting portion, wide-guiding pipes, a second connecting portion and wind-guiding holes. The first connecting portion is connected to heat-dissipating fins. The wide-guiding pipes are integrally connected to the first connecting portion. The second connecting portion is integrally connected to the wide-guiding pipes. A heat-dissipating fan is mounted in the second connecting portion. The second connecting portion is not in parallel to the first connecting portion. The wide-guiding holes run through the first connecting portion, the wide-guiding pipes and the second connecting portion. Since the second connecting portion is not in parallel to the first connecting portion, a cooling airflow generated by the heat-dissipating fan in the second connecting portion can blow to a region corresponding to the heat-dissipating fins. Thus, the cooling airflow blows to the hottest portion of the heat-dissipating fins directly, thereby improving the cooling efficiency and lowering the temperature of the integrated circuit.
摘要翻译：集成电路散热结构的导风装置包括第一连接部分，宽引导管，第二连接部分和导风孔。第一连接部分连接到散热片。宽引导管与第一连接部一体连接。第二连接部分一体地连接到宽导向管。散热风扇安装在第二连接部分中。第二连接部不与第一连接部平行。宽引导孔贯穿第一连接部分，宽引导管和第二连接部分。由于第二连接部不与第一连接部平行，所以由第二连接部中的散热风扇产生的冷却气流可以吹向与散热翅片对应的区域。因此，冷却气流直接吹向散热片的最热的部分，从而提高冷却效率，降低集成电路的温度。

77. 发明授权

US08459335B2 Heat sink having heat-dissipating fins of large area and method for manufacturing the same 失效
标题翻译：具有大面积散热翅片的散热片及其制造方法
公开(公告)号：US08459335B2
公开(公告)日：2013-06-11
申请号：US12511202
申请日：2009-07-29
申请人： Kuo-Len Lin , Chen-Hsiang Lin , Ken Hsu , Chih-Hung Cheng
发明人： Kuo-Len Lin , Chen-Hsiang Lin , Ken Hsu , Chih-Hung Cheng
IPC分类号： F28F7/00
CPC分类号： F28D15/0275 , B21D53/085 , F28F1/32 , H01L23/3672 , H01L23/427 , H01L23/467 , H01L2924/0002 , Y10T29/49353 , H01L2924/00
摘要： A heat-dissipating fin of a large area is made of a metallic sheet and has a fin body. An outer edge of one side of the fin body extends to form a sheet-like expanding portion. The expanding portion is bent and overlapped on the fin body to obtain the heat-dissipating fin. A heat sink includes a plurality of heat-dissipating fins and a heat-conducting element, which is formed by means of penetrating the respective heat-dissipating fins with a condensing section of the heat-conducting element.
摘要翻译：大面积的散热翅片由金属板制成并具有翅片体。翅片体的一侧的外缘延伸形成片状扩张部。膨胀部弯曲并重叠在翅片体上以获得散热翅片。散热器包括多个散热翅片和导热元件，其通过用导热元件的冷凝部穿透相应的散热翅片而形成。

78. 发明授权

US08375584B2 Method for manufacturing large-area heat sink having heat-dissipating fins 失效
标题翻译：制造具有散热片的大面积散热片的方法
公开(公告)号：US08375584B2
公开(公告)日：2013-02-19
申请号：US12511184
申请日：2009-07-29
申请人： Kuo-Len Lin , Chen-Hsiang Lin , Ken Hsu , Chih-Hung Cheng
发明人： Kuo-Len Lin , Chen-Hsiang Lin , Ken Hsu , Chih-Hung Cheng
IPC分类号： B21D53/06
CPC分类号： F28D15/02 , B23P15/26 , B23P2700/10 , F28D15/0266 , F28D15/0275 , F28F1/32 , H01L23/3672 , H01L23/427 , H01L23/467 , H01L2924/0002 , Y10T29/49368 , Y10T29/49377 , Y10T29/49378 , Y10T29/4938 , H01L2924/00
摘要： The present invention relates to a heat sink of a large area, in which a heat-dissipating body is further provided in its limited space. The method for manufacturing a fin includes the steps of providing a fin, cutting the fin to form a foldable piece thereon, folding back the foldable piece to be overlapped on the fin and form an accommodating hole, and punching the folded piece and the fin to form two overlapped through-holes. The fin, the heat-dissipating body and heat pipes are assembled together to obtain the heat sink. Since the fins and the heat-dissipating body dissipate the heat of the heat-generating element simultaneously, the heat-dissipating efficiency of the heat sink can be improved.
摘要翻译：本发明涉及一种大面积散热器，其中散热体还在其有限的空间内设置。制造翅片的方法包括以下步骤：提供翅片，切割翅片以在其上形成可折叠件，将可折叠件折叠在翅片上并形成容纳孔，并将折叠件和翅片冲压成形成两个重叠的通孔。翅片，散热体和热管组装在一起以获得散热器。由于翅片和散热体同时散发发热元件的热量，所以可以提高散热器的散热效率。

79. 发明授权

US08359745B2 Method for manufacturing a heat sink 失效
标题翻译：制造散热片的方法
公开(公告)号：US08359745B2
公开(公告)日：2013-01-29
申请号：US12511195
申请日：2009-07-29
申请人： Kuo-Len Lin , Chen-Hsiang Lin , Ken Hsu , Chih-Hung Cheng
发明人： Kuo-Len Lin , Chen-Hsiang Lin , Ken Hsu , Chih-Hung Cheng
IPC分类号： B23P15/26
CPC分类号： F28D15/02 , B21D53/085 , F28D15/0266 , F28D15/0275 , F28F1/126 , F28F1/32 , F28F3/02 , F28F7/00 , F28F2215/04 , H01L23/3672 , H01L23/427 , H01L23/467 , H01L2924/0002 , Y10T29/4935 , Y10T29/49353 , Y10T29/49359 , Y10T29/49364 , Y10T29/49373 , Y10T29/49377 , Y10T29/49378 , H01L2924/00
摘要： A method for manufacturing a heat sink includes providing a heat-conducting base with a plurality of open troughs; providing a plurality of heat pipes, each having a heat-absorbing section and a heat-releasing section extending from the heat-absorbing section; the heat-absorbing section being accommodated in one open trough to have the heat pipe engaged with the heat-conducting base; providing a plurality of heat-dissipating fins, each of the heat-dissipating fins having a lower plate and an upper plate extending from the lower plate, the upper plate being folded to form an overlapping portion attached on the lower plate; forming a through-hole in the lower plate and the upper plate at the overlapping portion; and penetrating the through-holes of the heat-dissipating fins by the heat-releasing section of the heat pipe. In this way, the heat-dissipating area in the same height can be increased, thereby improving the heat-dissipating efficiency of the heat sink.
摘要翻译：制造散热器的方法包括：提供具有多个开放槽的导热底座; 提供多个热管，每个热管具有吸热部分和从吸热部分延伸的散热部分; 所述吸热部容纳在一个开口槽中，使所述热管与所述导热性基体接合; 提供多个散热翅片，每个散热翅片具有下板和从下板延伸的上板，上板被折叠以形成安装在下板上的重叠部分; 在重叠部分形成下板和上板中的通孔; 并且通过热管的散热部分穿透散热片的通孔。以这种方式，可以提高相同高度的散热区域，从而提高散热器的散热效率。

80. 发明授权

US08344600B2 Heat dissipating structure of LED circuit board and LED lamp tube comprised thereof 有权
标题翻译： LED电路板的散热结构及其组成的LED灯管
公开(公告)号：US08344600B2
公开(公告)日：2013-01-01
申请号：US12211965
申请日：2008-09-17
申请人： Kuo-Len Lin , Chen-Hsiang Lin , Hwai-Ming Wang , Ken Hsu , Chih-Hung Cheng
发明人： Kuo-Len Lin , Chen-Hsiang Lin , Hwai-Ming Wang , Ken Hsu , Chih-Hung Cheng
IPC分类号： H01J1/02
CPC分类号： F21S4/003 , B82Y30/00 , B82Y99/00 , F21K9/27 , F21S8/031 , F21V3/02 , F21V5/04 , F21V29/506 , F21V29/83 , F21V29/85 , F21Y2105/10 , F21Y2115/10 , H05K1/0209 , H05K3/285 , H05K3/3447 , H05K2201/0209 , H05K2201/0257 , H05K2201/10106 , H05K2201/10977
摘要： A heat dissipating structure of an LED circuit board includes an LED circuit board having a plurality of soldering points. The soldering points of the LED circuit board are covered by a coating layer including Nanoparticles and a bonding agent. The LED circuit board is covered by the coating layer in an LED lamp tube to accelerate dissipating the heat of the LED circuit board. The coating layer has the characteristics of high emitting rate, temperature resistance, and conductivity insulation. On the other hand, the coating layer can increase the contacting areas of the soldering points with the air to enlarge the heat dissipation area of the LED circuit board to, thereby accelerating dissipating the heat.
摘要翻译： LED电路板的散热结构包括具有多个焊接点的LED电路板。 LED电路板的焊接点由包括纳米颗粒和粘合剂的涂层覆盖。 LED电路板被LED灯管中的涂层覆盖，以加速LED电路板的散热。涂层具有发光率高，耐温性和导电性绝缘性高的特点。另一方面，涂层可以增加焊接点与空气的接触面积，以扩大LED电路板的散热面积，从而加速散热。

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