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71. 发明授权

US07834365B2 LED chip package structure with high-efficiency light-emitting effect and method of packing the same 有权
标题翻译： LED芯片封装结构具有高效发光效果和封装方式相同
公开(公告)号：US07834365B2
公开(公告)日：2010-11-16
申请号：US11898378
申请日：2007-09-12
申请人： Bily Wang , Jonnie Chuang , Wen-Kuei Wu
发明人： Bily Wang , Jonnie Chuang , Wen-Kuei Wu
IPC分类号： H01L29/18
CPC分类号： G02F1/133603 , H01L2224/48091 , H01L2924/181 , H01L2924/1815 , H01L2924/00014 , H01L2924/00012
摘要： An LED chip package structure with high-efficiency light-emitting effect includes a substrate unit, a light-emitting unit, and a package colloid unit. The substrate unit has a substrate body, and a positive electrode trace and a negative electrode trace respectively formed on the substrate body. The light-emitting unit has a plurality of LED chips arranged on the substrate body. Each LED chip has a positive electrode side and a negative electrode side respectively and electrically connected with the positive electrode trace and the negative electrode trace of the substrate unit. The package colloid unit has a plurality of package colloids respectively covered on the LED chips. Each package colloid has a colloid cambered surface and a colloid light-emitting surface respectively formed on a top surface and a front surface thereof.
摘要翻译：具有高效率发光效果的LED芯片封装结构包括基板单元，发光单元和封装胶体单元。基板单元具有分别形成在基板主体上的基板主体和正极迹线和负极迹线。发光单元具有布置在基板主体上的多个LED芯片。各LED芯片分别具有正极侧和负极侧，与基板单元的正极迹线和负极迹线电连接。封装胶体单元具有分别覆盖在LED芯片上的多个封装胶体。每个包装胶体具有分别形成在其顶表面和前表面上的胶体弧形表面和胶体发光表面。

72. 发明申请

US20100271844A1 LIGHT-GUIDING STRUCTURE WITH PHOSPHOR MATERIAL LAYERS 审中-公开
标题翻译：具有磷光体材料层的光引导结构
公开(公告)号：US20100271844A1
公开(公告)日：2010-10-28
申请号：US12429469
申请日：2009-04-24
申请人： Bily Wang , Jonnie Chuang
发明人： Bily Wang , Jonnie Chuang
IPC分类号： F21V7/22
CPC分类号： G02B6/0023
摘要： A light-guiding structure with phosphor material layers includes a light-guiding unit, a light-emitting unit and a phosphor unit. The light-emitting unit is disposed beside an outer lateral side of the light-guiding unit. The phosphor unit is connected with the light-guiding unit and is disposed between the light-guiding unit and the light-emitting unit. In addition, the phosphor unit is formed or pasted on the lateral side of the light-guiding unit, and the light-emitting unit has a PCB substrate and a plurality of light-emitting elements electrically disposed on the PCB substrate and facing the light-guiding unit. Hence, light beams generated by the light-emitting elements of the light-emitting unit pass through the phosphor unit to form another light beams, and the light beams are guided into the light-guiding unit. Finally, the light beams are projected out from a light-exiting face of the light-guiding unit.
摘要翻译：具有荧光体材料层的导光结构包括导光单元，发光单元和荧光体单元。发光单元设置在导光单元的外侧的旁边。荧光体单元与导光单元连接并设置在导光单元和发光单元之间。此外，荧光体单元形成或粘贴在导光单元的侧面上，并且发光单元具有PCB基板和多个发光元件，电气设置在PCB基板上并面对发光元件，指导单位因此，由发光单元的发光元件产生的光束通过荧光体单元以形成另一个光束，并且光束被引导到导光单元中。最后，光束从导光单元的光出射面突出。

73. 发明授权

US07804162B2 Multi-wavelength white light-emitting structure 有权
标题翻译：多波长白光发光结构
公开(公告)号：US07804162B2
公开(公告)日：2010-09-28
申请号：US12379258
申请日：2009-02-18
申请人： Bily Wang , Jonnie Chuang , Chuan-Fa Lin
发明人： Bily Wang , Jonnie Chuang , Chuan-Fa Lin
IPC分类号： H01L23/02 , H01J1/62 , H01J63/04 , F21V9/00
CPC分类号： C09K11/7787 , C09K11/7789 , C09K11/7794 , F21K9/00 , H01L33/505 , H01L33/507 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , Y02B20/181 , H01L2924/00014
摘要： A multi-wavelength white light-emitting structure uses a UV light emitting diode chip and a blue light emitting diode chip to excite a red phosphor and a green phosphor and generates a white light-emitting structure having good color rendering. The multi-wavelength white light-emitting structure uses a UV light emitting diode chip that emits light having a wavelength of between 350˜430 nm to excite a red phosphor to emit red light having a wavelength of between 600˜700 nm. The present invention then uses a blue light emitting diode chip that emits light having a wavelength between of 400˜500 nm to emit blue light and uses the blue light emitting diode chip to excite a green phosphor to emit green light having a wavelength of between 490˜560 nm. Mixing the red light, the blue light and the green light forms a white light.
摘要翻译：多波长白色发光结构使用UV发光二极管芯片和蓝色发光二极管芯片来激发红色荧光体和绿色荧光体，并产生具有良好显色性能的白色发光结构。多波长白色发光结构使用发射波长在350〜430nm之间的光的UV发光二极管芯片，以激发红色荧光体发射波长在600〜700nm之间的红色光。然后，本发明使用发射波长在400〜500nm之间的光的蓝色发光二极管芯片发射蓝色光，并使用蓝色发光二极管芯片来激发绿色荧光体以发射波长为490nm的绿色光〜560nm。混合红光，蓝光和绿光形成白光。

74. 发明申请

US20090246897A1 LED chip package structure and method for manufacturing the same 审中-公开
标题翻译： LED芯片封装结构及其制造方法
公开(公告)号：US20090246897A1
公开(公告)日：2009-10-01
申请号：US12385716
申请日：2009-04-17
申请人： Bily Wang , Jonnie Chuang , Wen-Kuei Wu
发明人： Bily Wang , Jonnie Chuang , Wen-Kuei Wu
IPC分类号： H01L21/50
CPC分类号： G02B6/0073 , F21K9/00 , F21Y2103/10 , F21Y2115/10 , H01L25/0753 , H01L2924/0002 , H01L2924/00
摘要： An LED chip package structure includes a substrate unit, a light-emitting unit, and a colloid unit. The substrate unit has a substrate body, and a positive electrode trace and a negative electrode trace is respectively formed on the substrate body. The light-emitting unit has a plurality of LED chips arranged on the substrate body for generating light, wherein each of the LED chips has a positive side and a negative side respectively electrically connected with the positive electrode trace and the negative electrode trace. The colloid unit is covered over the substrate unit and the light-emitting unit for guiding the light from the light-emitting unit to form a series of light-generating areas on the colloid unit.
摘要翻译： LED芯片封装结构包括基板单元，发光单元和胶体单元。基板单元具有基板主体，并且在基板主体上分别形成正极迹线和负极迹线。发光单元具有布置在基板主体上用于产生光的多个LED芯片，其中每个LED芯片具有分别与正极迹线和负极迹线电连接的正侧和负极。胶体单元被覆盖在基板单元和用于引导来自发光单元的光的发光单元上，以在胶体单元上形成一系列发光区域。

75. 发明申请

US20090239319A1 Package for a light emitting diode and a process for fabricating the same 审中-公开
标题翻译：用于发光二极管的封装及其制造方法
公开(公告)号：US20090239319A1
公开(公告)日：2009-09-24
申请号：US12385728
申请日：2009-04-17
申请人： Bily Wang , Jonnie Chuang , Hui-Yen Huang
发明人： Bily Wang , Jonnie Chuang , Hui-Yen Huang
IPC分类号： H01L21/56
CPC分类号： H01L33/486 , H01L33/56 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： A package for an LED, comprises a metal substrate, at least one LED chip, and an insulative housing, wherein the metal substrate has a first terminal and a second terminal, and the first terminal is formed with a recess. The at least one LED chip is arranged in the recess of the first terminal of the metal substrate, wherein the chip is electrically connected with the first terminal and the second terminal of the metal substrate. Since the insulative housing caps the chip and the metal substrate, and the LED package can be reduced in size.
摘要翻译：一种用于LED的封装，包括金属基板，至少一个LED芯片和绝缘壳体，其中所述金属基板具有第一端子和第二端子，并且所述第一端子形成有凹部。所述至少一个LED芯片布置在所述金属基板的所述第一端子的所述凹部中，其中所述芯片与所述金属基板的所述第一端子和所述第二端子电连接。由于绝缘壳体覆盖芯片和金属基板，并且LED封装的尺寸可以减小。

76. 发明申请

US20090186434A1 Led chip package structre with a plurality of thick guiding and a method for manufactruing the same 有权
标题翻译：具有多个厚引导的LED芯片封装结构及其制造方法
公开(公告)号：US20090186434A1
公开(公告)日：2009-07-23
申请号：US12382760
申请日：2009-03-24
申请人： Bily Wang , Jonnie Chuang , Hui-Yen Huang
发明人： Bily Wang , Jonnie Chuang , Hui-Yen Huang
IPC分类号： H01L21/50
CPC分类号： H01L25/0753 , H01L24/97 , H01L33/483 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2224/97 , H01L2924/01082 , H01L2924/12041 , H01L2224/85 , H01L2924/00014
摘要： An LED chip package structure with thick guiding pin includes a plurality of conductive pins separated from each other, an insulative casing, a plurality of LED chips, and a packaging colloid. The insulative casing covers a bottom side of each conductive pin to form an injection concave groove for exposing a top surface of each conductive pin. Two lateral sides of each conductive pin are extended outward from the insulative casing. The LED chips are arranged in the injection concave groove, and each LED chip has a positive electrode side and a negative electrode side respectively and electrically connected with different conductive pins. In addition, the packaging colloid is filled into the injection concave groove for covering the LED chips.
摘要翻译：具有厚引导针的LED芯片封装结构包括彼此分离的多个导电引脚，绝缘壳体，多个LED芯片和封装胶体。绝缘壳体覆盖每个导电销的底侧，以形成用于暴露每个导电销的顶表面的注入凹槽。每个导电针的两个侧面从绝缘壳体向外延伸。 LED芯片布置在注入凹槽中，并且每个LED芯片分别具有正极侧和负极侧，并与不同的导电针电连接。此外，将包装胶体填充到用于覆盖LED芯片的注入凹槽中。

77. 发明授权

US07563641B2 Laminated light-emitting diode display device and manufacturing method thereof 有权
标题翻译：层压发光二极管显示装置及其制造方法
公开(公告)号：US07563641B2
公开(公告)日：2009-07-21
申请号：US11605425
申请日：2006-11-29
申请人： Bily Wang , Jonnie Chuang , Chuanfa Lin , Chao-Yuan Huang
发明人： Bily Wang , Jonnie Chuang , Chuanfa Lin , Chao-Yuan Huang
IPC分类号： H01L21/00
CPC分类号： G09F9/302 , G09F9/33 , H05K1/0306 , H05K1/0393 , H05K1/181 , H05K2201/0108 , H05K2201/10106 , Y02P70/611
摘要： A laminated light-emitting diode display device and a manufacturing method thereof are described. The laminated light-emitting diode display device has an insulator, a circuitry device placed on the insulator and having of a plurality of circuits interconnected with each other, and a plurality of SMT-type light-emitting diodes electrically connected to the circuits of the circuitry unit.
摘要翻译：对层叠型发光二极管显示装置及其制造方法进行说明。层叠发光二极管显示装置具有绝缘体，放置在绝缘体上并具有彼此互连的多个电路的电路装置，以及电连接到电路的电路的多个SMT型发光二极管单元。

78. 发明授权

US07515061B2 LED package structure for increasing light-emitting efficiency and method of packaging the same 有权
标题翻译： LED封装结构，提高发光效率和封装方法
公开(公告)号：US07515061B2
公开(公告)日：2009-04-07
申请号：US11588399
申请日：2006-10-27
申请人： Bily Wang , Jonnie Chuang , Chi-Wen Hung
发明人： Bily Wang , Jonnie Chuang , Chi-Wen Hung
IPC分类号： G08B5/22
CPC分类号： H01L33/56 , H01L25/167 , H01L33/505 , H01L33/54 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/16245 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： An LED package structure for increasing light-emitting efficiency includes: a substrate unit, and a plurality of fluorescence colloid units, LED units, conductive units and opaque units. The substrate unit has a main body and a plurality of through holes passing through the main body. Each fluorescence colloid unit is received in the corresponding through hole and having an installed surface. Each LED unit has a light-emitting surface disposed on the corresponding fluorescence colloid unit and facing the installed surface of the corresponding fluorescence colloid units. Each conductive unit is electrically connected between each two electrode areas that have the same pole and are respectively arranged on each LED unit and the main body. Each opaque unit is disposed on two corresponding lateral faces of the main body for covering the installed surface of the corresponding fluorescence colloid unit, the corresponding LED unit, and the corresponding conductive units.
摘要翻译：用于提高发光效率的LED封装结构包括：基板单元和多个荧光胶体单元，LED单元，导电单元和不透明单元。基板单元具有主体和穿过主体的多个通孔。每个荧光胶体单元被接收在相应的通孔中并具有安装表面。每个LED单元具有设置在相应的荧光胶体单元上并面对相应荧光胶体单元的安装表面的发光表面。每个导电单元电连接在具有相同极点并且分别布置在每个LED单元和主体上的每个两个电极区域之间。每个不透明单元设置在主体的两个对应的侧面上，用于覆盖相应的荧光胶体单元的安装表面，相应的LED单元和相应的导电单元。

79. 发明申请

US20080179604A1 LED CHIP PACKAGE STRUCTURE WITH A PLURALITY OF THICK GUIDING PINS AND A METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：具有多个导向针的多个LED芯片包装结构及其制造方法
公开(公告)号：US20080179604A1
公开(公告)日：2008-07-31
申请号：US11861757
申请日：2007-09-26
申请人： Bily Wang , Jonnie Chuang , Hui-Yen Huang
发明人： Bily Wang , Jonnie Chuang , Hui-Yen Huang
IPC分类号： H01L33/00
CPC分类号： H01L25/0753 , H01L24/97 , H01L33/483 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2224/97 , H01L2924/01082 , H01L2924/12041 , H01L2224/85 , H01L2924/00014
摘要： An LED chip package structure with thick guiding pin includes a plurality of conductive pins separated from each other, an insulative casing, a plurality of LED chips, and a packaging colloid. The insulative casing covers a bottom side of each conductive pin to form an injection concave groove for exposing a top surface of each conductive pin. Two lateral sides of each conductive pin are extended outward from the insulative casing. The LED chips are arranged in the injection concave groove, and each LED chip has a positive electrode side and a negative electrode side respectively and electrically connected with different conductive pins. In addition, the packaging colloid is filled into the injection concave groove for covering the LED chips.
摘要翻译：具有厚引导针的LED芯片封装结构包括彼此分离的多个导电引脚，绝缘壳体，多个LED芯片和封装胶体。绝缘壳体覆盖每个导电销的底侧，以形成用于暴露每个导电销的顶表面的注入凹槽。每个导电针的两个侧面从绝缘壳体向外延伸。 LED芯片布置在注入凹槽中，并且每个LED芯片分别具有正极侧和负极侧，并且与不同的导电针电连接。此外，将包装胶体填充到用于覆盖LED芯片的注入凹槽中。

80. 发明申请

US20080173881A1 LED chip package structure using a ceramic material as a substrate and a method for manufacturing the same 有权
标题翻译：使用陶瓷材料作为基板的LED芯片封装结构及其制造方法
公开(公告)号：US20080173881A1
公开(公告)日：2008-07-24
申请号：US11976478
申请日：2007-10-25
申请人： Bily Wang , Jonnie Chuang , Chia-Hung Chen
发明人： Bily Wang , Jonnie Chuang , Chia-Hung Chen
IPC分类号： H01L29/78
CPC分类号： H01L25/0753 , H01L33/486 , H01L2224/48091 , H01L2224/48247 , H01L2924/09701 , H01L2924/00014
摘要： An LED chip package structure using a ceramic material as a substrate includes a ceramic substrate, a conductive unit, a hollow ceramic casing, a plurality of LED chips, and a package colloid. The ceramic substrate has a main body, and a plurality of protrusions extended from three faces of the main body. The conductive unit has a plurality of conductive layers formed on the protrusions, respectively. The hollow casing is fixed on a top face of the main body to form a receiving space for exposing a top face of each conductive layer. The LED chips are received in the receiving space, and each LED chip has a positive electrode side and a negative electrode side respectively and electrically connected to different conductive layers. In addition, the packaging colloid is filled into the receiving space for covering the LED chips.
摘要翻译：使用陶瓷材料作为基板的LED芯片封装结构包括陶瓷基板，导电单元，中空陶瓷外壳，多个LED芯片和封装胶体。陶瓷基板具有主体和从主体的三个面延伸的多个突起。导电单元具有分别形成在突起上的多个导电层。中空壳体固定在主体的顶面上，以形成用于暴露每个导电层顶面的容纳空间。 LED芯片被接收在接收空间中，并且每个LED芯片分别具有正极侧和负极侧，并且电连接到不同的导电层。此外，将包装胶体填充到用于覆盖LED芯片的接收空间中。

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