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71. 发明申请

US20060215387A1 Backlight module 有权
标题翻译：背光模组
公开(公告)号：US20060215387A1
公开(公告)日：2006-09-28
申请号：US11088791
申请日：2005-03-25
申请人： Bily Wang , Jonnie Chuang , Chuanfa Lin
发明人： Bily Wang , Jonnie Chuang , Chuanfa Lin
IPC分类号： G01D11/28
CPC分类号： G02B6/0018 , G02B6/005 , G02B6/0083 , G02F1/133615
摘要： A backlight module arranged under a flat display includes a printed circuit board being parallel to the flat display and including a plurality of LEDs, a reflection portion being a reflection wall bent from a fringe of the LEDs to extend over the LEDs, and a guide light plate being parallel to the printed circuit board. The reflection portion includes an orientation wall parallel to the reflection wall and an outlet with a direction parallel to the printed circuit board. The guide light plate has an end connecting inside the outlet of the reflection portion, a light delivering surface adjacent to the flat display, and a reflection surface arranged at a bottom thereof.
摘要翻译：布置在平坦显示器下方的背光模块包括平行于平面显示器并包括多个LED的印刷电路板，反射部分是从LED的边缘弯曲以在LED上延伸的反射壁，以及引导光板平行于印刷电路板。反射部分包括平行于反射壁的定向壁和具有平行于印刷电路板的方向的出口。引导光板具有连接在反射部分的出口内部的端部，与平面显示器相邻的光输送表面和布置在其底部的反射表面。

72. 发明申请

US20060099728A1 Method of manufacturing a substrate structure for increasing cutting precision and strength thereof 失效
标题翻译：制造提高切割精度和强度的基板结构的方法
公开(公告)号：US20060099728A1
公开(公告)日：2006-05-11
申请号：US11304558
申请日：2005-12-16
申请人： Bily Wang , Jonnie Chuang , Hui-Yen Huang
发明人： Bily Wang , Jonnie Chuang , Hui-Yen Huang
IPC分类号： H01L21/00
CPC分类号： H05K3/0052 , H05K1/056 , H05K3/445 , H05K2201/09881 , H05K2203/0228 , H05K2203/0278 , H05K2203/1536
摘要： A method of manufacturing a substrate structure includes the steps of: (1) providing a metal substrate having a metal portion; (2) chemically etching a plurality of trenches in the metal substrate; (3) applying a polymer composite material into the trenches to form a substrate having a polymer composite portion abutted to the metal portion; (4) polishing a surface of the substrate to make a height of the polymer composite portion equal to that of the metal portion; (5) forming a covering material on the surface of the substrate; and (6) cutting the substrate via the polymer composite portion for decreasing cutting bur produced on the metal portion. Furthermore, the method is provided for combining the metal substrate and the polymer composite material, thereby to increase cutting precision and strength of the substrate structure.
摘要翻译：一种制造衬底结构的方法包括以下步骤：（1）提供具有金属部分的金属衬底; （2）化学蚀刻金属基板中的多个沟槽; （3）将聚合物复合材料施加到沟槽中以形成具有与金属部分邻接的聚合物复合部分的基底; （4）研磨基板的表面，使聚合物复合部的高度与金属部的高度相等; （5）在基板的表面上形成覆盖材料; 和（6）通过聚合物复合部分切割基底以减少在金属部分上产生的切割毛刺。此外，提供了用于组合金属基板和聚合物复合材料的方法，从而提高基板结构的切割精度和强度。

73. 发明申请

US20060035406A1 METHOD OF FORMING A COMPOSITE POLYMER MATERIAL INSIDE TRENCHES OF A SEMICONDUCTOR SUBSTRATE TO FORM A COMPOSITE POLYMER STRUCTURE 审中-公开
标题翻译：在半导体基板的内部形成复合聚合物材料以形成复合聚合物结构的方法
公开(公告)号：US20060035406A1
公开(公告)日：2006-02-16
申请号：US10918371
申请日：2004-08-16
申请人： Bily Wang , Jonnie Chuang , Hui-Yen Huang
发明人： Bily Wang , Jonnie Chuang , Hui-Yen Huang
IPC分类号： H01L21/50 , H01L23/48
CPC分类号： H05K3/445 , H05K1/056 , H05K3/0052 , H05K2201/09881 , H05K2203/0228 , H05K2203/0278 , H05K2203/1536
摘要： A semiconductor substrate structure includes a substrate having a trench formed thereon, a polymer composite material supplied into the trench and an electroplate conductive layer formed on the substrate. Further, a semiconductor substrate processing method includes the steps of: providing a substrate forming a trench thereon, supplying a polymer composite material into the trench, polishing a surface of the substrate and forming a covering material on the surface of the substrate. Therefore, the method is provided for combining the polymer composite material into the substrate, thereby to raise cutting precision and strength of the semiconductor substrate structure.
摘要翻译：半导体衬底结构包括其上形成有沟槽的衬底，提供到沟槽中的聚合物复合材料和形成在衬底上的电镀导电层。此外，半导体衬底处理方法包括以下步骤：提供在其上形成沟槽的衬底，将聚合物复合材料供应到沟槽中，抛光衬底的表面并在衬底的表面上形成覆盖材料。因此，提供了将聚合物复合材料组合到基板中的方法，从而提高半导体基板结构的切割精度和强度。

74. 发明申请

US20050264173A1 White light emitting diode light source and method for manufacturing the same 审中-公开
标题翻译：白光发光二极管光源及其制造方法
公开(公告)号：US20050264173A1
公开(公告)日：2005-12-01
申请号：US10855419
申请日：2004-05-28
申请人： Bily Wang , Jonnie Chuang , Chuanfa Lin
发明人： Bily Wang , Jonnie Chuang , Chuanfa Lin
IPC分类号： C09K11/77 , H01L33/50 , H05B33/00 , H05B33/14
CPC分类号： C09K11/7731 , C09K11/7721 , C09K11/7734 , H01L25/0753 , H01L33/502 , H01L2924/0002 , H05B33/14 , Y02B20/181 , H01L2924/00
摘要： A while light emitting diode light source and method for manufacturing the same are proposed. The while light emitting diode light source has a printed circuit board, and a plurality of LED units on one face of the PCB, each of the LED units comprising a substrate, a blue LED on the substrate and a red-green-yellow phosphor mixture enclosing the blue LED. The red-green-yellow phosphor mixture is a mixture of a red phosphor, a green phosphor and a yellow phosphor. The red phosphor is CaS:Eu or SrS:Eu. The green phosphor is SrGa2S4:Eu or Ca8EuMnMg(SiO4)4C12. The yellow phosphor is YAG:Ce or ThAG:Ce. The light emitted from the phosphors are mixed with blue light into white light with a satisfactory color rendering property.
摘要翻译：提出一种发光二极管光源及其制造方法。同时发光二极管光源具有印刷电路板和PCB的一个面上的多个LED单元，每个LED单元包括基板，基板上的蓝色LED和红 - 绿 - 黄色荧光体混合物封闭蓝色LED。红绿色荧光体混合物是红色荧光体，绿色荧光体和黄色荧光体的混合物。红色荧光体为CaS：Eu或SrS：Eu。绿色荧光体是SrGa 2 S 4：Eu或Ca 8 O 5 MnMg（SiO 4）4 12 。黄色荧光体是YAG：Ce或ThAG：Ce。从荧光体发射的光与蓝色光混合，成为具有令人满意的显色性的白光。

75. 外观设计

USD507246S1 Light emitting diode package 失效
公开(公告)号：USD507246S1
公开(公告)日：2005-07-12
申请号：US29179370
申请日：2003-04-10
申请人： Bily Wang , Jonnie Chuang
设计人： Bily Wang , Jonnie Chuang

76. 发明授权

US5962922A Cavity grid array integrated circuit package 失效
标题翻译：腔栅阵列集成电路封装
公开(公告)号：US5962922A
公开(公告)日：1999-10-05
申请号：US40472
申请日：1998-03-18
申请人： Bily Wang
发明人： Bily Wang
IPC分类号： H01L23/13 , H01L23/498 , H05K1/11 , H05K3/34 , H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L23/13 , H01L23/49816 , H01L23/49827 , H05K3/3436 , H01L2224/48227 , H01L2224/48235 , H01L24/48 , H01L2924/00014 , H01L2924/14 , H01L2924/15311 , H05K1/116 , H05K2201/09463 , H05K2201/09472 , H05K2201/0949 , H05K2201/09509 , H05K2201/09845 , H05K2201/10666 , H05K2203/1178 , Y02P70/613
摘要： A flat package for integrated circuit chip has a substrate with plated through holes. The top flange of a plated through hole is interconnected to a terminal of the IC chip. The bottom flange of the through hole has a cavity recessed into the substrates. A solder is placed between a circuit contact on a mother board and the bottom flange. Upon heating, the solder rises to fill the cavity, to make connection between the terminal on the IC chip and the contact on the mother board.
摘要翻译：用于集成电路芯片的扁平封装具有带有电镀通孔的基板。电镀通孔的顶部凸缘与IC芯片的端子互连。通孔的底部凸缘具有凹入基板的腔体。焊料放置在母板上的电路触点和底部法兰之间。在加热时，焊料上升以填充空腔，以使IC芯片上的端子和母板上的触点之间的连接。

77. 发明授权

US08623680B2 LED chip package structure using sedimentation and method for making the same 有权
标题翻译： LED芯片封装结构采用沉淀法和制造方法相同
公开(公告)号：US08623680B2
公开(公告)日：2014-01-07
申请号：US13232391
申请日：2011-09-14
申请人： Bily Wang , Shih-Yu Wu , Chao-Yuan Huang , Ping-Chou Yang , Cheng-Yen Chiang
发明人： Bily Wang , Shih-Yu Wu , Chao-Yuan Huang , Ping-Chou Yang , Cheng-Yen Chiang
IPC分类号： H01L21/00
CPC分类号： H01L33/52 , H01L33/508 , H01L2224/48091 , H01L2924/181 , H01L2933/0041 , H01L2924/00014 , H01L2924/00012
摘要： An LED chip package structure using sedimentation includes a package body, at least two conductive substrates, at least one light-emitting element, and a package unit. The package body has a receiving space. The two conductive substrates are received in the receiving space. The light-emitting element is received in the receiving space and electrically connected to the two conductive substrates. The package unit has a package colloid layer and a powder mixed into the package colloid layer, and the package unit is filled into the receiving space. The powder is uniformly deposited in the receiving space by maintaining the package unit at room temperature firstly and the powder is solidified in the receiving space by heating to a predetermined temperature.
摘要翻译：使用沉淀的LED芯片封装结构包括封装体，至少两个导电基板，至少一个发光元件和封装单元。包装体具有接收空间。两个导电基板被接收在接收空间中。发光元件被容纳在接收空间中并与两个导电基板电连接。包装单元具有包装胶体层和混合到包装胶体层中的粉末，并且包装单元填充到容纳空间中。首先将包装单元保持在室温下，将粉末均匀地沉积在接收空间中，并通过加热到预定温度使粉末在接收空间中固化。

78. 发明授权

US08556463B2 Simple detachable illumination structure and lamp tube 有权
标题翻译：简单的可拆卸照明结构和灯管
公开(公告)号：US08556463B2
公开(公告)日：2013-10-15
申请号：US13008164
申请日：2011-01-18
申请人： Bily Wang , Chi-Tseng Chang , Chi-Kang Lo , Zhen Hao Fan
发明人： Bily Wang , Chi-Tseng Chang , Chi-Kang Lo , Zhen Hao Fan
IPC分类号： F21S4/00
CPC分类号： F21V29/503 , F21K9/27 , F21V19/003 , F21V19/045 , F21V23/005 , F21V29/20 , F21V29/506 , F21Y2103/10 , F21Y2115/10
摘要： A simple detachable illumination lamp tube includes a tube unit, a heat-dissipating unit, a light-emitting unit, a support unit and a lateral cover unit. The tube unit has a light-permitting hollow tube. The heat-dissipating unit has a heat-dissipating substrate received in the light-permitting hollow tube. The heat-dissipating substrate has two opposite lateral sides contacting the inner surface of the light-permitting hollow tube. The light-emitting unit has a plurality of strip light-emitting modules received in the light-permitting hollow tube. The strip light-emitting modules are disposed on the heat-dissipating substrate and electrically connected in sequence. The support unit has a plurality of support elements received in the light-permitting hollow tube and disposed between a bottom side of the heat-dissipating substrate and the inner surface of the light-permitting hollow tube. The lateral cover unit has two lateral covers installed on two ends of the light-permitting hollow tube.
摘要翻译：简单的可拆卸照明灯管包括管单元，散热单元，发光单元，支撑单元和侧盖单元。管单元具有允许光的中空管。散热单元具有容纳在光允许中空管中的散热基板。散热基板具有与允许允许中空管的内表面接触的两个相对的侧面。发光单元具有容纳在光允许中空管中的多个条状发光模块。带状发光模块设置在散热基板上并依次电连接。支撑单元具有容纳在允许光的中空管中并且设置在散热基板的底侧和允许光的中空管的内表面之间的多个支撑元件。侧盖单元具有安装在允许中空管的两端的两个侧盖。

79. 发明授权

US08555492B2 Method for manufacturing a conductive substrate structure with conductive channels formed by using a two-sided cut approach 有权
标题翻译：制造具有通过使用双面切割方法形成的导电通道的导电基板结构的方法
公开(公告)号：US08555492B2
公开(公告)日：2013-10-15
申请号：US13338410
申请日：2011-12-28
申请人： Bily Wang , Sung-Yi Hsiao , Jack Chen
发明人： Bily Wang , Sung-Yi Hsiao , Jack Chen
IPC分类号： H05K3/04
CPC分类号： B26D3/06 , H05K3/0044 , H05K3/0052 , H05K3/107 , H05K3/403 , Y10T29/49155 , Y10T29/49156 , Y10T83/0524
摘要： A conductive substrate structure includes a substrate unit, a conductive pad unit, and a conductive layer unit. The substrate unit has a top surface, a bottom surface, two opposite lateral surfaces, and a front surface. The conductive pad unit has at least two first conductive pads separated from each other and disposed on the top surface, and at least two second conductive pads separated from each other and disposed on the bottom surface. The conductive layer unit has at least two first conductive layers formed on the front surface and respectively electrically connected to two front sides of the two first conductive pads, and at least two second conductive layers respectively formed on the two opposite lateral surfaces and respectively electrically connected to two opposite lateral sides of the two second conductive pads. The two first conductive layers are respectively electrically connected with the two second conductive layers.
摘要翻译：导电基板结构包括基板单元，导电焊盘单元和导电层单元。基板单元具有顶表面，底表面，两个相对的侧表面和前表面。导电焊盘单元具有至少两个彼此分离并设置在顶表面上的第一导电焊盘，以及至少两个彼此分离并设置在底表面上的第二导电焊盘。导电层单元具有形成在前表面上并分别电连接到两个第一导电焊盘的两个前侧的至少两个第一导电层，以及分别形成在两个相对的侧表面上并分别电连接的至少两个第二导电层到两个第二导电焊盘的两个相对的侧面。两个第一导电层分别与两个第二导电层电连接。

80. 发明授权

US08198800B2 LED chip package structure in order to prevent the light-emitting efficiency of fluorescent powder from decreasing due to high temperature and method for making the same 有权
标题翻译： LED芯片封装结构，以防止荧光粉的发光效率由于高温而降低，并且制造它们的方法
公开(公告)号：US08198800B2
公开(公告)日：2012-06-12
申请号：US12232931
申请日：2008-09-26
申请人： Bily Wang , Shih-Yu Wu , Wen-Kuei Wu
发明人： Bily Wang , Shih-Yu Wu , Wen-Kuei Wu
IPC分类号： H01J1/62 , H01J63/04
CPC分类号： H01L33/507 , H01L25/0753 , H01L33/60 , H01L2224/48091 , H01L2924/181 , H01L2933/0041 , H01L2924/00014 , H01L2924/00012
摘要： An LED chip package structure in order to prevent the light-emitting efficiency of fluorescent powder from decreasing due to high temperature includes a substrate unit, a light-emitting unit, a transparent colloid body unit, a fluorescent colloid body unit and a frame unit. The light-emitting unit has a plurality of LED chips electrically arranged on the substrate unit. The transparent colloid body unit has a plurality of transparent colloid bodies respectively covering the LED chips. The fluorescent colloid body unit has a plurality of fluorescent colloid bodies respectively covering the transparent colloid bodies. The frame unit is covering the peripheries of each transparent colloid body and each fluorescent colloid body in order to expose the top surfaces of the fluorescent colloid body.
摘要翻译：为了防止荧光粉的发光效率由于高温而降低的LED芯片封装结构包括基板单元，发光单元，透明胶体主体单元，荧光胶体主体单元和框架单元。发光单元具有电子地布置在基板单元上的多个LED芯片。透明胶体体单元具有分别覆盖LED芯片的多个透明胶体。荧光胶体主体单元具有分别覆盖透明胶体的多个荧光胶体。框架单元覆盖每个透明胶体和每个荧光胶体的周边，以暴露荧光胶体的顶表面。

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