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71. 发明申请

US20080290497A1 Mounting Board, Mounted Body, and Electronic Equipment Using the Same 失效
标题翻译：安装板，安装体和使用其的电子设备
公开(公告)号：US20080290497A1
公开(公告)日：2008-11-27
申请号：US11630025
申请日：2006-07-13
申请人： Yasuhiro Sugaya , Toshiyuki Asahi , Katsumasa Miki , Yoshiyuki Yamamoto , Hiroyuki Ishitomi , Tsuyoshi Himori
发明人： Yasuhiro Sugaya , Toshiyuki Asahi , Katsumasa Miki , Yoshiyuki Yamamoto , Hiroyuki Ishitomi , Tsuyoshi Himori
IPC分类号： H01L23/12 , H05K7/02
CPC分类号： H05K1/162 , H01L23/49822 , H01L23/49838 , H01L23/50 , H01L23/66 , H01L24/48 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2924/00011 , H01L2924/00014 , H01L2924/01078 , H01L2924/12042 , H01L2924/181 , H01L2924/19041 , H01L2924/30107 , H05K3/385 , H05K3/4641 , H05K2201/0329 , H05K2201/0355 , H05K2203/0307 , H05K2203/0315 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2224/0401 , H01L2924/00012
摘要： The mounting board has a capacitor-forming sheet made from a valve metal, first and second board-forming structures, first and second electrodes, an extractor electrode, and a conductive polymer. The capacitor-forming sheet has an inner layer and a rough oxide film on at least one face of the inner layer. The first board-forming structure is provided on a face of the capacitor-forming sheet, and the second board-forming structure is provided on another face thereof on a side opposite to the first one. The first and second electrodes are isolated to each other and provided on a surface of at least one of the first and second board-forming structures. The extractor electrode and conductive polymer are provided inside at least one of the first and second board-forming structures. The extractor electrode electrically-connects the first electrode with the inner layer. The conductive polymer electrically-connects the second electrode with the rough oxide film.
摘要翻译：安装板具有由阀金属制成的电容器形成片，第一和第二板形成结构，第一和第二电极，提取器电极和导电聚合物。电容器形成片材在内层的至少一个面上具有内层和粗糙的氧化膜。第一板形成结构设置在电容器形成片的表面上，并且第二板形成结构在与第一板形成结构相对的一侧的另一个表面上设置。第一和第二电极彼此隔离并设置在第一和第二板形成结构中的至少一个的表面上。提取器电极和导电聚合物设置在第一和第二板形成结构中的至少一个中。提取器电极将第一电极与内层电连接。导电聚合物将第二电极与粗氧化物膜电连接。

72. 发明授权

US07395190B2 Analytical model producing method and analytical model producing apparatus 有权
标题翻译：分析模型制作方法和分析模型制作装置
公开(公告)号：US07395190B2
公开(公告)日：2008-07-01
申请号：US10073008
申请日：2002-02-12
申请人： Masayuki Hariya , Yoshimitsu Hiro , Yoshiyuki Yamamoto , Hiromitsu Tokisue
发明人： Masayuki Hariya , Yoshimitsu Hiro , Yoshiyuki Yamamoto , Hiromitsu Tokisue
IPC分类号： G06G7/64
CPC分类号： G06F17/5018
摘要： The present invention provides an analytical model preparing apparatus which reduces the user's labor of template selecting operation by selecting and presenting an appropriate template from among a plurality of already prepared templates. The analytical model preparing apparatus of the invention comprises means for entering a shape model to be analyzed; a database which associates at least one already prepared shape model with the analytical model prepared for such an already prepared shape model, and registers the same; means for collating the above-mentioned shape model to be analyzed with at least one already prepared shape model; analytical model preparing means for preparing at least one analytical model corresponding to the shape model to be analyzed, by use of analytical model preparing information prepared for the above-mentioned already prepared shape model, in accordance with the result of collation; and mesh quality evaluating means for calculating a mesh quality evaluation value for the analytical model corresponding to at least one prepared shape model to be analyzed.
摘要翻译：本发明提供了一种分析模型制备装置，其通过从多个已经准备好的模板中选择和呈现适当的模板来减少用户对模板选择操作的劳动。本发明的分析模型制备装置包括用于输入要分析的形状模型的装置; 将至少一个已经准备好的形状模型与为这种已经准备好的形状模型准备的分析模型相关联的数据库，并将其注册; 用于将上述具有至少一个已经准备好的形状模型进行分析的形状模型整理的装置; 分析模型制备装置，用于根据对照结果，通过使用为上述已经制备的形状模型制备的准备信息的分析模型来制备对应于待分析的形状模型的至少一个分析模型; 以及用于计算与要分析的至少一个准备形状模型相对应的分析模型的网格质量评估值的网格质量评估装置。

73. 发明授权

US07294587B2 Component built-in module and method for producing the same 有权
标题翻译：组件内置模块及其制造方法
公开(公告)号：US07294587B2
公开(公告)日：2007-11-13
申请号：US11126029
申请日：2005-05-10
申请人： Toshiyuki Asahi , Yasuhiro Sugaya , Shingo Komatsu , Yoshiyuki Yamamoto , Seiichi Nakatani
发明人： Toshiyuki Asahi , Yasuhiro Sugaya , Shingo Komatsu , Yoshiyuki Yamamoto , Seiichi Nakatani
IPC分类号： H01L21/31 , H01L21/469
CPC分类号： H01L25/50 , H01L21/6835 , H01L23/5389 , H01L23/552 , H01L24/24 , H01L24/81 , H01L24/82 , H01L24/83 , H01L25/0652 , H01L25/16 , H01L2221/68345 , H01L2224/16225 , H01L2224/2402 , H01L2224/24226 , H01L2224/2929 , H01L2224/293 , H01L2224/32225 , H01L2224/73204 , H01L2224/8121 , H01L2224/81815 , H01L2224/82047 , H01L2224/83801 , H01L2224/83851 , H01L2924/00011 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01012 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01046 , H01L2924/01047 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/12042 , H01L2924/15787 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2924/30105 , H01L2924/30107 , H01L2924/3025 , H05K1/186 , H05K3/20 , H05K3/4069 , H05K3/4602 , H05K3/4652 , H05K2201/10378 , H05K2201/10636 , H05K2203/061 , Y02P70/611 , H01L2924/00 , H01L2224/29075
摘要： A component built-in module includes an insulating layer, wirings integrated with both surfaces of the insulating layer, a via connecting the wirings, and one or more components selected from an electronic component and a semiconductor, which is embedded inside of the insulating layer. In this module, at least one of the wirings is formed on a surface of a wiring board, and the components embedded inside of the insulating layer are mounted on and integrated with the wiring board before embedding. This configuration allows the components such as a semiconductor to undergo a mounting inspection and a property inspection before embedding. As a result, the yields of the module can be improved. In addition, since the components are integrated with the wiring board and embedded, the strength thereof can be enhanced.
摘要翻译：组件内置模块包括绝缘层，与绝缘层的两个表面一体化的布线，连接布线的通孔以及嵌入在绝缘层内部的一个或多个选自电子部件和半导体的部件。在该模块中，布线板的表面上形成有布线中的至少一方，嵌入绝缘层内的部件安装在布线基板上并与嵌入板一体化。这种构造允许诸如半导体的部件在嵌入之前进行安装检查和性能检查。结果，可以提高模块的产量。此外，由于部件与布线板集成并嵌入，因此可以提高其强度。

74. 发明授权

US07157789B2 Semiconductor device and method for manufacturing the same 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US07157789B2
公开(公告)日：2007-01-02
申请号：US11136110
申请日：2005-05-24
申请人： Koichi Hirano , Yoshiyuki Yamamoto , Seiichi Nakatani , Toshiyuki Kojima , Shingo Komatsu
发明人： Koichi Hirano , Yoshiyuki Yamamoto , Seiichi Nakatani , Toshiyuki Kojima , Shingo Komatsu
IPC分类号： H01L23/552
CPC分类号： H01L25/0657 , H01L23/5389 , H01L24/24 , H01L24/45 , H01L24/48 , H01L24/50 , H01L24/82 , H01L24/86 , H01L2224/05568 , H01L2224/05573 , H01L2224/05624 , H01L2224/16225 , H01L2224/2402 , H01L2224/24051 , H01L2224/24145 , H01L2224/24226 , H01L2224/24227 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73204 , H01L2224/73265 , H01L2224/92 , H01L2224/92244 , H01L2225/0651 , H01L2225/06517 , H01L2225/06524 , H01L2225/06551 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/01058 , H01L2924/01064 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/12041 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/15311 , H01L2924/1532 , H01L2924/19043 , H01L2924/3011 , H01L2924/3025 , H01L2224/83 , H01L2224/82 , H01L2924/00 , H01L2224/05599
摘要： An example of a semiconductor device of the present invention includes a first semiconductor element including a first element body portion and a first element electrode that is provided on a first face of the first element body portion; a wiring board including an insulating substrate and a first wiring layer that is formed on one principal face of the insulating substrate, the wiring board being disposed such that the one principal face of the wiring board is opposed to a second face of the first element body portion; a first film that covers at least a portion of a face of the first semiconductor element that includes the surface of the first element electrode and at least a portion of a face on the first semiconductor element side of the wiring board; and a second wiring layer that is formed on a face on the wiring board side of the first film and that includes a first conductor having first and second ends. The first end of the first conductor is bonded to the first element electrode, and the second end of the first conductor is bonded to a portion of the first wiring layer.
摘要翻译：本发明的半导体器件的一个例子包括：第一半导体元件，包括第一元件主体部分和设置在第一元件主体部分的第一面上的第一元件电极; 布线板，包括绝缘基板和形成在所述绝缘基板的一个主面上的第一布线层，所述布线板布置成使得所述布线板的所述一个主面与所述第一元件体的第二面相对一部分; 第一膜，其覆盖包括第一元件电极的表面和布线板的第一半导体元件侧的面的至少一部分的第一半导体元件的表面的至少一部分; 以及第二布线层，其形成在第一膜的布线板侧的面上，并且包括具有第一端和第二端的第一导体。第一导体的第一端接合到第一元件电极，第一导体的第二端接合到第一布线层的一部分。

75. 发明授权

US6103401A Window for an optical use and a process for the production of the same 失效
标题翻译：用于光学用途的窗口和用于生产光学用途的工艺
公开(公告)号：US6103401A
公开(公告)日：2000-08-15
申请号：US793982
申请日：1997-06-16
申请人： Norio Okada , Shuji Asaka , Tsuneo Urisu , Yoshiyuki Yamamoto , Keiichiro Tanabe , Yoshiaki Kumazawa
发明人： Norio Okada , Shuji Asaka , Tsuneo Urisu , Yoshiyuki Yamamoto , Keiichiro Tanabe , Yoshiaki Kumazawa
IPC分类号： G02B5/00 , B01J3/00 , B32B9/00 , C30B29/04 , G02B1/00 , G02B1/02 , G02B7/00 , B32B3/10 , B05D3/02 , B32B15/04 , C23C16/26
CPC分类号： G02B1/02 , G02B7/007 , Y10T428/12361 , Y10T428/12625 , Y10T428/12993 , Y10T428/24355 , Y10T428/24777
摘要： An object of the invention is to provide a window for an optical use having excellent transmission property over a wide range of from infra-red to vacuum ultraviolet as well as excellent baking resistance and capable of being fitted to an ultra-high vacuum apparatus and a process for the production of the same.This object can be attained by a window for an optical use comprising a diamond as a window material, a flange for a vacuum apparatus, a frame for bonding the diamond to the flange and the specified adhesive material for bonding the frame and diamond, and a process for the production of the window for an optical use comprising a step of preparing a diamond plate, a step of fitting a frame to a flange and bonding the diamond plate to the frame through an adhesive material. The benefits can be enlarged by suitably selecting the shape, material, etc. of the frame.
摘要翻译：本发明的一个目的是提供一种在从红外线到真空紫外线的广泛范围内具有优异的透射性的光学用窗口以及优异的耐烤性，并且能够适用于超高真空装置和生产过程相同。该目的可以通过包括金刚石作为窗口材料的光学用窗口，用于真空装置的凸缘，用于将金刚石结合到凸缘的框架和用于粘结框架和金刚石的指定粘合剂材料，以及用于生产用于光学用途的窗户的方法，包括制备金刚石板的步骤，将框架装配到凸缘并通过粘合材料将金刚石板结合到框架的步骤。可以通过适当地选择框架的形状，材料等来增加效果。

76. 发明授权

US5152256A Air-liquid cooled engine 失效
标题翻译：空气冷却发动机
公开(公告)号：US5152256A
公开(公告)日：1992-10-06
申请号：US458983
申请日：1989-12-29
申请人： Yoshinori Yamauchi , Yoshiyuki Yamamoto , Tomoo Taira
发明人： Yoshinori Yamauchi , Yoshiyuki Yamamoto , Tomoo Taira
IPC分类号： B62M7/02 , B62J99/00 , F01P3/02 , F01P5/06 , F01P5/12 , F01P9/04 , F02B61/02 , F02B75/02 , F02B75/16
CPC分类号： F01P9/04 , F01P5/06 , F01P5/12 , F02B61/02 , F02B75/16 , B62K2202/00 , F02B2075/025
摘要： Several embodiments of air-liquid cooled internal combustion engines for powering vehicles such as motor scooters. In each embodiment, the engine is provided with a finned cylinder for air cooling and a cylinder head having a liquid cooling jacket for water cooling. A radiator is provided for exchanging heat from the cylinder head cooling jacket and the atmosphere and a single fan circulates cooling air across both the radiator and the cylinder. In all embodiments, the flow across the fan, radiator and cylinder is in a series flow fashion. In many of the embodiments, the components are axially aligned. The fan is driven by the crankshaft either directly, through a gear train or through a flexible transmitter and in one case this flexible transmitter also drives the camshaft. A water pump is driven off of the camshaft for the liquid cooling system.

77. 发明授权

US5138697A Graphic data conversion method 失效
标题翻译：图形数据转换方法
公开(公告)号：US5138697A
公开(公告)日：1992-08-11
申请号：US760820
申请日：1991-09-17
申请人： Yoshiyuki Yamamoto , Yoshimitsu Murahashi
发明人： Yoshiyuki Yamamoto , Yoshimitsu Murahashi
IPC分类号： G06F17/50 , G06T17/00
CPC分类号： G06F17/50 , G06T17/00 , G06F2217/74
摘要： A graphic data conversion method converts the original data of a first format of a drawing or a product into basic element records comprising basic graphic elements, dimension line elements and text elements, organizes an intermediate data file by properly inserting edit partition records and edit records, and then converts the data stored in the intermediate data file into the data of a second format of the drawing or the product. Translators can be easily organized and the degree of freedom and efficiency of data conversion are enhanced, since the data is stored perspicuously in the intermediate data file in elements and structures.

78. 发明授权

US4622263A Water absorbing webs 失效
标题翻译：吸水网
公开(公告)号：US4622263A
公开(公告)日：1986-11-11
申请号：US733949
申请日：1985-05-14
申请人： Katsutoshi Ando , Eiichi Nishiura , Yoshiyuki Yamamoto
发明人： Katsutoshi Ando , Eiichi Nishiura , Yoshiyuki Yamamoto
IPC分类号： A61L15/26 , D01F6/86 , D04H1/435 , D04H1/56 , D04H1/58
CPC分类号： D04H3/16 , A61L15/26 , D01F6/86 , D04H1/56 , D04H3/011 , D04H3/016 , Y10S428/913 , Y10T442/68 , Y10T442/697
摘要： This invention relates to a melt-blow water-absorbing fiber webs whose main component is block-copolyetheresters having polyester and polyether segments in the molecules, wherein the amount the polyether component is 5 to 80 wt % base on the block-copolyetheresters.The water-absorbing web of this invention shows high chlorine fastness and consequently shows excellent water absorption performances after repeated washing. They are available as good batting (urine absorber) for diapers, as well as bed pads, towel materials and sports underpants, and applicable to a wide range of disposal products which require high water absorption performances and durability.
摘要翻译：本发明涉及一种熔融吸水纤维网，其主要成分是在分子中具有聚酯和聚醚链段的嵌段共聚醚酯，其中聚醚组分的量为5-80重量％，基于嵌段共聚醚酯。本发明的吸水纤维网显示出高耐氯性，因此在反复洗涤后显示出优异的吸水性能。它们可用作尿布的良好的捶击（尿液吸收剂），以及床垫，毛巾材料和运动内裤，并且适用于需要高吸水性能和耐久性的各种处理产品。

79. 发明授权

US4587309A Process for producing polyetheresteramides 失效
标题翻译：生产聚醚酯酰胺的方法
公开(公告)号：US4587309A
公开(公告)日：1986-05-06
申请号：US724611
申请日：1985-04-18
申请人： Chiaki Tanaka , Makoto Kondou , Yoshiyuki Yamamoto
发明人： Chiaki Tanaka , Makoto Kondou , Yoshiyuki Yamamoto
IPC分类号： C08G69/00 , C08G69/44 , C08F283/00 , C08G63/76 , C08G69/48 , C08L67/00
CPC分类号： C08G69/44
摘要： The high polymerization degree polyetheresteramides without any gelated materials and with superior color tones are obtained in a short time through the polycondensing interaction carried out between (A) one or more than two polyamide forming components selected from lactams and aminocarboxylic acids as well as the salts of substantially-equal quantities of diamines and dicarboxylic acid and (B) the polyetherester forming components consisting of the substantially-equal quantities of dicarboxylic acids and poly(alkylene oxide) glycols in the presence of 0.001 to 0.5 percent by weight of the mixtures composed of antimony oxides/organic tin compounds at the ratios of 80/20 to 30/70 by weight and more preferably in the co-presence of 0.0005 to 0.5 percent by weight of phosphoric compounds.
摘要翻译：通过在（A）一种或多于两种选自内酰胺和氨基羧酸的聚酰胺形成组分中进行的缩聚相互作用，在短时间内获得没有任何胶凝材料和优异色调的高聚合度聚醚酯酰胺以及基本上相等量的二胺和二羧酸和（B）在由锑组成的混合物的0.001至0.5重量％的存在下由基本上相等量的二羧酸和聚（环氧烷）二醇组成的聚醚酯形成组分氧化物/有机锡化合物，其比例为80/20〜30/70，更优选为0.0005〜0.5重量％的磷酸化合物共存。

80. 发明授权

US08697564B2 Method of manufacturing GaN-based film 有权
标题翻译：制造GaN基膜的方法
公开(公告)号：US08697564B2
公开(公告)日：2014-04-15
申请号：US13283963
申请日：2011-10-28
申请人： Shinsuke Fujiwara , Koji Uematsu , Yoshiyuki Yamamoto , Issei Satoh
发明人： Shinsuke Fujiwara , Koji Uematsu , Yoshiyuki Yamamoto , Issei Satoh
IPC分类号： H01L21/28 , H01L21/3205
CPC分类号： C30B29/406 , C30B25/02 , H01L33/007 , H01L33/0079
摘要： A method of manufacturing a GaN-based film includes the steps of preparing a composite substrate, the composite substrate including a support substrate in which a coefficient of thermal expansion in its main surface is more than 0.8 time and less than 1.0 time as high as a coefficient of thermal expansion of GaN crystal in a direction of a axis and a single crystal film arranged on a main surface side of the support substrate, the single crystal film having threefold symmetry with respect to an axis perpendicular to a main surface of the single crystal film, and forming a GaN-based film on the main surface of the single crystal film in the composite substrate, the single crystal film in the composite substrate being an SiC film. Thus, a method of manufacturing a GaN-based film capable of manufacturing a GaN-based film having a large main surface area and less warpage without crack being produced in a substrate is provided.
摘要翻译：制造GaN基膜的方法包括以下步骤：制备复合基板，该复合基板包括其主表面的热膨胀系数大于0.8倍且小于1.0倍的支撑基板 GaN晶体沿着轴方向的热膨胀系数和布置在支撑基板的主表面侧的单晶膜，单晶膜相对于垂直于单晶主表面的轴线具有三重对称性并且在复合衬底中的单晶膜的主表面上形成GaN基膜，复合衬底中的单晶膜是SiC膜。因此，提供了一种制造能够制造基板上具有大的主表面积和较少翘曲的GaN基膜的GaN基膜的方法。

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