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    • 79. 发明申请
    • PRESSURE SENSOR MODULE AND ELECTRONIC COMPONENT
    • 压力传感器模块和电子元件
    • US20120036936A1
    • 2012-02-16
    • US13281959
    • 2011-10-26
    • Satoshi YamamotoHirokazu Hashimoto
    • Satoshi YamamotoHirokazu Hashimoto
    • G01L7/08
    • G01L9/0054G01L19/0069G01L19/148H01L2224/05001H01L2224/16225H01L2924/07811H01L2924/00
    • A pressure sensor module includes a pressure sensor, a bump, and a laminated substrate. The pressure sensor includes a semiconductor substrate; a cavity; a pressure-sensitive element; and a conductive section. The cavity is disposed inside the semiconductor substrate such that a thin-plate region of the semiconductor substrate is provided and the thin-plate region being defined as a diaphragm. The pressure-sensitive element is arranged at the diaphragm. The conductive section is electrically connected to the pressure-sensitive element and disposed on the face of the semiconductor substrate at a region excluding the diaphragm. The bump is electrically connected to the conductive section. The laminated substrate includes a wiring base material electrically connected to the pressure sensor via the bump. The wiring base material is disposed inside the laminated substrate. A face of the wiring base material is electrically connected to the bump and has an exposed area from the laminated substrate.
    • 压力传感器模块包括压力传感器,凸块和层压基板。 压力传感器包括半导体衬底; 一个空腔 压敏元件; 和导电部分。 空腔设置在半导体衬底的内部,使得设置半导体衬底的薄板区域,并且将薄板区域定义为膜片。 压敏元件设置在隔膜上。 导电部分电连接到压敏元件并且设置在除了隔膜之外的区域的半导体衬底的表面上。 凸块电连接到导电部分。 层压基板包括经由凸块与压力传感器电连接的布线基材。 配线基材配置在层叠基板的内部。 布线基材的表面电连接到凸块并具有来自层叠基板的露出区域。