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71. 发明授权

US08236586B2 Method of fabricating light emitting device 有权
标题翻译：制造发光器件的方法
公开(公告)号：US08236586B2
公开(公告)日：2012-08-07
申请号：US13239488
申请日：2011-09-22
申请人： Yu-Sik Kim
发明人： Yu-Sik Kim
IPC分类号： H01L21/00
CPC分类号： B29D11/00807 , B29D11/00278 , F21K9/00 , F21Y2105/10 , F21Y2115/10 , H01L25/0753 , H01L33/54 , H01L2224/45139 , H01L2224/48091 , H01L2224/49107 , H01L2224/73265 , H01L2924/00 , H01L2924/00014
摘要： A method of fabricating a light emitting device includes forming a plurality of light emitting elements on light emitting element mounting regions, respectively, of a substrate, forming lens supports on the light emitting element mounting regions, respectively, are raised relative to isolation regions of the substrate located between neighboring ones of the light emitting element mounting regions, and forming lenses covering the light emitting elements on the lens support patterns, respectively.
摘要翻译：一种制造发光器件的方法包括在基板的发光元件安装区域上分别形成多个发光元件，分别在发光元件安装区域上形成透镜支架相对于所述发光元件安装区域的隔离区域升高位于相邻的发光元件安装区域之间的基板，以及分别在透镜支撑图案上覆盖发光元件的透镜。

72. 发明申请

US20120193672A1 METHOD OF FABRICATING LIGHT-EMITTING APPARATUS WITH IMPROVED LIGHT EXTRACTION EFFICIENCY AND LIGHT-EMITTING APPARATUS FABRICATED USING THE METHOD 有权
标题翻译：利用改进的光提取效率和发光装置制造发光装置的方法
公开(公告)号：US20120193672A1
公开(公告)日：2012-08-02
申请号：US13445455
申请日：2012-04-12
申请人： Yu-Sik Kim , Seong-Deok Hwang , Seung-Jae Lee , Sun-Pil Youn
发明人： Yu-Sik Kim , Seong-Deok Hwang , Seung-Jae Lee , Sun-Pil Youn
IPC分类号： H01L33/36
CPC分类号： H01L33/58 , H01L24/32 , H01L33/0079 , H01L33/0095 , H01L33/20 , H01L33/22 , H01L33/50 , H01L2224/06102 , H01L2224/13 , H01L2224/45139 , H01L2224/48091 , H01L2224/49107 , H01L2224/73265 , H01L2224/83385 , H01L2924/00014 , H01L2924/12041 , H01L2924/12042 , H01L2924/351 , H01L2924/00 , H01L2924/00011 , H01L2224/45099
摘要： Provided are a method of fabricating a light-emitting apparatus with improved light extraction efficiency and a light-emitting apparatus fabricated using the method. The method includes: preparing a monocrystalline substrate; forming an intermediate structure on the substrate, the intermediate structure comprising a light-emitting structure which comprises a first conductive pattern of a first conductivity type, a light-emitting pattern, and a second conductive pattern of a second conductivity type stacked sequentially, a first electrode which is electrically connected to the first conductive pattern, and a second electrode which is electrically connected to the second conductive pattern; forming a polycrystalline region, which extends in a horizontal direction, by irradiating a laser beam to the substrate in the horizontal direction such that the laser beam is focused on a beam-focusing point within the substrate; and cutting the substrate in the horizontal direction along the polycrystalline region.
摘要翻译：提供了一种制造具有改进的光提取效率的发光装置的方法和使用该方法制造的发光装置。该方法包括：制备单晶基板; 在所述基板上形成中间结构，所述中间结构包括发光结构，所述发光结构包括依次堆叠的第一导电类型的第一导电图案，发光图案和第二导电类型的第二导电图案，第一导电图案电连接到第一导电图案的电极和与第二导电图案电连接的第二电极; 通过在水平方向上将激光束照射到基板上，使得激光束聚焦在基板内的光束聚焦点上，形成沿水平方向延伸的多晶区域; 以及沿着多晶区沿水平方向切割基板。

73. 发明申请

US20120040479A1 LIGHT EMITTING ELEMENT, A LIGHT EMITTING DEVICE, A METHOD OF MANUFACTURING A LIGHT EMITTING ELEMENT AND A METHOD OF MANUFACTURING A LIGHT EMITTING DEVICE 有权
标题翻译：发光元件，发光装置，制造发光元件的方法和制造发光装置的方法
公开(公告)号：US20120040479A1
公开(公告)日：2012-02-16
申请号：US13279790
申请日：2011-10-24
申请人： Yu-Sik KIM , Sang-Joon Park
发明人： Yu-Sik KIM , Sang-Joon Park
IPC分类号： H01L33/48 , H01L33/32
CPC分类号： H01L33/0079 , H01L33/0095 , H01L33/483 , H01L2224/48091 , H01L2924/01021 , H01L2924/01066 , H01L2924/01067 , H01L2924/10253 , H01L2924/12044 , H01L2924/00014 , H01L2924/00
摘要： The present invention provides a light-emitting element, a method of manufacturing the light-emitting element, a light-emitting device, and a method of manufacturing the light-emitting device. A method of manufacturing a light-emitting element includes: forming a first conductive layer of a first conductive type, a light-emitting layer, and a second conductive layer of a second conductive type on at least one first substrate, forming an ohmic layer on the second conductive layer and bonding the at least one first substrate to a second substrate. The second substrate being larger than the first substrate. The method further includes etching portions of the ohmic layer, the second conductive layer, and the light-emitting layer to expose a portion of the first conductive layer.
摘要翻译：本发明提供一种发光元件，发光元件的制造方法，发光元件及其制造方法。一种制造发光元件的方法包括：在至少一个第一基板上形成第一导电类型的第一导电层，第二导电类型的第二导电层和形成欧姆层的第二导电层所述第二导电层并将所述至少一个第一衬底结合到第二衬底。第二基板大于第一基板。该方法还包括蚀刻欧姆层，第二导电层和发光层的部分以暴露第一导电层的一部分。

74. 发明申请

US20120034715A1 Methods of fabricating a light-emitting device 有权
标题翻译：制造发光装置的方法
公开(公告)号：US20120034715A1
公开(公告)日：2012-02-09
申请号：US13317254
申请日：2011-10-13
申请人： Yu-Sik Kim
发明人： Yu-Sik Kim
IPC分类号： H01L21/66
CPC分类号： H01L33/50 , H01L24/94 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05666 , H01L2224/05669 , H01L2224/05671 , H01L2224/05672 , H01L2224/0568 , H01L2224/05684 , H01L2224/14 , H01L2924/00014 , H01L2924/12035 , H01L2933/0041 , H01L2924/00 , H01L2924/013 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： Methods of fabricating of a light-emitting device are provided, the methods include forming a plurality of light-emitting units on a substrate, measuring light characteristics of the plurality of light-emitting units, respectively, depositing a phosphor layer on the plurality of light-emitting units using a printing method, and cutting the substrate to separate the plurality of light-emitting units into unit by unit. The phosphor layer is adjustably deposited according to the measured light characteristics of the plurality of light-emitting units.
摘要翻译：提供了一种制造发光器件的方法，所述方法包括在衬底上形成多个发光单元，分别测量多个发光单元的光特性，在多个光上沉积磷光体层 - 使用打印方法的设备单元，以及切割所述基板以将所述多个发光单元分离成单元。根据多个发光单元的测量光特性可调节地沉积磷光体层。

75. 发明申请

US20120009701A1 METHOD OF FABRICATING LIGHT EMITTING DEVICE 有权
标题翻译：制造发光装置的方法
公开(公告)号：US20120009701A1
公开(公告)日：2012-01-12
申请号：US13239488
申请日：2011-09-22
申请人： Yu-Sik Kim
发明人： Yu-Sik Kim
IPC分类号： H01L33/58
CPC分类号： B29D11/00807 , B29D11/00278 , F21K9/00 , F21Y2105/10 , F21Y2115/10 , H01L25/0753 , H01L33/54 , H01L2224/45139 , H01L2224/48091 , H01L2224/49107 , H01L2224/73265 , H01L2924/00 , H01L2924/00014
摘要： A method of fabricating a light emitting device includes forming a plurality of light emitting elements on light emitting element mounting regions, respectively, of a substrate, forming lens supports on the light emitting element mounting regions, respectively, are raised relative to isolation regions of the substrate located between neighboring ones of the light emitting element mounting regions, and forming lenses covering the light emitting elements on the lens support patterns, respectively.
摘要翻译：一种制造发光器件的方法包括在基板的发光元件安装区域上分别形成多个发光元件，分别在发光元件安装区域上形成透镜支架，相对于所述发光元件安装区域的隔离区域升高位于相邻的发光元件安装区域之间的基板，以及分别在透镜支撑图案上覆盖发光元件的透镜。

76. 发明授权

US07943951B2 Light emitting device package 有权
标题翻译：发光装置封装
公开(公告)号：US07943951B2
公开(公告)日：2011-05-17
申请号：US11452410
申请日：2006-06-14
申请人： Hyung-kun Kim , Yu-sik Kim
发明人： Hyung-kun Kim , Yu-sik Kim
IPC分类号： H01L33/00
CPC分类号： H01L33/58 , H01L33/60 , H01L2924/0002 , H01L2924/00
摘要： A light emitting device package is provided. The light emitting device package comprises a base substrate on which a wiring pattern is formed; a light emitting device mounted on the base substrate to emit light when supplied with driving power through the wiring pattern; a molded lens stably seated on the base substrate and having an inner space for sealing the light emitting device and reflective surfaces formed along outer sides facing the inner space to guide light from the light emitting device in an effective display direction; and a sealing resin between the inner space to bond the base substrate to the molded lens, whereby the packaging structure is simplified so that an assembly process and reliability testing are simplified, process losses due to defects are minimized, and the light extraction efficiency from the light emitting device and heat-dissipation performance are improved.
摘要翻译：提供发光器件封装。发光器件封装包括其上形成有布线图案的基底基板; 当通过所述布线图案供给驱动电力时，安装在所述基底基板上的发光装置发光; 模制透镜稳定地安置在基底基板上，并且具有用于密封发光器件的内部空间和沿着面向内部空间的外侧形成的反射表面，以在有效的显示方向上引导来自发光器件的光; 以及在内部空间之间的密封树脂，以将基底基板粘合到模制透镜上，从而简化了包装结构，从而简化了组装过程和可靠性测试，使由缺陷引起的工艺损失最小化，并且来自发光器件和散热性能得到改善。

77. 发明授权

US07902563B2 Light emitting diode module with heat spreading plate between capping layer and phosphor layer 有权
标题翻译：发光二极管模块，在封盖层和磷光体层之间具有散热板
公开(公告)号：US07902563B2
公开(公告)日：2011-03-08
申请号：US11515248
申请日：2006-09-05
申请人： Yu-sik Kim , Hyung-kun Kim
发明人： Yu-sik Kim , Hyung-kun Kim
IPC分类号： H01L33/64
CPC分类号： H01L33/507 , H01L33/486 , H01L33/644 , H01L2224/48235
摘要： A long life light-emitting diode (LED) module is provided. The LED module includes: a light-emitting chip; a phosphor layer formed of phosphor materials that transform light emitted from the light-emitting chip into light having a longer wavelength than the light emitted from the light-emitting chip; a capping layer that is formed on the light-emitting chip and protects the light-emitting chip; and a heat spreading plate that is disposed between the capping layer and the phosphor layer that dissipates heat generated in the light-emitting chip and the phosphor layer.
摘要翻译：提供长寿命的发光二极管（LED）模块。 LED模块包括：发光芯片; 将从发光芯片发射的光变换为比从发光芯片发射的光更长的波长的荧光材料形成的荧光体层; 覆盖层，形成在所述发光芯片上并保护所述发光芯片; 以及散热板，其设置在所述覆盖层和所述荧光体层之间，其散发在所述发光芯片和所述荧光体层中产生的热量。

78. 发明申请

US20100244083A1 Light-Emitting Devices 有权
标题翻译：发光装置
公开(公告)号：US20100244083A1
公开(公告)日：2010-09-30
申请号：US12662081
申请日：2010-03-30
申请人： Yu-Sik Kim
发明人： Yu-Sik Kim
IPC分类号： H01L33/62
CPC分类号： H01L33/501 , H01L24/73 , H01L33/06 , H01L33/14 , H01L33/382 , H01L2224/45139 , H01L2224/48091 , H01L2224/73265 , H01L2924/10155 , H01L2924/12042 , H01L2924/12044 , H01L2924/00014 , H01L2924/00
摘要： Light-emitting devices are provided, the light-emitting devices include a light-emitting structure layer having a first conductive layer, a light-emitting layer and a second conductive layer sequentially stacked on a first of a substrate, a plurality of seed layer patterns formed apart each other in the first conductive layer; and a plurality of first electrodes formed through the substrate, wherein each of the first electrodes extends from a second side of the substrate to each of the seed layer patterns.
摘要翻译：发光装置，发光装置包括：发光结构层，具有依次堆叠在基板上的第一基板上的第一导电层，发光层和第二导电层，多个晶种层图案在第一导电层中彼此分开形成; 以及通过所述基板形成的多个第一电极，其中所述第一电极中的每一个从所述基板的第二侧延伸到所述种子层图案中的每一个。

79. 发明申请

US20100244072A1 Light-emitting devices and methods of fabricating the same 有权
标题翻译：发光装置及其制造方法
公开(公告)号：US20100244072A1
公开(公告)日：2010-09-30
申请号：US12662116
申请日：2010-03-31
申请人： Yu-Sik KIM
发明人： Yu-Sik KIM
IPC分类号： H01L33/00 , H01L21/00
CPC分类号： H01L33/642 , H01L33/486 , H01L33/62 , H01L2224/16225
摘要： A light-emitting device includes: a substrate; a light-emitting element is mounted on a first surface of the substrate; at least one uneven heat dissipation pattern is formed on at least one surface of the substrate; and an electrode covers at least a portion of the at least one uneven heat dissipation pattern and is connected to the light-emitting element.
摘要翻译：发光装置包括：基板; 发光元件安装在基板的第一表面上; 在所述基板的至少一个表面上形成至少一个不均匀的散热图案; 并且电极覆盖所述至少一个不均匀散热图案的至少一部分并且连接到所述发光元件。

80. 发明申请

US20100213498A1 LIGHT EMITTING PACKAGE CONTROLLING COLOR TEMPERATURE, FABRICATING METHOD THEREOF, COLOR TEMPERATURE CONTROLLING METHOD OF LIGHT EMITTING PACKAGE 有权
标题翻译：发光包装控制彩色温度，其制造方法，发光包装的颜色温度控制方法
公开(公告)号：US20100213498A1
公开(公告)日：2010-08-26
申请号：US12710708
申请日：2010-02-23
申请人： Yu-Sik Kim
发明人： Yu-Sik Kim
IPC分类号： H01L33/00
CPC分类号： H01L33/486 , H01L25/167 , H01L2224/16 , H01L2924/00011 , H01L2924/00014 , H01L2224/0401
摘要： Provided are a light emitting package capable of controlling a color temperature, a fabricating method thereof, and a color temperature controlling method of the light emitting package. The light emitting package includes a package body, a first electrode and a second electrode formed on the package body and spaced apart from each other, a light emitting element formed on the package body and electrically connected to the first electrode and the second electrode, and a thin film resistor connected in series to the first electrode.
摘要翻译：提供了能够控制色温的发光封装，其制造方法和发光封装的色温控制方法。发光封装包括封装主体，第一电极和形成在封装主体上并彼此间隔开的第二电极，形成在封装主体上并电连接到第一电极和第二电极的发光元件，以及与第一电极串联连接的薄膜电阻器。

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