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    • 75. 发明申请
    • METHOD AND APPARATUS FOR PRINTING VISCOUS MATERIAL
    • 印刷材料的方法和装置
    • WO2006019802A1
    • 2006-02-23
    • PCT/US2005/024828
    • 2005-07-13
    • SPEEDLINE TECHNOLOGIES, INC.WILLSHERE, Richard
    • WILLSHERE, Richard
    • B23K3/06
    • B41F15/42B23K3/0638B41P2215/132H05K3/0097H05K3/1233H05K2203/0126H05K2203/0139
    • A method for printing a viscous material on substrates within a stencil printer includes supplying viscous material to a dispensing region of a print head, positioning a first substrate into a print position, printing on the first substrate by means of a pair of blades (52, 54) in contact with a stencil (16) during a first print stroke in which the pair of blades travel in a first direction (80), the dispensing region being defined between the pair of blades, positioning a second substrate into a print position, and printing on the second substrate during a second print stroke in which the pair of blades travel in a second direction (82), opposite to the first direction, the pair of blades maintaining contact with the stencil when transitioning between the first and second print strokes. A print head and a stencil printer are further disclosed.
    • 一种用于在模板印刷机中的基板上印刷粘性材料的方法包括:将粘性材料供应到打印头的分配区域,将第一基板定位到打印位置,借助于一对叶片(52,52)在第一基板上进行印刷, 54)在第一打印行程期间与模板(16)接触,其中所述一对刀片沿着第一方向(80)行进,所述分配区域被限定在所述一对刀片之间,将第二衬底定位到打印位置, 并且在第二打印行程期间在第二打印行程中打印第二打印行程,其中所述一对刀片沿与第一方向相反的第二方向(82)行进,所述一对刀片在第一和第二打印笔划之间转换时保持与模板的接触 。 进一步公开了打印头和模版印刷机。
    • 79. 发明申请
    • METHOD AND APPARATUS FOR RELEASING MATERIALS FROM STENCILS
    • 用于从茎上释放材料的方法和装置
    • WO2004022351A3
    • 2004-07-29
    • PCT/US0327149
    • 2003-08-27
    • SPEEDLINE TECHNOLOGIES INCVAN-DIEP GERALD PHAMANDRES FRANK
    • VAN-DIEP GERALD PHAMANDRES FRANK
    • B41L13/02H05K3/12B41L13/18
    • H05K3/1233B41L13/02H05K2203/0285H05K2203/0292
    • An apparatus and method for depositing material on a surface of an electronic substrate includes a frame, a substrate support coupled to the frame to support the electronic substrate, a stencil coupled to the frame having at least one aperture to receive a material to be deposited through the aperture onto the surface of the electronic substrate, a controller that controls dispensing of material on the substrates, and a vibration system, coupled to one of the stencil, the frame and the substrate support, and coupled to the controller, that introduces a vibration to the stencil, wherein the vibration has a frequency controlled by the controller based on characteristics of at least one of the material, the stencil and the electronic substrate. Release of material from the apertures is accomplished while the vibration is applied to the stencil.
    • 用于在电子基板的表面上沉积材料的装置和方法包括框架,耦合到框架以支撑电子基板的基板支撑件,耦合到框架的模板具有至少一个孔以接收要沉积的材料 电子基板的表面上的孔径,控制基板上的材料分配的控制器和耦合到模板,框架和基板支撑件之一并耦合到控制器的振动系统,其引入振动 其中所述振动具有基于所述材料,所述模板和所述电子基板中的至少一个的特性由所述控制器控制的频率。 当将振动施加到模板时,实现从孔中释放材料。