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    • 74. 发明授权
    • Nitride semiconductor laser device
    • 氮化物半导体激光器件
    • US07496124B2
    • 2009-02-24
    • US11287339
    • 2005-11-28
    • Tokuya KozakiMasahiko SanoShuji NakamuraShinichi Nagahama
    • Tokuya KozakiMasahiko SanoShuji NakamuraShinichi Nagahama
    • H01S3/04H01S3/14
    • B82Y20/00H01S5/0655H01S5/2004H01S5/2031H01S5/22H01S5/2214H01S5/2216H01S5/223H01S5/2231H01S5/3213H01S5/32341H01S5/34333H01S2304/00
    • A nitride semiconductor laser device has an improved stability of the lateral mode under high output power and a longer lifetime, so that the device can be applied to write and read light sources for recording media with high capacity. The nitride semiconductor laser device includes an active layer, a p-side cladding layer, and a p-side contact layer laminated in turn. The device further includes a waveguide region of a stripe structure formed by etching from the p-side contact layer. The stripe width provided by etching is within the stripe range of 1 to 3 μm and the etching depth is below the thickness of the p-side cladding layer of 0.1 μm and above the active layer. Particularly, when a p-side optical waveguide layer includes a projection part of the stripe structure and a p-type nitride semiconductor layer on the projection part and the projection part of the p-side optical waveguide layer has a thickness of not more than 1 μm, an aspect ratio is improved in far field image. Moreover, the thickness of the p-side optical waveguide layer is greater than that of an n-side optical waveguide layer.
    • 氮化物半导体激光装置在高输出功率下具有改进的横向模式的稳定性和更长的寿命,使得该装置可以用于写入和读取具有高容量的记录介质的光源。 氮化物半导体激光器件依次层叠有有源层,p侧覆层,p侧接触层。 该器件还包括通过从p侧接触层蚀刻而形成的条纹结构的波导区域。 通过蚀刻提供的条纹宽度在1-3μm的条纹范围内,并且蚀刻深度低于0.1μm的p侧包覆层的厚度和活性层上方。 特别是,当p侧光波导层包括条形结构的突出部分和突起部分上的p型氮化物半导体层和p侧光波导层的突出部分的厚度不大于1 妈妈,远景图像的纵横比得到改善。 此外,p侧光波导层的厚度大于n侧光波导层的厚度。