会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 71. 发明授权
    • Double sidewall short channel split gate flash memory
    • 双侧壁短通道分闸门闪存
    • US06180461B2
    • 2001-01-30
    • US09128585
    • 1998-08-03
    • Seiki Ogura
    • Seiki Ogura
    • H01L218247
    • H01L27/11521H01L27/115
    • An electrically programmable read only memory device which has efficiency of electron injection from channel to floating gate is provided. This memory cell includes a control gate and floating gate between source and drain regions. The region under the floating gate has extremely small enhanced mode channel and N region. Therefore, this channel is completely depleted by the program drain voltage. The enhanced mode channel region is precisely defined by the side wall spacer technique. Also, the N drain region is accurately defined by the difference of side wall polysilicon gate and the first spacer.
    • 提供了具有从通道到浮动栅极的电子注入效率的电可编程只读存储器件。 该存储单元包括在源极和漏极区之间的控制栅极和浮置栅极。 浮动栅极下的区域具有非常小的增强模式通道和N区域。 因此,该通道完全耗尽程序漏极电压。 增强模式通道区域由侧壁间隔技术精确地限定。 此外,N漏极区域由侧壁多晶硅栅极和第一间隔物的差异精确地限定。
    • 72. 发明授权
    • Low voltage EEPROM/NVRAM transistors and making method
    • US6157058A
    • 2000-12-05
    • US111720
    • 1998-07-08
    • Seiki Ogura
    • Seiki Ogura
    • H01L21/28H01L21/336H01L21/8247H01L27/115H01L29/423H01L29/788
    • H01L29/66825H01L21/28273H01L27/115H01L27/11521H01L27/11553H01L27/11556H01L29/42324H01L29/7885
    • A new FET device configuration for electrically programmable memories (EPROM), flash/electrically erasable and programmable read-only memories (EEPROM), and non-volatile Random Access Memory (NVRAM) which adds vertical components to a previously planar floating gate cell structure; efficiency of electron injection from the channel to floating gate is enhanced by many orders of magnitude because electrons accelerated in the channel penetraite in the direction of movement, straight into the floating gate. The floating gate resides over a series of arbitrary horizontal and vertical channel region components, the key topological feature being that the vertical channel resides near the drain, allowing electrons to penetrate straight into the floating gate. In contrast, the prior art relies on the indirect process of electron scattering by phonon and the 90 degree upward redirection of motion to the floating gate used by conventional Channel Hot Electron EPROM and EEPROM cells. With the feature of the vertical injection step, high injection efficiency can be achieved at much lower operating voltages, and program time is decreased, which has been a limiting factor in EEPROM applications. Operation at lower voltages improves reliability and overall process complexity. The feature of high injection efficiency at low drain voltage also makes multi-level storage easier and more controllable since the storage of electrons can be controlled by a single control gate voltage. This high efficiency, low voltage, step channel enables a single polysilicon EPROM transistor. Also, a double polysilicon EEPROM transistor with the vertical injection step near drain can achieve erase capability of polysilicon to polysilicon, something that could only be practically built with a triple polysilicon EEPROM cell, in prior art. This combination of a low voltage program and poly to poly erase in a double polysilicon split gate cell with the vertical injection step achieves the non-volatile RAM feature of write 0 (program) or 1 (erase) for a selected word line (control gate) at once. Fabrication methods for the vertical injection step channel near drain are also be described.
    • 73. 发明授权
    • Nonvolatile semiconductor memory device and method for fabricating the
same and semiconductor integrated circuit
    • 非易失性半导体存储器件及其制造方法和半导体集成电路
    • US6121655A
    • 2000-09-19
    • US848
    • 1997-12-30
    • Shinji OdanakaKaori AkamatsuJunichi KatoAtsushi HoriSeiki Ogura
    • Shinji OdanakaKaori AkamatsuJunichi KatoAtsushi HoriSeiki Ogura
    • G11C16/04H01L21/336H01L21/8247H01L27/115H01L29/423H01L29/788H01L29/792H01L29/76
    • H01L29/66825H01L29/42324H01L29/7885
    • The nonvolatile semiconductor memory device of the present invention includes: a semiconductor substrate having a surface including a first surface region at a first level, a second surface region at a second level lower than the first level, and a step side region linking the first surface region and the second surface region together; a channel region formed in the first surface region of the semiconductor substrate; a source region and a drain region which are formed in the surface of the semiconductor substrate so as to interpose the channel region therebetween; a first insulating film formed on the surface of the semiconductor substrate; a floating gate formed on the first insulating film; a second insulating film formed on the floating gate; and a control gate which is capacitively coupled to the floating gate via the second insulating film. The drain region includes a low-concentration impurity layer which is formed in the second surface region and which has one end extending toward the step side region, and a high-concentration impurity layer which is connected to the low-concentration impurity layer and which is formed in a region distant from the channel region. As impurity concentration of the low-concentration impurity layer is lower than an impurity concentration of the high-concentration impurity layer. The floating gate covers the step side region and at least a part of the low-concentration impurity layer via the first insulating film.
    • 本发明的非易失性半导体存储器件包括:半导体衬底,具有包括第一层的第一表面区域,低于第一层次的第二层的第二表面区域和将第一表面 区域和第二表面区域在一起; 形成在所述半导体衬底的所述第一表面区域中的沟道区; 源极区域和漏极区域,其形成在半导体衬底的表面中,以便在其间插入沟道区域; 形成在所述半导体衬底的表面上的第一绝缘膜; 形成在第一绝缘膜上的浮栅; 形成在浮动栅极上的第二绝缘膜; 以及通过第二绝缘膜电容耦合到浮动栅极的控制栅极。 漏区包括形成在第二表面区域中并且具有朝向台阶侧区域延伸的一端的低浓度杂质层和连接到低浓度杂质层的高浓度杂质层, 形成在远离通道区域的区域中。 由于低浓度杂质层的杂质浓度低于高浓度杂质层的杂质浓度。 浮置栅极经由第一绝缘膜覆盖台阶侧区域和至少一部分低浓度杂质层。
    • 74. 发明授权
    • Read reference scheme for flash memory
    • 读取闪存的参考方案
    • US6038169A
    • 2000-03-14
    • US270596
    • 1999-03-18
    • Seiki OguraTomoko Ogura
    • Seiki OguraTomoko Ogura
    • G11C11/56G11C16/28G11C16/04
    • G11C11/5642G11C11/5621G11C16/28G11C2211/5634
    • In this invention a reference circuit is disclosed that produces a reference current to be used in determining the value of data in a flash memory cell. The memory cell current is compared to the reference current in a sense amplifier. A reference circuit that generates the reference current is connect to each bit line of the flash memory and uses bit lines that are not activated when a particular cell is being read to connect the reference current to the sense amplifiers. The use of a reference current allows multi-bit cells to be read by using a variation on the reference circuit that has a plurality of reference transistors creating a plurality of reference currents.. Verification of the programmed and erase states of a flash memory cell can be determined using different values of the reference current that are easily set in the reference circuit by changing a reference voltage.
    • 在本发明中,公开了一种参考电路,其产生用于确定闪存单元中的数据值的参考电流。 将存储单元电流与读出放大器中的参考电流进行比较。 产生参考电流的参考电路连接到闪存的每个位线,并且使用当读取特定单元以将参考电流连接到读出放大器时未被激活的位线。 使用参考电流允许通过使用具有多个参考晶体管的参考电路上的变化来读取多位单元,该参考电路产生多个参考电流。闪存单元的编程和擦除状态的验证可以 可以通过改变参考电压来容易地在参考电路中设置的参考电流的不同值来确定。
    • 76. 发明授权
    • Process for making and programming a flash memory array
    • 制作和编程闪存阵列的过程
    • US5541130A
    • 1996-07-30
    • US477791
    • 1995-06-07
    • Seiki OguraNivo RovedoRobert C. Wong
    • Seiki OguraNivo RovedoRobert C. Wong
    • H01L21/8247H01L27/115H01L29/788H01L29/792
    • H01L27/11521H01L27/115Y10S438/972
    • A process for fabricating a high density memory array. N-type impurities are implanted in a p-type substrate to form continuous rails of diffusion that have a substantially flat contour. Each rail of diffusion defines a corresponding bit line. Each rail defines the source and drain region of each pair of adjacent memory array cells associated with the bit line. In one embodiment, multiple layers of polysilicon are utilized to form a control gate, a floating gate, a source and a drain. In another embodiment, multiple layers of polysilicon are utilized to form an auxiliary gate, a floating gate, a source and a drain. In both embodiments, the polysilicon layers self-aligned to substantially reduce polysilicon layer-overlap so as to minimize parasitic capacitances. Domino and Skippy Domino schemes are used to program and read the memory array cells. Programming may be implemented with channel hot-electron tunneling using relatively low programming voltages thereby realizing faster programming time and closer bit-line spacing.
    • 一种用于制造高密度存储器阵列的方法。 将N型杂质注入p型衬底中以形成具有基本平坦轮廓的连续扩散轨道。 每个扩散轨定义相应的位线。 每个轨道限定与位线相关联的每对相邻存储器阵列单元的源极和漏极区域。 在一个实施例中,利用多层多晶硅来形成控制栅极,浮置栅极,源极和漏极。 在另一实施例中,利用多层多晶硅来形成辅助栅极,浮栅,源极和漏极。 在两个实施例中,多晶硅层自对准以显着减少多晶硅层重叠,从而使寄生电容最小化。 Domino和Skippy Domino方案用于对内存阵列单元进行编程和读取。 通过使用相对较低的编程电压的通道热电子隧穿可以实现编程,从而实现更快的编程时间和更靠近的位线间隔。